THGBMHG6C1LBAU6

The THGBMHG6C1LBAU6 is a 64 Gbit non-volatile NAND flash memory in an e·MMC form factor, integrating NAND media and a host-facing controller for managed mass storage. It implements e·MMC interface standards and on-die memory management to serve industrial, consumer electronics, multimedia, and smart metering/lighting applications requiring compact, managed storage.

Designed for system-level integration, the device supports a 2.7 V to 3.6 V supply, a 200 MHz clock frequency, and a 153-WFBGA (11.5 × 13 mm) package while operating across a wide temperature range of −40°C to 105°C (TA).

Key Features

• Core / Technology — 15 nm MLC NAND flash technology with an integrated controller and on-chip memory management.
• Memory — 64 Gbit capacity organized as 8G × 8 to provide a compact density for embedded storage.
• Interface — e·MMC interface compliant with JEDEC versions 5.0 / 5.1 and the MMCA high‑speed memory interface standard; supports HS400 operation per JEDEC 5.x.
• Performance — 200 MHz clock frequency for host interface timing.
• Reliability & Management — Integrated error correction code (ECC), bad block management, wear‑leveling and garbage collection to maintain data integrity and extend usable life.
• Power — 2.7 V to 3.6 V supply voltage range for standard embedded power rails.
• Package & Temperature — 153‑WFBGA package (11.5 × 13 mm) with an operating temperature range of −40°C to 105°C (TA) for extended-environment use.

Typical Applications

• Industrial — Local mass storage for control systems and instrumentation where extended temperature support and managed NAND features are required.
• Consumer Electronics — Embedded storage for devices storing firmware, user data and media content with a standardized host interface.
• Multimedia — Storage for audio/video content and media applications benefiting from integrated error management and garbage collection.
• Smart Metering & Intelligent Lighting — Non-volatile storage for logged data and firmware updates in constrained, temperature‑varying environments.

Unique Advantages

• Highly integrated memory subsystem: Combines NAND flash and a controller with built-in management to reduce host software complexity and simplify system integration.
• Standards-based interface: JEDEC/MMCA compliance and HS400 capability provide predictable integration with standard e·MMC host controllers.
• Built-in data integrity features: ECC, bad block management and wear‑leveling mitigate NAND failure modes and reduce host-side maintenance.
• Wide operating range: −40°C to 105°C (TA) operation supports applications across harsh and extended-temperature environments.
• Compact, high-density package: 153‑WFBGA (11.5 × 13 mm) offers a space-efficient footprint for embedded designs.

Why Choose IC FLASH 64GBIT EMMC 153WFBGA?

The THGBMHG6C1LBAU6 delivers a managed 64 Gbit storage solution that pairs MLC NAND with integrated controller features—ECC, wear‑leveling, bad block management and garbage collection—under established JEDEC e·MMC standards. Its combination of a standardized high-speed interface, compact FBGA package and wide operating temperature range makes it suitable for embedded systems requiring reliable, cost-efficient mass storage.

This e·MMC device is well suited for engineers and procurement teams designing industrial, consumer and multimedia products or metering and lighting systems that need a standardized, managed NAND solution backed by established production and memory-management capabilities.

Request a quote or contact sales to discuss THGBMHG6C1LBAU6 for your design, including pricing, availability and lead-time details.