OMAP5910GGZG2
| Part Description |
MIXED SIGNAL PROCESSOR |
|---|---|
| Quantity | 1,536 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | OMAP5910 |
| Manufacturer | Texas Instruments |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Signal Processing; C55x, System Control; CP15 | Device Package | 289-BGA MICROSTAR (12x12) | ECCN | 3A991A2 | ||
|---|---|---|---|---|---|---|---|
| Ethernet | 10/100Mbps (1) | Grade | Industrial | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40 °C – 85 °C | Package / Case | 289-TFBGA | ||
| REACH Compliance | REACH Affected | RoHS Compliance | RoHS non-compliant | Voltage – I/O | 1.8 V – 3.3 V |
Overview of OMAP5910GGZG2 – MIXED SIGNAL PROCESSOR
The OMAP5910GGZG2 is a mixed-signal microprocessor from Texas Instruments' OMAP5910 series designed for embedded and industrial applications. It integrates a 32-bit single core architecture with dedicated coprocessors and on-chip interfaces to support signal processing, system control and networked device designs.
With industrial-grade temperature range and hardware security features, this device targets embedded systems that require integrated signal processing, deterministic control and wired networking capability.
Key Features
- Core 1 Core, 32‑Bit architecture providing the primary processing engine for embedded tasks.
- Co‑processors Includes a Signal Processing DSP (C55x) and a System Control coprocessor (CP15) for offloading specialized workloads and control functions.
- Ethernet 10/100 Mbps Ethernet (1) for wired network connectivity in industrial and embedded systems.
- Security Built‑in Cryptography and a Random Number Generator to support secure communications and cryptographic operations.
- Package & Mounting 289‑TFBGA package (Supplier device package: 289‑BGA MICROSTAR (12×12)); designed for surface mount assembly.
- Operating Range Industrial operating temperature from −40 °C to 85 °C for deployment in a wide range of environments.
- Compliance RoHS compliant, meeting common lead‑free manufacturing requirements.
- Graphics No graphics acceleration—optimized for control, signal processing and networked functionality rather than graphics.
Typical Applications
- Industrial Embedded Systems Use in control and monitoring equipment that require industrial temperature operation and integrated processing.
- Networked Devices Devices that need 10/100 Mbps Ethernet connectivity combined with onboard processing and security features.
- Security‑Sensitive Embedded Designs Applications that benefit from hardware cryptography and a random number generator for secure communications and key generation.
Unique Advantages
- Integrated signal and system coprocessors: Combines a C55x DSP and a CP15 system control coprocessor to offload specialized processing and streamline system design.
- Onboard wired networking: 10/100 Mbps Ethernet capability reduces the need for external PHY components in networked embedded products.
- Hardware security primitives: Built‑in cryptography and RNG support improves security implementation while reducing external security IC requirements.
- Industrial temperature rating: −40 °C to 85 °C operation enables deployment across a broad range of environmental conditions common in industrial applications.
- Compact BGA package: 289‑TFBGA / 289‑BGA MICROSTAR (12×12) footprint supports high‑density board designs and surface‑mount manufacturing.
- RoHS compliant: Meets lead‑free manufacturing requirements for many commercial and industrial projects.
Why Choose OMAP5910GGZG2?
The OMAP5910GGZG2 positions itself as a focused mixed‑signal processor for embedded and industrial designs that need integrated DSP capabilities, system control coprocessing, wired Ethernet connectivity, and hardware security features. Its industrial temperature rating and compact BGA package make it suitable for robust, space‑constrained applications.
This part is appropriate for engineers and procurement teams developing networked embedded products that require deterministic processing, security primitives, and an industrial operating envelope, while keeping board-level integration tight and BOM count lower.
Request a quote or submit an inquiry today to check availability and pricing for the OMAP5910GGZG2 mixed signal processor.

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