Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
5AGTFD7K3F40I5
5AGTFD7K3F40I5IntelIC FPGA 704 I/O 1517FBGAFPGAs1517-FBGA (40x40)1.07V ~ 1.13V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
23780
Number of Logic Elements/Cells:
504000
Total RAM Bits:
27695104
Number of I/O:
704
Voltage – Supply:
1.07V ~ 1.13V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
1517-BBGA
Supplier Device Package:
1517-FBGA (40×40)
412
5AGTFD7K3F40I5G5AGTFD7K3F40I5GIntelIC FPGA 342 I/O 1517FBGAFPGAs1517-FBGA, FC (40x40)820 mV - 880 mV-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
342
Number of LABs/CLBs:
23773
Number of Logic Elements/Cells:
504000
Qualification:
N/A
Total RAM Bits:
27695104
957
5AGTFD7K3F40I5N
5AGTFD7K3F40I5NIntelIC FPGA 704 I/O 1517FBGAFPGAs1517-FBGA (40x40)1.07V ~ 1.13V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
23780
Number of Logic Elements/Cells:
504000
Total RAM Bits:
27695104
Number of I/O:
704
Voltage – Supply:
1.07V ~ 1.13V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
1517-BBGA
Supplier Device Package:
1517-FBGA (40×40)
190
N/AN/A5AGTMC3D3F27I3GIntelIC FPGA 336 I/O 672FBGAFPGAs672-FBGA (27x27)1.12V ~ 1.18V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
7362
Number of Logic Elements/Cells:
156000
Total RAM Bits:
11746304
Number of I/O:
336
Voltage – Supply:
1.12V ~ 1.18V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
672-BBGA, FCBGA
Supplier Device Package:
672-FBGA (27×27)
1,243
5AGTMC3D3F27I3N5AGTMC3D3F27I3NIntelIC FPGA 336 I/O 672FBGAFPGAs672-FBGA (27x27)1.12 V - 1.18 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
336
Number of LABs/CLBs:
7362
Number of Logic Elements/Cells:
156000
Qualification:
N/A
Total RAM Bits:
11746304
829
N/AN/A5AGTMC3D3F27I5GIntelIC FPGA 336 I/O 672FBGAFPGAs672-FBGA (27x27)1.07V ~ 1.13V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
7362
Number of Logic Elements/Cells:
156000
Total RAM Bits:
11746304
Number of I/O:
336
Voltage – Supply:
1.07V ~ 1.13V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
672-BBGA, FCBGA
Supplier Device Package:
672-FBGA (27×27)
1,863
5AGTMC3D3F27I5N5AGTMC3D3F27I5NIntelIC FPGA 336 I/O 672FBGAFPGAs672-FBGA (27x27)1.07 V - 1.13 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
336
Number of LABs/CLBs:
7362
Number of Logic Elements/Cells:
156000
Qualification:
N/A
Total RAM Bits:
11746304
773
5AGTMC3D3F31I3GN/A5AGTMC3D3F31I3GIntelIC FPGA 416 I/O 896FBGAFPGAs896-FBGA (31x31)1.12V ~ 1.18V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
7362
Number of Logic Elements/Cells:
156000
Total RAM Bits:
11746304
Number of I/O:
416
Voltage – Supply:
1.12V ~ 1.18V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
896-BBGA, FCBGA
Supplier Device Package:
896-FBGA (31×31)
581
5AGTMC3D3F31I3N
5AGTMC3D3F31I3NIntelIC FPGA 416 I/O 896FBGAFPGAs896-FBGA (31x31)1.12V ~ 1.18V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
7362
Number of Logic Elements/Cells:
156000
Total RAM Bits:
11746304
Number of I/O:
416
Voltage – Supply:
1.12V ~ 1.18V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
896-BBGA, FCBGA
Supplier Device Package:
896-FBGA (31×31)
1,003
5AGTMC3D3F31I5GN/A5AGTMC3D3F31I5GIntelIC FPGA 416 I/O 896FBGAFPGAs896-FBGA (31x31)1.07V ~ 1.13V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
7362
Number of Logic Elements/Cells:
156000
Total RAM Bits:
11746304
Number of I/O:
416
Voltage – Supply:
1.07V ~ 1.13V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
896-BBGA, FCBGA
Supplier Device Package:
896-FBGA (31×31)
1,623
5AGTMC3D3F31I5N
