OMAP5912GDYAR

PROTOTYPE
Part Description

ARM926EJ-S Microprocessor IC OMAP-59xx 1 Core, 32-Bit 192MHz 289-BGA (19x19)

Quantity 3 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesOMAP5910
ManufacturerTexas Instruments
Manufacturing StatusActive
Manufacturer Standard Lead Time6 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPSignal Processing; C55x, System Control; CP15Core ProcessorARM926EJ-SDevice Package289-BGA (19x19)
Display & Interface ControllersKeyboard, LCDECCNN/AEthernet10/100Mbps (1)
GradeIndustrialGraphics AccelerationNoHTS CodeN/A
Moisture Sensitivity LevelN/AMounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 85°C (TC)Package / Case289-BGA
RAM ControllersLPDDRREACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesCryptography, Random Number GeneratorSpeed192MHzSupplier Device Package289-BGA (19×19)
USBUSB 1.1 (1), USB 1.x (2)Voltage – I/O1.8V, 2.75V, 3.3V

Overview of OMAP5912GDYAR – PROTOTYPE

The OMAP5912GDYAR is a Texas Instruments OMAP-59xx series applications processor based on a single ARM926EJ-S 32‑bit core running at 192 MHz. Designed for embedded and industrial applications, the device integrates on-chip interfaces and controllers to support networking, USB peripherals, display input and LPDDR memory.

With integrated cryptography and a hardware random number generator alongside signal-processing and system-control coprocessors, the OMAP5912GDYAR is targeted at embedded designs that require moderate processing performance with communications and security features in a compact BGA package.

Key Features

  • Core ARM926EJ-S 32‑bit processor core, single-core operation at 192 MHz for deterministic embedded processing.
  • Co‑processors Dedicated signal-processing coprocessor (C55x) and system control coprocessor (CP15) to offload specialized tasks.
  • Memory Interface LPDDR memory controller support to interface with low-power DDR memory devices.
  • Communications Interfaces Integrated 10/100 Mbps Ethernet (1 port) and multiple USB ports (USB 1.1 and USB 1.x) for networking and peripheral connectivity.
  • Display and Input On-chip display interface controllers for LCD and keyboard support to enable human‑machine interfaces.
  • Security On-chip cryptography and a hardware random number generator to support secure functions.
  • Package and Mounting 289‑ball BGA package (19 × 19 mm) in a surface-mount form factor suitable for compact system assemblies.
  • Industrial Grade Rated for an operating temperature range of −40 °C to 85 °C for industrial environments.
  • Additional Interfaces 1‑Wire/HDQ interface for simple serial peripheral connections and sensor networks.
  • Datasheet and Package Notes The OMAP-59xx documentation notes the 289-ball GDY package and provides package-specific guidance, including special consideration for the VSS pin connection related to the 32‑kHz oscillator and input clock, and slew-time constraints: EXT_DMA_REQ0/1 signals must meet a ≤10 ns (10% to 90% DVDD) slew-time constraint in Mode 1.
  • RoHS Compliance Device is RoHS compliant.

Typical Applications

  • Industrial Embedded Systems Embedded controllers and industrial appliances that require an industrial temperature‑rated processor with integrated I/O and memory interfaces.
  • Networking and Connectivity Products that need 10/100 Mbps Ethernet and USB connectivity for data transfer, device management, or peripheral interfaces.
  • Human‑Machine Interfaces Systems with LCD displays and keyboards where on‑chip display/input controllers simplify HMI design.
  • Secure Embedded Devices Designs requiring on‑device cryptography and a hardware RNG for secure boot or secure communications.

Unique Advantages

  • Integrated communications suite: Built‑in Ethernet and multiple USB interfaces reduce external component count and simplify board-level design.
  • Industrial temperature rating: −40 °C to 85 °C operation supports deployments in harsh or temperature‑variable environments.
  • On‑chip security: Cryptography and a hardware random number generator provide hardware-level building blocks for secure systems.
  • Compact BGA package: 289‑ball (19×19) BGA enables high‑density, surface‑mount assemblies while preserving extensive I/O.
  • Specialized coprocessors: Dedicated signal‑processing and system control coprocessors offload workload from the main ARM core for efficient task partitioning.
  • Design and package guidance: Datasheet includes package‑specific notes (VSS/32‑kHz oscillator considerations and EXT_DMA_REQ slew‑time constraints) to support robust hardware implementation.

Why Choose OMAP5912GDYAR?

The OMAP5912GDYAR pairs a reliable ARM926EJ-S core at 192 MHz with integrated communications, security, and memory interfaces tailored for embedded and industrial applications. Its combination of on‑chip Ethernet, USB, LPDDR support and security primitives offers a compact, functional platform for designs that need deterministic processing with built‑in connectivity and secure features.

Backed by Texas Instruments OMAP-59xx series documentation and package guidance, the OMAP5912GDYAR is suited for engineers designing industrial embedded products that require robust temperature performance, integrated peripherals and explicit hardware-level design considerations.

Request a quote or submit an inquiry for availability and pricing for the OMAP5912GDYAR to evaluate fit for your next embedded design.

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