OMAP5910JZZG2

IC MPU OMAP-59XX 150MHZ 289BGA
Part Description

ARM9TDMI Microprocessor IC OMAP-59xx 1 Core, 32-Bit 150MHz 289-BGA MICROSTAR (12x12)

Quantity 255 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesOMAP5910
ManufacturerTexas Instruments
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPSignal Processing; C55x, System Control; CP15Core ProcessorARM9TDMIDevice Package289-BGA MICROSTAR (12x12)
Display & Interface ControllersKeypad, LCDECCN3A991A2GradeIndustrial
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level4 (72 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 85°C (TC)Package / Case289-TFBGARAM ControllersSDRAM
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSpeed150MHz
Supplier Device Package289-BGA MICROSTAR (12×12)USBUSB 2.0 (2)Voltage – I/O1.8V, 2.75V, 3.3V

Overview of OMAP5910JZZG2 – IC MPU OMAP-59XX 150MHZ 289BGA

The OMAP5910JZZG2 is an ARM9TDMI-based 32-bit microprocessor optimized for embedded systems. With a single ARM9 core running at 150 MHz and integrated peripheral support, it addresses industrial embedded applications that require communications, human‑machine interfaces, and on-chip security.

Designed and documented by Texas Instruments as part of the OMAP5910 series, this part combines processor performance with a compact 289‑BGA MICROSTAR (12×12) surface‑mount package and an industrial operating temperature range for robust deployment.

Key Features

  • Core — ARM9TDMI 32‑bit processor core running at 150 MHz, providing deterministic processing for embedded control and application tasks.
  • Co‑processors — Integrated co‑processors for signal processing (C55x) and system control (CP15) to offload specialized workloads.
  • Memory Controller — SDRAM controller support for conventional external memory interfacing in embedded designs.
  • Display & Input — On‑chip controllers for LCD and keypad interfaces to support user interface implementations.
  • Connectivity — Built‑in 10/100 Mbps Ethernet port (1) and dual USB 2.0 controllers (2) for networking and peripheral connectivity.
  • Security — Hardware cryptography and a built‑in random number generator to support secure operations and encrypted communications.
  • Additional Interfaces — 1‑Wire/HDQ support for simple sensor or peripheral connections.
  • Package & Mounting — 289‑TFBGA / 289‑BGA MICROSTAR (12×12) surface‑mount package for compact board-level integration.
  • Industrial Temperature Range — Rated for operation from −40 °C to 85 °C for deployment in industrial environments.
  • RoHS Compliant — Meets RoHS environmental requirements.

Typical Applications

  • Industrial Embedded Systems — Control and monitoring applications that benefit from an industrial temperature range and integrated Ethernet connectivity.
  • Human‑Machine Interfaces — Devices with LCD and keypad requirements where on‑chip display and input controllers simplify BOM and design.
  • Networked Modules — Embedded communications equipment leveraging 10/100 Mbps Ethernet and USB 2.0 interfaces for connectivity and peripheral support.
  • Secure Embedded Devices — Applications that require on‑chip cryptography and random number generation for secure data handling and communications.

Unique Advantages

  • Deterministic ARM9 Performance: A 150 MHz ARM9TDMI core provides predictable 32‑bit processing suited to embedded control tasks.
  • Integrated Connectivity: Native Ethernet and dual USB 2.0 support reduce external interface components and simplify system design.
  • On‑Chip Security Primitives: Hardware cryptography and RNG reduce development complexity for secure applications.
  • Compact Surface‑Mount Package: The 289‑BGA MICROSTAR (12×12) package enables high‑density board layouts while maintaining signal integrity.
  • Industrial Grade Operation: −40 °C to 85 °C operating range supports deployment in demanding ambient conditions.
  • Specialized Offload: Dedicated signal processing and system control co‑processors help optimize real‑time and DSP workloads.

Why Choose OMAP5910JZZG2?

The OMAP5910JZZG2 positions itself as a reliable, integrated processor solution for embedded and industrial applications requiring a balance of processing capability, peripheral integration, and on‑chip security. Its combination of an ARM9TDMI core, memory interface, multiple connectivity options, and industrial temperature rating makes it suitable for designs where board‑level simplicity and environmental robustness matter.

Backed by Texas Instruments documentation for the OMAP5910 series, this part appeals to designers building networked embedded systems, human‑machine interfaces, and secure modules that benefit from a compact BGA package and proven silicon heritage.

Request a quote or submit an inquiry to receive pricing, availability, and lead‑time information for the OMAP5910JZZG2.

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