THGAMSG9T15BAIL

The THGAMSG9T15BAIL is a 512 Gbit non-volatile flash memory device in Kioxia America’s e•MMC™ series. It implements NAND (TLC) flash organized as 64G × 8 and provides an eMMC_5.1 memory interface for embedded storage applications.

Designed for board-level integration in a 153-WBGA / 153-BGA (11.5x13) package, the device operates from 2.7 V to 3.6 V, supports a 200 MHz clock frequency, and is specified for an operating temperature range of −25°C to 85°C.

Key Features

• Memory Core and Technology FLASH - NAND (TLC) non-volatile memory organized as 64G × 8, yielding 512 Gbit of storage capacity.
• Interface eMMC_5.1 memory interface for standard embedded storage connectivity.
• Clock 200 MHz clock frequency for eMMC operation.
• Power Supply voltage range 2.7 V to 3.6 V to match common embedded power domains.
• Package 153-WBGA / 153-BGA (11.5x13) package case for compact board-level mounting.
• Operating Environment Specified operating temperature range: −25°C to 85°C.
• Memory Format and Type FLASH memory in a non-volatile format suitable for persistent storage.

Typical Applications

• Embedded storage — Provides eMMC_5.1-compatible NAND flash capacity for embedded systems requiring onboard mass storage.
• System image and firmware storage — Hosts firmware, boot images and system data in a 512 Gbit flash device with a standard eMMC interface.
• Compact module integration — 153-WBGA / 153-BGA (11.5x13) package supports space-constrained board designs needing high-density flash.

Unique Advantages

• High storage density: 512 Gbit capacity delivered by 64G × 8 organization enables large on-board data storage in a single device.
• Standard eMMC interface: eMMC_5.1 compatibility simplifies integration with host controllers that support eMMC memory.
• Compact packaging: 153-WBGA / 153-BGA (11.5x13) package minimizes board footprint for integration into compact systems.
• Wide supply range: 2.7 V to 3.6 V operation provides flexibility across common embedded power rails.
• Extended operating temperature: −25°C to 85°C rating supports deployment across a range of temperature environments.
• Proven NAND technology: TLC NAND flash provides non-volatile storage in FLASH format suitable for persistent data retention.

Why Choose THGAMSG9T15BAIL?

The THGAMSG9T15BAIL combines 512 Gbit NAND (TLC) capacity with an eMMC_5.1 interface and a compact 153-WBGA / 153-BGA (11.5x13) package, offering a straightforward embedded storage option where board space, supply voltage flexibility, and a standard memory interface are required. Its 200 MHz clock support and −25°C to 85°C operating range provide predictable electrical and environmental characteristics for system designs.

This device is suited for designers and procurement teams looking for a single-chip eMMC flash solution that delivers high capacity, standard eMMC connectivity, and compact packaging for integration into embedded systems.

Request a quote or submit an inquiry for pricing and availability of the THGAMSG9T15BAIL to evaluate it for your designs.