THGAMSG9T15BAIL
| Part Description |
IC FLASH 512GBIT EMMC 153FBGA |
|---|---|
| Quantity | 113 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Kioxia America, Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 99 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 153-BGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND (TLC) | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 512 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | 200 MHz | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -25°C ~ 85°C | Write Cycle Time Word Page | N/A | Packaging | 153-WBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | eMMC_5.1 | Memory Organization | 64G x 8 | ||
| Moisture Sensitivity Level | N/A | RoHS Compliance | N/A | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | N/A | HTS Code | N/A |
Overview of THGAMSG9T15BAIL – IC FLASH 512GBIT EMMC 153FBGA
The THGAMSG9T15BAIL is a 512 Gbit non-volatile flash memory device in Kioxia America’s e•MMC™ series. It implements NAND (TLC) flash organized as 64G × 8 and provides an eMMC_5.1 memory interface for embedded storage applications.
Designed for board-level integration in a 153-WBGA / 153-BGA (11.5x13) package, the device operates from 2.7 V to 3.6 V, supports a 200 MHz clock frequency, and is specified for an operating temperature range of −25°C to 85°C.
Key Features
- Memory Core and Technology FLASH - NAND (TLC) non-volatile memory organized as 64G × 8, yielding 512 Gbit of storage capacity.
- Interface eMMC_5.1 memory interface for standard embedded storage connectivity.
- Clock 200 MHz clock frequency for eMMC operation.
- Power Supply voltage range 2.7 V to 3.6 V to match common embedded power domains.
- Package 153-WBGA / 153-BGA (11.5x13) package case for compact board-level mounting.
- Operating Environment Specified operating temperature range: −25°C to 85°C.
- Memory Format and Type FLASH memory in a non-volatile format suitable for persistent storage.
Typical Applications
- Embedded storage — Provides eMMC_5.1-compatible NAND flash capacity for embedded systems requiring onboard mass storage.
- System image and firmware storage — Hosts firmware, boot images and system data in a 512 Gbit flash device with a standard eMMC interface.
- Compact module integration — 153-WBGA / 153-BGA (11.5x13) package supports space-constrained board designs needing high-density flash.
Unique Advantages
- High storage density: 512 Gbit capacity delivered by 64G × 8 organization enables large on-board data storage in a single device.
- Standard eMMC interface: eMMC_5.1 compatibility simplifies integration with host controllers that support eMMC memory.
- Compact packaging: 153-WBGA / 153-BGA (11.5x13) package minimizes board footprint for integration into compact systems.
- Wide supply range: 2.7 V to 3.6 V operation provides flexibility across common embedded power rails.
- Extended operating temperature: −25°C to 85°C rating supports deployment across a range of temperature environments.
- Proven NAND technology: TLC NAND flash provides non-volatile storage in FLASH format suitable for persistent data retention.
Why Choose THGAMSG9T15BAIL?
The THGAMSG9T15BAIL combines 512 Gbit NAND (TLC) capacity with an eMMC_5.1 interface and a compact 153-WBGA / 153-BGA (11.5x13) package, offering a straightforward embedded storage option where board space, supply voltage flexibility, and a standard memory interface are required. Its 200 MHz clock support and −25°C to 85°C operating range provide predictable electrical and environmental characteristics for system designs.
This device is suited for designers and procurement teams looking for a single-chip eMMC flash solution that delivers high capacity, standard eMMC connectivity, and compact packaging for integration into embedded systems.
Request a quote or submit an inquiry for pricing and availability of the THGAMSG9T15BAIL to evaluate it for your designs.
