THGAMSG9T24BAIL

The THGAMSG9T24BAIL is a managed e-MMC flash memory device that integrates KIOXIA controller functions with BiCS FLASH™ 3D NAND in a single 153-ball WBGA package. It provides 512 Gbit (64 GB) of non-volatile storage with an e-MMC v5.1 interface for embedded applications.

Designed for compact embedded systems, the device targets applications such as IoT endpoints, mobile devices and consumer media products where on-board flash management, a small footprint and a standard e-MMC interface are required. Key value comes from integrated controller features, JEDEC-compliant interface support and a wide operating voltage and temperature range.

Key Features

• Core & Controller  KIOXIA integrated e-MMC controller provides managed-flash functions including error correction, wear leveling, logical-to-physical address translation and bad-block management.
• Memory  512 Gbit (64 GB) BiCS FLASH™ 3D NAND organized as 64G × 8.
• Interface & Performance  JEDEC e-MMC v5.1 compliant interface; e-MMC v5.1 supports up to 400 MB/s. Device clock frequency specified at 200 MHz.
• Power  Supply voltage range 2.7 V to 3.6 V to support common embedded power domains.
• Package & Temperature  153-ball WBGA package (11.5 × 13 mm); operating temperature range −25 °C to 85 °C.
• System Reliability  On-board ECC and managed-flash features reduce host overhead for error handling and extend usable media life.
• Low Power Characteristics  Designed with low power consumption in mind for space- and power-constrained designs.

Typical Applications

• IoT devices  Embedded storage for sensor hubs, gateways and instrumentation where a compact managed flash solution simplifies host firmware.
• Smartphones  Non-volatile storage for system software and user data in mobile designs using an e-MMC interface.
• Smart TVs  Local storage for firmware, applications and media buffering in consumer media devices.
• Tablets / 2‑in‑1  On-board storage for operating systems and application data in thin, space-constrained form factors.
• Streaming media & Smart Speakers  Embedded media and firmware storage to support streaming, playback and voice assistant applications.

Unique Advantages

• Highly integrated managed flash  Combines KIOXIA controller and NAND in one package to simplify host design and reduce BOM complexity.
• On-board flash management  Built-in ECC, wear leveling and bad-block management reduce host software requirements and improve reliability.
• JEDEC e-MMC v5.1 compatibility  Standardized interface and protocol support for designs using e-MMC, with documented 400 MB/s capability for v5.1.
• Compact 153-ball WBGA  11.5 × 13 mm footprint enables high-density layouts for space-constrained products.
• Wide voltage and temperature ranges  2.7–3.6 V supply and −25 °C to 85 °C operating range support a variety of embedded environments.
• Part of a broad e-MMC family  Available alongside multiple density options within KIOXIA’s e-MMC lineup for design scalability.

Why Choose THGAMSG9T24BAIL?

THGAMSG9T24BAIL delivers a compact, managed e-MMC storage solution combining KIOXIA controller functionality with BiCS FLASH™ 3D NAND. Its JEDEC v5.1 interface, on-board ECC and flash-management features reduce host complexity while providing a standardized connection and measurable performance characteristics for embedded systems.

This part is suited to engineers designing space- and power-sensitive embedded products that require integrated flash management and a small BGA footprint. The combination of supported supply range, operating temperature and a managed controller provides a reliable foundation for long-term embedded storage needs.

Request a quote or submit a materials inquiry to receive pricing, lead-time and availability details for THGAMSG9T24BAIL.