W9825G6KH-6I TR

The W9825G6KH-6I TR is a 256 Mbit synchronous dynamic RAM (SDRAM) device offered in a 54‑TSOP II package. It implements a parallel SDRAM architecture organized as 4M × 4 banks × 16 bits (listed as 16M × 16 organization in product specifications) and is provided as an industrial-temperature (-40°C to 85°C) speed grade.

Designed for board‑level memory subsystems, the device provides standard SDRAM control (burst read/write, auto‑refresh, self‑refresh, power‑down) and a 3.0–3.6 V supply range to suit 3.3 V system environments where a compact 54‑TSOP form factor and deterministic timing are required.

Key Features

• Core / Architecture Synchronous DRAM (SDRAM) organized as 4M words × 4 banks × 16 bits with a total capacity of 256 Mbit.
• Memory Organization Specified as 16M × 16 in product specifications and implemented across four internal banks for interleaved and burst access modes.
• Performance & Timing 166 MHz clock frequency for the -6/-6I grade with CAS latency support noted in the datasheet; access time listed as 5 ns.
• Standard SDRAM Commands Supports burst read/write, auto‑precharge, precharge, self‑refresh, power‑down, bank activate and other standard SDRAM command sequences as documented in the datasheet.
• Voltage & Power Operates from 3.0 V to 3.6 V supply voltage, compatible with common 3.3 V system rails.
• Package & Mounting 54‑lead TSOP II package (0.400", 10.16 mm width) for low‑profile, board‑level mounting.
• Operating Temperature Industrial temperature grade: −40 °C to 85 °C (TA) for the -6I part number variant.

Typical Applications

• Industrial embedded systems — Use as main or auxiliary DRAM where industrial temperature range and standard SDRAM commands are required.
• Board‑level memory expansion — Compact 54‑TSOP II package provides density for space‑constrained PCBs needing parallel SDRAM.
• Legacy PC and workstation subsystems — Supplied in speed grades sorted to personal‑computer industrial standard as described in the datasheet.

Unique Advantages

• Industrial temperature capability: The -6I grade is specified for −40 °C to 85 °C, enabling deployment in temperature‑sensitive environments.
• Deterministic SDRAM timing: Documented AC characteristics, access time (5 ns) and timing waveforms support predictable integration with SDRAM controllers.
• Compact TSOP II package: 54‑lead TSOP (0.400", 10.16 mm) offers a low‑profile footprint for dense board layouts.
• Standard SDRAM feature set: Built‑in support for burst modes, auto‑refresh and self‑refresh simplifies controller implementation and memory management.
• 3.0–3.6 V compatibility: Matches common 3.3 V system rails for straightforward power integration.

Why Choose W9825G6KH-6I TR?

The W9825G6KH-6I TR provides a validated SDRAM option for designs that require 256 Mbit density in a compact 54‑TSOP II package with industrial temperature capability. Its documented command set and timing parameters support integration into systems that rely on standard SDRAM control and predictable performance at the listed 166 MHz grade.

This device is suited to engineers specifying board‑level parallel SDRAM for industrial embedded systems, memory expansion on constrained PCBs, or applications that require the documented timing, supply and thermal characteristics provided in the datasheet.

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