W9825G6KH-5 TR
| Part Description |
IC DRAM 256MBIT PAR 54TSOP II |
|---|---|
| Quantity | 505 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Winbond Electronics |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 24 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 54-TSOP II | Memory Format | DRAM | Technology | SDRAM | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Mbit | Access Time | 5 ns | Grade | Commercial | ||
| Clock Frequency | 200 MHz | Voltage | 3V ~ 3.6V | Memory Type | Volatile | ||
| Operating Temperature | 0°C ~ 70°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 54-TSOP (0.400", 10.16mm Width) | ||
| Mounting Method | Volatile | Memory Interface | Parallel | Memory Organization | 16M x 16 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.0024 |
Overview of W9825G6KH-5 TR – IC DRAM 256MBIT PAR 54TSOP II
The W9825G6KH-5 TR is a high-speed synchronous DRAM (SDRAM) device with a memory capacity of 256 Mbit, organized as 16M × 16 and implemented as 4M × 4 banks × 16 bits. It delivers a data bandwidth up to 200M words per second and conforms to the -5 speed grade supporting 200 MHz/CL3 operation.
This parallel-interface SDRAM is targeted at systems that require a 16-bit DRAM data path, offering standard SDRAM command support and a 54-TSOP II package footprint. Its electrical and timing characteristics support common SDRAM operations including burst read/write, auto-refresh, self-refresh and power-down modes.
Key Features
- Memory Architecture Organized as 16M × 16 (4M × 4 banks × 16 bits) providing a total density of 256 Mbit for parallel memory subsystems.
- High-Speed Operation Rated for 200 MHz clock frequency with an access time of 5 ns and a data bandwidth up to 200M words per second (‑5 speed grade / CL3).
- Standard SDRAM Command Support Supports standard SDRAM operations and command set including bank activate, burst read/write, auto-precharge, auto-refresh, self-refresh and power-down modes (per device functional description).
- Voltage and Power Operates from 3.0 V to 3.6 V supply, suitable for 3.3 V-based system designs.
- Package and Mounting Supplied in a 54-TSOP II package (0.400", 10.16 mm width) for compact board-level integration.
- Operating Range Specified for ambient operating temperature TA = 0 °C to 70 °C.
Typical Applications
- Personal Computers Conforms to the personal computer industrial speed specifications for use in PC memory subsystems requiring 200 MHz/CL3 SDRAM operation.
- Parallel SDRAM Subsystems Suited for system designs that require a 16-bit parallel DRAM interface and compact 54-TSOP II mounting.
- Memory Expansion Modules Appropriate for board-level memory expansion where 256 Mbit density and standard SDRAM command support are required.
Unique Advantages
- Performance at 200 MHz: -5 speed grade supports 200 MHz operation and CL3 timing, delivering up to 200M words per second for higher-throughput memory paths.
- 256 Mbit Density in 16-bit Organization: 16M × 16 organization (4M × 4 banks × 16 bits) provides a balanced combination of capacity and parallel data width for system memory designs.
- Comprehensive SDRAM Feature Set: Implements standard SDRAM functions such as burst read/write, auto-refresh, self-refresh and power-down to support robust memory management and power control.
- Compact TSOP II Package: 54-TSOP (0.400", 10.16 mm width) package simplifies placement in space-constrained designs while maintaining a standard footprint.
- 3.0–3.6 V Supply Compatibility: Operates on common 3.3 V supply rails, easing integration into existing 3.3 V systems.
Why Choose W9825G6KH-5 TR?
The W9825G6KH-5 TR combines a 256 Mbit SDRAM density with a 16-bit parallel data path and a 4-bank internal organization to deliver high-speed, standard SDRAM functionality in a compact 54-TSOP II package. Its 200 MHz/CL3 capability and a comprehensive set of SDRAM commands make it suitable for systems that need predictable timing and throughput.
This device is appropriate for designers specifying a 3.0–3.6 V SDRAM solution with an ambient operating range of 0 °C to 70 °C and a 54-TSOP II footprint. It offers a clear specification set for engineering validation and system integration where standard SDRAM behavior and timing are required.
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