W9825G6KH-6I

The W9825G6KH-6I is a high-speed synchronous DRAM (SDRAM) device from Winbond Electronics, organized as 4M × 4 banks × 16 bits to provide 256 Mbit of parallel memory. It implements a standard SDRAM architecture with a 16M × 16 organization and supports a parallel memory interface for systems requiring deterministic external DRAM access.

Designed for systems targeting the 166 MHz/CL3 speed grade, the device supports industrial temperature operation (−40°C to 85°C) and operates from a 3.0 V to 3.6 V supply, making it suitable for computing and industrial applications where documented timing, power modes and package footprint matter.

Key Features

• SDRAM Core and Organization Organized as 4M × 4 banks × 16 bits (16M × 16), providing 256 Mbit of parallel SDRAM capacity for external memory applications.
• Speed and Timing Rated for 166 MHz clock operation (‑6 grade) with an access time of 5 ns; datasheet references operation and timing examples including burst read/write and CAS latency documentation.
• Power Supply Operates from a 3.0 V to 3.6 V supply range to match common 3 V SDRAM rails.
• Package Available in a 54‑lead TSOP II (0.400", 10.16 mm width) package for compact board-level integration.
• Operating Temperature Specified for −40°C to 85°C (TA), supporting industrial temperature range requirements.
• SDRAM Functional Features Supports standard SDRAM command set and modes documented in the datasheet including mode register set, bank activate, burst read/write, auto‑precharge, precharge, auto‑refresh, self‑refresh, power‑down and clock suspend modes.
• Interface Parallel memory interface with full SDRAM control signals and timing detail provided in the datasheet for deterministic system design.

Typical Applications

• Personal and Industrial Computing Use as external SDRAM for systems designed to meet personal computer industrial standard timing and performance requirements.
• Industrial Equipment Memory for industrial designs requiring operation across −40°C to 85°C ambient temperatures.
• Board-Level Memory Expansion Compact 54‑TSOP II package suited for designs that require parallel SDRAM integration in limited PCB footprint.

Unique Advantages

• Documented SDRAM Behavior: Comprehensive datasheet coverage of operation modes, timing waveforms and command sequences simplifies system timing validation and integration.
• Industrial Temperature Capability: Specified −40°C to 85°C operation enables deployment in temperature‑sensitive industrial environments.
• High-Speed Parallel Throughput: 166 MHz clock rating with 5 ns access time supports high-rate external memory data transfers for designs matching the -6 speed grade.
• Standard 3 V Supply: 3.0 V to 3.6 V supply compatibility simplifies power rail design for systems using common 3 V SDRAM supplies.
• Compact TSOP II Footprint: 54‑lead TSOP II package provides a small board footprint while maintaining required lead counts for standard SDRAM interfaces.

Why Choose W9825G6KH-6I?

The W9825G6KH-6I provides a documented, industrial‑temperature SDRAM solution with a parallel interface, predictable timing behavior and a compact 54‑TSOP II package. Its 256 Mbit capacity, 16M × 16 organization and support for standard SDRAM commands (burst modes, auto‑precharge, self‑refresh, power‑down, etc.) make it appropriate for designs that require externally managed high‑speed SDRAM with explicit timing control.

Backed by a detailed Winbond datasheet covering electrical characteristics, timing waveforms and operating examples, the W9825G6KH-6I is suited to engineering teams that need verifiable timing data and package specifications for reliable system integration.

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