THGAF8G8T23BAIL

The THGAF8G8T23BAIL is a managed Universal Flash Storage (UFS) device that integrates KIOXIA flash and controller in a single package. It implements NAND flash memory in a UFS serial interface architecture suitable for compact consumer devices.

Designed for mobile and embedded markets such as smartphones, tablets, AR/VR and streaming devices, this UFS part delivers high-speed read/write performance with a compact 153-ball WFBGA package while operating across a broad voltage and temperature range.

Key Features

• Controller & Integration Integrated KIOXIA controller and managed flash solution reduce system-level integration work by combining controller and NAND in one package.
• Memory 32 Gbit NAND flash memory organized as 4G × 8; BiCS FLASH™ 3D flash memory technology is used across the UFS family.
• Interface & Performance UFS serial interface conforming to JEDEC standards with a listed maximum data rate of 1160 MB/s for this consumer-grade device; designed for high-speed reads/writes.
• Power Single-supply operation over a wide input range: 2.7 V to 3.6 V.
• Package 153-ball WFBGA package, 11.5 × 13 mm footprint (supplier package 153-WFBGA), compact form factor for space-constrained designs.
• Operating Range Commercial temperature range: −25 °C to 85 °C (TC) suitable for consumer applications.
• Standards JEDEC-standard UFS implementation and low pin count for simplified board routing.

Typical Applications

• Smartphones — High-speed mobile storage for OS, applications and multimedia files where compact managed flash simplifies integration.
• Tablets / 2‑in‑1 — Local non-volatile storage for media, apps and system data with a small package footprint.
• AR/VR — Fast read/write access for immersive content and system storage in compact consumer headsets.
• Streaming Media — On-device storage for cached content and firmware in streaming set-top boxes and media players.
• Smart Speakers — Local non-volatile storage of firmware and audio assets in space-constrained smart home devices.

Unique Advantages

• Integrated Managed Flash — Combines KIOXIA controller and NAND flash to reduce BOM and simplify firmware and system integration.
• High-Speed UFS Interface — Serial UFS interface and a specified max data rate of 1160 MB/s support fast data transfers for responsive applications.
• Compact BGA Package — 153-ball WFBGA (11.5 × 13 mm) minimizes PCB area for compact device designs.
• Flexible Power Range — Operates from 2.7 V to 3.6 V to accommodate common consumer power rails.
• Wide Operating Temperature — −25 °C to 85 °C rating supports a broad set of consumer environments.
• JEDEC Compliance — Standardized UFS implementation for predictable system behavior and interoperability.

Why Choose THGAF8G8T23BAIL?

THGAF8G8T23BAIL positions as a compact, managed UFS storage option for consumer-focused designs that require integrated controller/flash, high-speed serial performance and a small board footprint. Its 32 Gbit NAND organization, JEDEC-standard UFS interface and 153-ball WFBGA package make it suitable for handheld and embedded devices where board space and integration simplicity matter.

This device targets designers seeking a managed flash solution offering predictable electrical interfaces (2.7–3.6 V) and a commercial operating temperature window (−25 °C to 85 °C), with a clear upgrade path within the UFS family for higher densities when needed.

Request a quote or contact sales to discuss availability, lead times and how THGAF8G8T23BAIL can fit into your product design and supply plan.