OMAP5910JGVL2

IC MPU OMAP-59XX 150MHZ 289NFBGA
Part Description

ARM9TDMI Microprocessor IC OMAP-59xx 1 Core, 32-Bit 150MHz 289-NFBGA (12x12)

Quantity 354 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesOMAP5910
ManufacturerTexas Instruments
Manufacturing StatusActive
Manufacturer Standard Lead Time6 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPSignal Processing; C55x, System Control; CP15Core ProcessorARM9TDMIDevice Package289-NFBGA (12x12)
Display & Interface ControllersKeypad, LCDECCN3A991A2GradeIndustrial
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 85°C (TC)Package / Case289-TFBGARAM ControllersSDRAM
REACH ComplianceREACH AffectedRoHS ComplianceRoHS non-compliantSpeed150MHz
Supplier Device Package289-NFBGA (12×12)USBUSB 2.0 (2)Voltage – I/O1.8V, 2.75V, 3.3V

Overview of OMAP5910JGVL2 – ARM9TDMI 150 MHz 289-NFBGA Microprocessor

The OMAP5910JGVL2 is an industrial-grade 32-bit microprocessor based on the ARM9TDMI core, clocked at 150 MHz. It combines a general-purpose ARM9TDMI core with integrated peripherals and co-processors to support embedded designs requiring deterministic control, communications, and human‑machine interface functions.

Targeted at embedded applications, this device delivers integration of memory interfaces, display support, wired networking and USB connectivity along with on-chip security features and industrial temperature operation for robust deployment.

Key Features

  • Core — ARM9TDMI 32-bit processor core operating at 150 MHz, suitable for embedded control and application processing.
  • Co‑processors — Includes signal processing co-processor support (C55x) and system control co-processor (CP15) for enhanced processing flexibility.
  • Memory Interfaces — SDRAM controller support; the EMIF interface provides access to 16-bit-wide standard SDRAM memories and the IMIF provides access to 192 KB of on‑chip SRAM.
  • Display and UI — Integrated display interface controllers with support for keypad and LCD panels; datasheet notes support for monochrome (STN) and color panels (STN or TFT).
  • Connectivity — Single 10/100 Mbps Ethernet MAC and dual USB 2.0 ports for wired networking and peripheral connectivity.
  • Additional Interfaces — 1‑Wire/HDQ support for sensor and low-pin-count communications.
  • Security — Hardware cryptography and a Random Number Generator to support secure functions.
  • Package and Mounting — Available in 289‑NFBGA (12×12) supplier package and 289‑TFBGA case; surface-mount device designed for standard PCB assembly.
  • Industrial Grade Operation — Rated for operation from −40 °C to 85 °C and RoHS compliant for environmental requirements.

Typical Applications

  • Industrial Control — Deterministic 32-bit processing and SDRAM support for embedded controllers, HMI nodes, and factory automation endpoints.
  • Networking Endpoints — Integrated 10/100 Mbps Ethernet and USB 2.0 ports for connectivity in edge devices and protocol gateways.
  • User Interfaces — LCD and keypad controller support for operator panels, portable handhelds, and appliance interfaces.
  • Secure Embedded Systems — On-chip cryptography and RNG for devices requiring secure boot, authentication, or encrypted communications.

Unique Advantages

  • Balanced compute and I/O: The ARM9TDMI core combined with C55x and CP15 co-processors provides a mix of general-purpose and signal-processing capability without external co-processor requirements.
  • Integrated memory subsystem: EMIF access to 16-bit SDRAM and 192 KB of on-chip SRAM via IMIF reduces external memory complexity and streamlines board design.
  • Built‑in connectivity: Native Ethernet and dual USB 2.0 ports lower BOM and simplify integration for networked and peripheral-rich applications.
  • Security primitives on-chip: Hardware cryptography and RNG enable implementation of secure features without separate security ICs.
  • Industrial temperature and RoHS compliance: Rated −40 °C to 85 °C and RoHS compliant for industrial deployments and environmental requirements.
  • Compact BGA package: 289‑pin BGA packages support high I/O density in a compact 12×12 form factor for space-constrained designs.

Why Choose OMAP5910JGVL2?

OMAP5910JGVL2 positions itself as a versatile embedded microprocessor offering a 150 MHz ARM9TDMI core paired with co-processor support, integrated memory interfaces, and on-chip security. Its combination of connectivity (Ethernet, USB), display support, and industrial temperature rating makes it suitable for embedded designs that require a reliable, integrated processing platform.

This device is appropriate for engineers and procurement teams building industrial control systems, HMI products, and networked edge devices where a balance of processing capability, I/O integration, and compact packaging reduces BOM and design complexity while supporting longer-term deployment needs.

Request a quote or submit an inquiry to get pricing and availability for OMAP5910JGVL2 and discuss how this device can fit into your next embedded design.

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