Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
5AGXMB1G4F35I5G5AGXMB1G4F35I5GIntelIC FPGA 544 I/O 1152FBGAFPGAs1152-FBGA (35x35)1.07 V - 1.13 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
544
Number of LABs/CLBs:
14151
Number of Logic Elements/Cells:
300000
Qualification:
N/A
Total RAM Bits:
17358848
142
5AGXMB1G4F35I5N5AGXMB1G4F35I5NIntelIC FPGA 544 I/O 1152FBGAFPGAs1152-FBGA (35x35)1.07 V - 1.13 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
544
Number of LABs/CLBs:
14151
Number of Logic Elements/Cells:
300000
Qualification:
N/A
Total RAM Bits:
17358848
725
5AGXMB1G4F40C4GN/A5AGXMB1G4F40C4GIntelIC FPGA 704 I/O 1517FBGAFPGAs1517-FBGA, FC (40x40)1.07V ~ 1.13V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
14151
Number of Logic Elements/Cells:
300000
Total RAM Bits:
17358848
Number of I/O:
704
Voltage – Supply:
1.07V ~ 1.13V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
1517-BBGA, FCBGA
Supplier Device Package:
1517-FBGA, FC (40×40)
1,071
5AGXMB1G4F40C4N
5AGXMB1G4F40C4NIntelIC FPGA 704 I/O 1517FBGAFPGAs1517-FBGA (40x40)1.07V ~ 1.13V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
14151
Number of Logic Elements/Cells:
300000
Total RAM Bits:
17358848
Number of I/O:
704
Voltage – Supply:
1.07V ~ 1.13V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
1517-BBGA
Supplier Device Package:
1517-FBGA (40×40)
84
5AGXMB1G4F40C5GN/A5AGXMB1G4F40C5GIntelIC FPGA 704 I/O 1517FBGAFPGAs1517-FBGA, FC (40x40)1.07 V - 1.13 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
704
Number of LABs/CLBs:
14151
Number of Logic Elements/Cells:
300000
Qualification:
N/A
Total RAM Bits:
17358848
1,033
5AGXMB1G4F40C5N
5AGXMB1G4F40C5NIntelIC FPGA 704 I/O 1517FBGAFPGAs1517-FBGA (40x40)1.07V ~ 1.13V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
14151
Number of Logic Elements/Cells:
300000
Total RAM Bits:
17358848
Number of I/O:
704
Voltage – Supply:
1.07V ~ 1.13V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
1517-BBGA
Supplier Device Package:
1517-FBGA (40×40)
1,242
5AGXMB1G4F40I5GN/A5AGXMB1G4F40I5GIntelIC FPGA 704 I/O 1517FBGAFPGAs1517-FBGA, FC (40x40)1.07V ~ 1.13V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
14151
Number of Logic Elements/Cells:
300000
Total RAM Bits:
17358848
Number of I/O:
704
Voltage – Supply:
1.07V ~ 1.13V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
1517-BBGA, FCBGA
Supplier Device Package:
1517-FBGA, FC (40×40)
648
5AGXMB1G4F40I5N
5AGXMB1G4F40I5NIntelIC FPGA 704 I/O 1517FBGAFPGAs1517-FBGA (40x40)1.07V ~ 1.13V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
14151
Number of Logic Elements/Cells:
300000
Total RAM Bits:
17358848
Number of I/O:
704
Voltage – Supply:
1.07V ~ 1.13V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
1517-BBGA
Supplier Device Package:
1517-FBGA (40×40)
778
5AGXMB1G6F31C6G5AGXMB1G6F31C6GIntelIC FPGA 384 I/O 896FBGAFPGAs896-FBGA (31x31)1.07 V - 1.13 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
384
Number of LABs/CLBs:
14151
Number of Logic Elements/Cells:
300000
Qualification:
N/A
Total RAM Bits:
17358848
331
5AGXMB1G6F31C6N5AGXMB1G6F31C6NIntelIC FPGA 384 I/O 896FBGAFPGAs896-FBGA (31x31)1.07 V - 1.13 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
