OMAP5912ZDY

IC MPU OMAP-59XX 192MHZ 289BGA
Part Description

ARM926EJ-S Microprocessor IC OMAP-59xx 1 Core, 32-Bit 192MHz 289-BGA (19x19)

Quantity 1,858 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesOMAP5910
ManufacturerTexas Instruments
Manufacturing StatusActive
Manufacturer Standard Lead Time6 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPSignal Processing; C55x, System Control; CP15Core ProcessorARM926EJ-SDevice Package289-BGA (19x19)
Display & Interface ControllersKeyboard, LCDECCN5A992CGradeIndustrial
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 85°C (TC)Package / Case289-BGARAM ControllersLPDDR
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesCryptography, Random Number Generator
Speed192MHzSupplier Device Package289-BGA (19×19)USBUSB 1.1 (1), USB 1.x (2)
Voltage – I/O1.8V, 2.75V, 3.3V

Overview of OMAP5912ZDY – IC MPU OMAP-59XX 192MHZ 289BGA

The OMAP5912ZDY is an embedded microprocessor from Texas Instruments' OMAP5910 series featuring a single 32‑bit ARM926EJ‑S core running at 192 MHz. It targets embedded and industrial applications that require a compact, integrated processor with on‑chip peripherals and memory controller support.

Designed as an industrial‑grade part, the device is supplied in a 289‑ball BGA (19×19) package and supports an extended operating temperature range from −40 °C to 85 °C. The device datasheet provides detailed production and package terminal information for engineering integration.

Key Features

  • CPU Core Single ARM926EJ‑S 32‑bit core operating at 192 MHz, suitable for general embedded processing tasks.
  • Co‑processors Integrated signal processing and system control co‑processors (C55x and CP15) for offloading specialized tasks.
  • Memory Support On‑chip LPDDR memory controller to interface with low‑power DRAM implementations.
  • Connectivity Integrated 10/100 Mbps Ethernet (1) and multiple USB ports (USB 1.1 and USB 1.x) for network and peripheral connectivity.
  • Display & Input Display interface controllers including support for LCD and keyboard interfaces for human‑machine interaction.
  • Security Built‑in cryptography and a random number generator to support device security functions.
  • System Interfaces Additional peripheral interfaces including 1‑Wire/HDQ and standard peripheral muxing options documented in the datasheet.
  • Package & Mounting 289‑BGA (19×19) surface‑mount package optimized for compact board designs and automated assembly.
  • Industrial Temperature Range Rated for −40 °C to 85 °C operation for deployment in industrial environments.
  • Regulatory Status RoHS compliant.

Typical Applications

  • Embedded Systems Use as the main application processor in compact embedded controllers where a 32‑bit ARM core and integrated peripherals are required.
  • Industrial Control Suitable for industrial devices that need a processor with an extended temperature range and integrated networking and I/O.
  • Human‑Machine Interfaces (HMI) Drive simple LCD and keyboard interfaces for operator panels and control consoles.
  • Networked Peripherals Integrate Ethernet and USB connectivity for networked appliances or peripheral controllers.

Unique Advantages

  • Integrated Processing and Offload ARM926EJ‑S core combined with C55x and CP15 co‑processors provides native options for offloading signal and system control tasks.
  • On‑board Memory Controller LPDDR controller integration reduces external memory interface complexity and BOM count.
  • Industrial‑Grade Reliability −40 °C to 85 °C operating range and surface‑mount BGA package support robust deployment in industrial environments.
  • Broad Peripheral Set Built‑in Ethernet, multiple USB ports, display and keyboard controllers, and 1‑Wire/HDQ simplify connectivity and user interface design.
  • Security Primitives On‑chip cryptography and random number generation enable implementation of security features without additional hardware.
  • Compact Package 289‑ball BGA (19×19) package enables high‑density PCB layouts for space‑constrained designs.

Why Choose OMAP5912ZDY?

The OMAP5912ZDY combines a 192 MHz ARM926EJ‑S core with integrated co‑processors, memory controller, networking, USB and display interfaces, making it a practical choice for embedded and industrial projects that demand a compact, well‑integrated processor solution. Its industrial temperature rating and RoHS compliance support deployment in harsh environments where long‑term reliability is required.

As a Texas Instruments OMAP5910 series device, the OMAP5912ZDY is accompanied by detailed production documentation and package terminal information to aid engineering integration and system design.

Request a quote or submit an inquiry to receive pricing, availability and technical assistance for the OMAP5912ZDY. Our team can provide support for procurement and design‑in considerations.

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