OMAP5910JGDY2
| Part Description |
ARM9TDMI Microprocessor IC OMAP-59xx 1 Core, 32-Bit 150MHz 289-BGA (19x19) |
|---|---|
| Quantity | 326 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | OMAP5910 |
| Manufacturer | Texas Instruments |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Signal Processing; C55x, System Control; CP15 | Core Processor | ARM9TDMI | Device Package | 289-BGA (19x19) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | Keypad, LCD | ECCN | 3A991A2 | Grade | Industrial | ||
| Graphics Acceleration | No | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 85°C (TC) | Package / Case | 289-BGA | RAM Controllers | SDRAM | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Speed | 150MHz | ||
| Supplier Device Package | 289-BGA (19×19) | USB | USB 2.0 (2) | Voltage – I/O | 1.8V, 2.75V, 3.3V |
Overview of OMAP5910JGDY2 – IC MPU OMAP-59XX 150MHz 289-BGA
The OMAP5910JGDY2 is a Texas Instruments microprocessor IC featuring an ARM9TDMI 32-bit core running at 150 MHz, packaged in a 289-ball BGA (19 × 19) for surface-mount applications. Designed for embedded and industrial applications, the device integrates memory controller, communications interfaces and security features to support connected, industrial-grade embedded systems.
Key Features
- Core The device uses an ARM9TDMI core with 32-bit operation at 150 MHz, delivering compute capability appropriate for control and embedded processing tasks.
- Co-processors Includes signal-processing co-processor support (C55x) and a system control co-processor (CP15) to assist specialized processing and system management.
- Memory Built-in SDRAM controller support simplifies external memory interfacing for system memory requirements.
- Display and User I/O Integrated display interface controllers for keypad and LCD provide direct support for basic human-machine interfaces.
- Connectivity Single 10/100 Mbps Ethernet interface and two USB 2.0 ports enable wired network and peripheral connectivity.
- Security On-chip cryptography and a hardware random number generator provide foundation-level security capabilities for embedded applications.
- Package and Mounting Supplied in a 289-BGA (19 × 19) package for surface-mount assembly, enabling compact board layouts.
- Environmental and Grade Industrial-grade device rated for operation from -40 °C to 85 °C and RoHS compliant for regulated manufacturing.
- Additional Interfaces Includes 1-Wire/HDQ support for simple sensor and low-pin-count peripheral interfacing.
Typical Applications
- Industrial Control Embedded controllers and automation nodes that require Ethernet connectivity, USB peripherals, and industrial temperature operation.
- Human‑Machine Interfaces (HMI) Keypad and LCD interface support for operator panels and local device control displays.
- Embedded Communication Gateways Devices that bridge local peripherals to networks using the integrated 10/100 Ethernet and USB 2.0 ports.
- Secure Embedded Systems Applications that require hardware cryptography and random number generation for device authentication or secure communications.
Unique Advantages
- Integrated connectivity On-chip Ethernet and dual USB 2.0 ports reduce external interface components and simplify board-level design.
- Security-ready Built-in cryptography and a random number generator enable foundational security functions without separate security ICs.
- Industrial temperature range Specified operation from -40 °C to 85 °C supports deployment in varied industrial environments.
- Compact BGA package The 289-BGA (19 × 19) package enables a higher-density layout for space-constrained embedded systems.
- Memory interface SDRAM controller integration streamlines external memory connections and reduces BOM complexity.
- Surface-mount ready Designed for standard surface-mount manufacturing processes to support volume assembly.
Why Choose OMAP5910JGDY2?
The OMAP5910JGDY2 combines a 150 MHz ARM9TDMI core with integrated communications, memory controller, display interfaces, and hardware security to deliver a compact, industrial-grade solution for embedded systems. Its combination of Ethernet, USB, keypad/LCD support and security features makes it well suited for industrial control, HMI and connected embedded gateway designs that require robust operation across a wide temperature range.
Supplied by Texas Instruments and backed by product documentation, the OMAP5910JGDY2 offers a balance of integration and reliability for designs that prioritize connectivity, security, and industrial temperature performance.
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