5AGTMC3D3F31I5NIntelIC FPGA 416 I/O 896FBGAFPGAs896-FBGA (31x31)1.07V ~ 1.13V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
7362
Number of Logic Elements/Cells:
156000
Total RAM Bits:
11746304
Number of I/O:
416
Voltage – Supply:
1.07V ~ 1.13V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
896-BBGA, FCBGA
Supplier Device Package:
896-FBGA (31×31)
857
5AGTMC7G3F31I3GN/A5AGTMC7G3F31I3GIntelIC FPGA 384 I/O 896FBGAFPGAs896-FBGA (31x31)1.12V ~ 1.18V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
11460
Number of Logic Elements/Cells:
242000
Total RAM Bits:
15470592
Number of I/O:
384
Voltage – Supply:
1.12V ~ 1.18V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
896-BBGA, FCBGA
Supplier Device Package:
896-FBGA (31×31)
219
5AGTMC7G3F31I3N
5AGTMC7G3F31I3NIntelIC FPGA 384 I/O 896FBGAFPGAs896-FBGA (31x31)1.12V ~ 1.18V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
11460
Number of Logic Elements/Cells:
242000
Total RAM Bits:
15470592
Number of I/O:
384
Voltage – Supply:
1.12V ~ 1.18V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
896-BBGA, FCBGA
Supplier Device Package:
896-FBGA (31×31)
846
5AGTMC7G3F31I5GN/A5AGTMC7G3F31I5GIntelIC FPGA 384 I/O 896FBGAFPGAs896-FBGA (31x31)1.07V ~ 1.13V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
11460
Number of Logic Elements/Cells:
242000
Total RAM Bits:
15470592
Number of I/O:
384
Voltage – Supply:
1.07V ~ 1.13V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
896-BBGA, FCBGA
Supplier Device Package:
896-FBGA (31×31)
1,828
5AGTMC7G3F31I5N5AGTMC7G3F31I5NIntelIC FPGA 384 I/O 896FBGAFPGAs896-FBGA (31x31)1.07 V - 1.13 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
384
Number of LABs/CLBs:
11460
Number of Logic Elements/Cells:
242000
Qualification:
N/A
Total RAM Bits:
15470592
1,712
5AGTMD3G3F31I3GN/A5AGTMD3G3F31I3GIntelIC FPGA 384 I/O 896FBGAFPGAs896-FBGA (31x31)1.12V ~ 1.18V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
17110
Number of Logic Elements/Cells:
362000
Total RAM Bits:
19822592
Number of I/O:
384
Voltage – Supply:
1.12V ~ 1.18V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
896-BBGA, FCBGA
Supplier Device Package:
896-FBGA (31×31)
122
5AGTMD3G3F31I3N5AGTMD3G3F31I3NIntelIC FPGA 384 I/O 896FBGAFPGAs896-FBGA (31x31)1.12 V - 1.18 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
384
Number of LABs/CLBs:
17110
Number of Logic Elements/Cells:
242000
Qualification:
N/A
Total RAM Bits:
19822592
558
5AGTMD3G3F31I3NAAN/A5AGTMD3G3F31I3NAAIntelIC FPGA 384 I/O 896FBGAFPGAs896-FBGA (31x31)1.12V ~ 1.18V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
17110
Number of Logic Elements/Cells:
362000
Total RAM Bits:
19822592
Number of I/O:
384
Voltage – Supply:
1.12V ~ 1.18V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
896-BBGA, FCBGA
Supplier Device Package:
896-FBGA (31×31)
1,166
5AGTMD3G3F31I3NABN/A5AGTMD3G3F31I3NABIntelIC FPGA 384 I/O 896FBGAFPGAs896-FBGA (31x31)1.12V ~ 1.18V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
17110
Number of Logic Elements/Cells:
362000
Total RAM Bits:
19822592
Number of I/O:
384
Voltage – Supply:
1.12V ~ 1.18V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
896-BBGA, FCBGA
Supplier Device Package:
896-FBGA (31×31)
298
5AGTMD3G3F31I5GN/A5AGTMD3G3F31I5GIntelIC FPGA 384 I/O 896FBGAFPGAs896-FBGA (31x31)1.07V ~ 1.13V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
17110
Number of Logic Elements/Cells:
362000
Total RAM Bits:
19822592
Number of I/O:
384
Voltage – Supply:
1.07V ~ 1.13V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
896-BBGA, FCBGA
Supplier Device Package:
896-FBGA (31×31)
21

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