THGAF8G9T43BAIR
| Part Description |
IC FLASH 64GBIT UFS 153VFBGA |
|---|---|
| Quantity | 243 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Kioxia America, Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 153-VFBGA (11.5x13) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Gbit | Access Time | N/A | Grade | Industrial | ||
| Clock Frequency | N/A | Voltage | 2.7V ~ 3.6V | Memory Type | Non-Volatile | ||
| Operating Temperature | -25°C ~ 85°C (TC) | Write Cycle Time Word Page | N/A | Packaging | 153-VFBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | UFS | Memory Organization | 8G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of THGAF8G9T43BAIR – IC FLASH 64GBIT UFS 153VFBGA
The THGAF8G9T43BAIR is a 64 Gbit Universal Flash Storage (UFS) managed flash device from Kioxia America, Inc., combining KIOXIA flash memory and an integrated controller in a single package. It is part of the Consumer UFS series and uses BiCS FLASH™ 3D NAND technology in a compact 153-ball VFBGA package.
This device targets consumer mobile and embedded storage needs where integrated UFS architecture, higher density, and compact packaging are required—examples include smartphones, tablets, AR/VR devices, streaming media players and smart speakers.
Key Features
- Managed UFS Architecture Integrates KIOXIA controller and flash memory into a single UFS device for simplified host integration.
- Flash Technology BiCS FLASH™ 3D NAND (FLASH - NAND) non-volatile memory organized as 8G × 8 for a total capacity of 64 Gbit.
- Memory Interface UFS serial interface suitable for consumer UFS applications and higher-density storage needs.
- Power Operates from a supply voltage range of 2.7 V to 3.6 V.
- Package 153-ball VFBGA package with package dimensions 11.5 × 13 mm; listed supplier device package 153-VFBGA (11.5×13).
- Operating Temperature Commercial temperature range of −25 °C to 85 °C (TC).
- Standards JEDEC-standard UFS implementation as indicated in product documentation.
- Compact, Low Pin-Count Design VFBGA 153-ball package supports compact board designs and reduced footprint.
Typical Applications
- Smartphones Provides integrated 64 Gbit non-volatile storage in a compact package for consumer mobile devices.
- Tablets and 2‑in‑1 Devices Offers higher-density managed storage with UFS interface to support media and application storage needs.
- AR/VR Headsets Compact, integrated UFS storage suited for space-constrained designs requiring non-volatile capacity.
- Streaming Media Players Delivers integrated flash and controller in a small package to store firmware, media cache and system data.
- Smart Speakers and Consumer Audio Provides non-volatile storage for content, firmware and user data in consumer audio products.
Unique Advantages
- Integrated Controller and Flash: Reduces system-level complexity by providing managed flash in a single-package UFS device.
- Higher-Density Consumer Option: 64 Gbit capacity in the Consumer UFS series supports designs that require more onboard storage without changing form factor.
- Compact Package Footprint: 153‑VFBGA (11.5 × 13 mm) enables high-density board layouts and small product enclosures.
- Wide Supply Voltage Range: 2.7 V to 3.6 V operation provides flexibility across common consumer power domains.
- Commercial Temperature Range: −25 °C to 85 °C supports typical consumer product thermal environments.
- JEDEC-Referenced UFS Implementation: Conforms to JEDEC-referenced UFS design guidance as described in product documentation.
Why Choose THGAF8G9T43BAIR?
The THGAF8G9T43BAIR positions itself as a compact, integrated UFS storage option for consumer devices that need 64 Gbit of non-volatile capacity. Its combination of KIOXIA BiCS FLASH™ 3D NAND and an integrated controller simplifies board design and reduces BOM for devices requiring managed flash storage.
Designed for consumer mobile and embedded applications, this device is suitable for engineers seeking a scalable storage solution within the Consumer UFS series that balances capacity, package size and standard UFS interface compatibility.
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