TH58TEG6H2HBA4C

The TH58TEG6H2HBA4C is a 64GB single-level cell (SLC) NAND flash memory device from Kioxia America, Inc. It implements SLC NAND flash architecture in a compact 132-BGA package and is provided as non-volatile FLASH memory.

Designed for commercial and industrial storage use, the device emphasizes read/write performance and write endurance while operating from a 2.7V to 3.6V supply and interfacing via an SPI memory interface. The device is specified for an operating temperature range of 0°C to 70°C.

Key Features

• Memory Technology  SLC NAND flash providing single-bit-per-cell storage and documented high read/write performance and write endurance.
• Memory Organization  8G × 8 organization for the device memory array as specified in product details.
• Interface  SPI memory interface for serial communication with host controllers.
• Voltage Supply  Operates from 2.7V to 3.6V, supporting standard 3.3V system rails.
• Package  132-BGA package (supplier device package 132-BGA) for high-density board mounting.
• Operating Temperature  Specified operating range of 0°C to 70°C for commercial temperature deployments.
• Memory Format & Mounting  Provided as FLASH, categorized as non-volatile memory for persistent data storage.

Typical Applications

• Industrial Equipment  Persistent storage for industrial controllers and equipment where endurance and performance are required within commercial temperature ranges.
• Embedded Storage  On-board non-volatile storage for embedded systems and appliances that use SPI-based memory interfaces.
• Commercial Storage Devices  Use in commercial-grade storage modules and devices that benefit from SLC performance and endurance characteristics.
• System Firmware and Boot Storage  Reliable storage medium for firmware, boot code, and configuration data requiring non-volatile retention.

Unique Advantages

• SLC Endurance and Performance: SLC architecture and datasheet-described high read/write performance and write endurance support demanding write/erase cycles.
• Standard SPI Interface: SPI connectivity simplifies integration with a wide range of host controllers and reduces interface complexity.
• Broad Supply Range: 2.7V–3.6V operation aligns with common 3.3V system rails for straightforward power integration.
• Compact High-Density Package: 132-BGA package enables high-density PCB mounting for space-constrained designs.
• Commercial Temperature Rating: 0°C to 70°C operation suitable for many commercial and light industrial environments.

Why Choose 64GB SLC NAND?

The TH58TEG6H2HBA4C positions itself as a durable, performance-oriented SLC NAND flash solution for designs that need non-volatile storage with documented read/write performance and endurance. Its SPI interface, 132-BGA packaging, and 2.7V–3.6V supply range make it suitable for embedded systems and commercial storage applications where reliable persistent memory is required.

This device is appropriate for engineers specifying memory for industrial equipment, embedded controllers, and commercial storage modules that prioritize endurance and straightforward integration. Its specification set supports long-term use in systems requiring repeatable write/erase cycles within the stated temperature and voltage ranges.

If you would like pricing, lead-time information, or technical clarification, request a quote or submit an inquiry to receive detailed availability and procurement assistance.