MIMX8MN1DVPIZAA

IC MPU I.MX8MN 1.4GHZ 306TFBGA
Part Description

ARM® Cortex®-A53, ARM® Cortex®-M7 Microprocessor IC i.MX8MN 2 Core, 64-Bit 1.4GHz 306-TFBGA (11x11)

Quantity 1,281 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 8MN
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A53, ARM® Cortex®-M7Device Package306-TFBGA (11x11)
Display & Interface ControllersLCD, MIPI-CSIECCNN/AEthernetGbE
Graphics AccelerationYesHTS CodeN/AMoisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 64-Bit
Operating Temperature0°C ~ 95°C (TJ)Package / Case306-TFBGARAM ControllersDDR3L, DDR4, LPDDR4
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Speed1.4GHzSupplier Device Package306-TFBGA (11×11)USBUSB 2.0 OTG + PHY (1)

Overview of MIMX8MN1DVPIZAA – IC MPU I.MX8MN 1.4GHZ 306TFBGA

The MIMX8MN1DVPIZAA is an NXP Semiconductors microprocessor integrating ARM® Cortex®-A53 and ARM® Cortex®-M7 cores in a compact 306‑TFBGA (11×11 mm) package. It combines a 64‑bit application core and a real‑time microcontroller core to address embedded consumer designs that require a mix of application performance, multimedia processing and deterministic control.

Designed for embedded consumer applications, this device delivers 1.4 GHz application performance, hardware multimedia acceleration and a set of common peripheral interfaces to simplify system integration and accelerate time to market.

Key Features

  • Core Architecture  Dual‑core configuration with ARM® Cortex®‑A53 and ARM® Cortex®‑M7 processors providing 64‑bit application processing and a dedicated real‑time core.
  • Clock Speed  1.4 GHz application core frequency for responsive processing in consumer embedded systems.
  • Multimedia and DSP  Multimedia co‑processing including NEON™ Media Processing Engine for accelerated media workloads and DSP‑style processing.
  • Memory Support  Integrated controllers supporting DDR3L, DDR4 and LPDDR4 memory types for flexible performance and cost tradeoffs.
  • Display and Camera Interfaces  On‑chip display interface controllers (LCD) and MIPI‑CSI for camera input and display connectivity.
  • Connectivity  Gigabit Ethernet (GbE) and one USB 2.0 OTG with PHY for networked and peripheral connectivity.
  • Audio and Legacy Interfaces  Includes AC'97 support for legacy audio subsystem integration.
  • Security Features  Hardware security building blocks including ARM TrustZone (TZ), CAAM, HAB, OCRAM, RDC, SJC and SNVS for secure boot, cipher acceleration and system isolation.
  • Graphics Acceleration  On‑die graphics acceleration to support UI and media rendering workloads.
  • Package and Mounting  306‑TFBGA (11×11 mm) surface‑mount package suitable for compact embedded boards.
  • Operating Range and Compliance  Consumer‑grade qualification with an operating temperature range of 0 °C to 95 °C and RoHS compliance.

Typical Applications

  • Consumer Multimedia Devices  Suitable for streaming and media‑rich products that require application processing plus hardware multimedia acceleration.
  • Smart Home and IoT Gateways  Provides network connectivity (GbE) and USB OTG for connected home hubs and gateway devices.
  • Embedded HMI and Displays  LCD and graphics acceleration support make it suitable for consumer human‑machine interfaces and touchscreen displays.
  • Audio Subsystems  AC'97 and on‑chip multimedia features support consumer audio applications and playback devices.

Unique Advantages

  • Balanced dual‑core design: Combines a 64‑bit Cortex‑A53 application core with a Cortex‑M7 real‑time core to separate high‑level processing from deterministic control tasks.
  • Flexible memory support: DDR3L, DDR4 and LPDDR4 controller compatibility enables designers to choose memory that matches performance and cost targets.
  • Integrated multimedia acceleration: NEON MPE and graphics acceleration reduce external processing requirements for media and UI workloads.
  • Comprehensive security features: On‑chip security modules such as ARM TZ, CAAM and HAB support secure boot and crypto acceleration for consumer devices.
  • Compact system footprint: The 306‑TFBGA (11×11) surface‑mount package helps minimize board area for space‑constrained designs.
  • Ready for consumer markets: Consumer qualification and RoHS compliance align the device with a broad set of embedded consumer product requirements.

Why Choose MIMX8MN1DVPIZAA?

The MIMX8MN1DVPIZAA positions itself as a compact, integrated solution for embedded consumer designs that need both application‑level performance and real‑time control. Its combination of ARM® Cortex®‑A53 and Cortex®‑M7 cores, multimedia acceleration, flexible memory support and built‑in security features enables simplified system architecture and reduced external component needs.

This device is well suited to developers building consumer multimedia, smart home, HMI and audio products who require an NXP Semiconductors solution offering balanced processing, connectivity options and a compact package footprint for reliable, production‑grade designs.

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