OMAP5910JZDY2
| Part Description |
ARM9TDMI Microprocessor IC OMAP-59xx 1 Core, 32-Bit 150MHz 289-BGA (19x19) |
|---|---|
| Quantity | 122 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | OMAP5910 |
| Manufacturer | Texas Instruments |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 6 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Signal Processing; C55x, System Control; CP15 | Core Processor | ARM9TDMI | Device Package | 289-BGA (19x19) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | Keypad, LCD | ECCN | 3A991A2 | Grade | Industrial | ||
| Graphics Acceleration | No | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 85°C (TC) | Package / Case | 289-BGA | RAM Controllers | SDRAM | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Speed | 150MHz | ||
| Supplier Device Package | 289-BGA (19×19) | USB | USB 2.0 (2) | Voltage – I/O | 1.8V, 2.75V, 3.3V |
Overview of OMAP5910JZDY2 – IC MPU OMAP-59XX 150MHz 289BGA
The OMAP5910JZDY2 is a 32-bit ARM9TDMI microprocessor IC targeted for embedded applications. It operates at 150 MHz and integrates core system controllers and peripheral interfaces to support compact, industrial-grade designs.
Designed for embedded and industrial markets, the device delivers processor performance together with integrated Ethernet, USB 2.0, display and memory controller support, plus hardware security primitives—enabling networked, secure human‑machine and control applications in a single 289‑BGA package.
Key Features
- Core — ARM9TDMI 32‑bit processor core running at 150 MHz for control and application processing in embedded systems.
- Memory and Controllers — Integrated SDRAM controller to interface with external memory for system and application data storage.
- Display and HMI — Built‑in display interface controllers for keypad and LCD support, enabling direct human‑machine interface integration.
- Connectivity — 10/100 Mbps Ethernet MAC and dual USB 2.0 ports provide wired networking and peripheral connectivity options.
- Co‑processing — Dedicated signal processing and system control co‑processors (C55x and CP15) to offload specialized tasks from the main core.
- Security — Cryptography engine and hardware random number generator for device-level security functions.
- Package and Mounting — 289‑BGA (19×19) surface‑mount package suitable for dense board layouts.
- Industrial Temperature Range — Rated for operation from −40 °C to 85 °C for a broad range of industrial applications.
- Additional Interfaces — Includes support for 1‑Wire/HDQ for simple sensor and peripheral interfacing.
Typical Applications
- Industrial Control — Use the industrial temperature rating and integrated networking to implement controllers and gateways for factory or process automation.
- Embedded Networking Devices — Combine the 10/100 Mbps Ethernet and USB 2.0 ports to build connected embedded nodes, protocol converters, and communication interfaces.
- Human‑Machine Interfaces (HMIs) — Leverage LCD and keypad controllers to implement compact operator panels and touchless displays.
- Secure Edge Devices — Hardware cryptography and RNG support secure boot, encrypted communication, and device authentication in edge deployments.
Unique Advantages
- Integrated I/O and Networking: Built‑in Ethernet and dual USB 2.0 ports reduce external components and simplify board design for connected systems.
- Security Primitives On‑Chip: Cryptography engine and random number generator provide on‑device security functions without separate security ICs.
- HMI-Ready: Native keypad and LCD controllers enable direct implementation of user interfaces with minimal additional logic.
- Industrial Reliability: Specified operation from −40 °C to 85 °C and an industrial grade designation support deployment in harsh environments.
- Compact, High‑Density Package: 289‑BGA (19×19) allows for a small system footprint while retaining extensive peripheral integration.
Why Choose OMAP5910JZDY2?
The OMAP5910JZDY2 combines an ARM9TDMI core at 150 MHz with integrated memory control, connectivity, display interfaces, and hardware security, providing a balanced platform for embedded and industrial designs that require network connectivity and secure operation. Its industrial temperature rating and compact 289‑BGA package make it suitable for space‑constrained systems operating in demanding conditions.
This device is well suited for engineers seeking an integrated microprocessor solution that reduces BOM count, supports multiple I/O modalities, and includes on‑chip security features—delivering a stable platform for connected HMIs, industrial controllers, and secure edge devices.
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