384
Number of LABs/CLBs:
14151
Number of Logic Elements/Cells:
300000
Qualification:
N/A
Total RAM Bits:
17358848
507
5AGXMB1G6F35C6GN/A5AGXMB1G6F35C6GIntelIC FPGA 544 I/O 1152FBGAFPGAs1152-FBGA, FC (35x35)1.07V ~ 1.13V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
14151
Number of Logic Elements/Cells:
300000
Total RAM Bits:
17358848
Number of I/O:
544
Voltage – Supply:
1.07V ~ 1.13V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
1152-BBGA, FCBGA
Supplier Device Package:
1152-FBGA, FC (35×35)
253
5AGXMB1G6F35C6N
5AGXMB1G6F35C6NIntelIC FPGA 544 I/O 1152FBGAFPGAs1152-FBGA (35x35)1.07V ~ 1.13V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
14151
Number of Logic Elements/Cells:
300000
Total RAM Bits:
17358848
Number of I/O:
544
Voltage – Supply:
1.07V ~ 1.13V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
1152-BBGA, FCBGA Exposed Pad
Supplier Device Package:
1152-FBGA (35×35)
1,175
5AGXMB1G6F40C6GN/A5AGXMB1G6F40C6GIntelIC FPGA 704 I/O 1517FBGAFPGAs1517-FBGA, FC (40x40)1.07V ~ 1.13V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
14151
Number of Logic Elements/Cells:
300000
Total RAM Bits:
17358848
Number of I/O:
704
Voltage – Supply:
1.07V ~ 1.13V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
1517-BBGA, FCBGA
Supplier Device Package:
1517-FBGA, FC (40×40)
949
5AGXMB1G6F40C6N
5AGXMB1G6F40C6NIntelIC FPGA 704 I/O 1517FBGAFPGAs1517-FBGA (40x40)1.07V ~ 1.13V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
14151
Number of Logic Elements/Cells:
300000
Total RAM Bits:
17358848
Number of I/O:
704
Voltage – Supply:
1.07V ~ 1.13V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
1517-BBGA
Supplier Device Package:
1517-FBGA (40×40)
1,724
5AGXMB3G4F31C4GN/A5AGXMB3G4F31C4GIntelIC FPGA 384 I/O 896FBGAFPGAs896-FBGA (31x31)1.07V ~ 1.13V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
17110
Number of Logic Elements/Cells:
362000
Total RAM Bits:
19822592
Number of I/O:
384
Voltage – Supply:
1.07V ~ 1.13V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
896-BBGA, FCBGA
Supplier Device Package:
896-FBGA (31×31)
1,278
5AGXMB3G4F31C4N5AGXMB3G4F31C4NIntelIC FPGA 384 I/O 896FBGAFPGAs896-FBGA (31x31)1.07 V - 1.13 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
384
Number of LABs/CLBs:
17110
Number of Logic Elements/Cells:
362000
Qualification:
N/A
Total RAM Bits:
19822592
588
5AGXMB3G4F31C5GN/A5AGXMB3G4F31C5GIntelIC FPGA 384 I/O 896FBGAFPGAs896-FBGA (31x31)1.07V ~ 1.13V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
17110
Number of Logic Elements/Cells:
362000
Total RAM Bits:
19822592
Number of I/O:
384
Voltage – Supply:
1.07V ~ 1.13V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
896-BBGA, FCBGA
Supplier Device Package:
896-FBGA (31×31)
535
5AGXMB3G4F31C5N
5AGXMB3G4F31C5NIntelIC FPGA 384 I/O 896FBGAFPGAs896-FBGA (31x31)1.07V ~ 1.13V0°C ~ 85°C (TJ)
Number of LABs/CLBs:
17110
Number of Logic Elements/Cells:
362000
Total RAM Bits:
19822592
Number of I/O:
384
Voltage – Supply:
1.07V ~ 1.13V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
896-BBGA, FCBGA
Supplier Device Package:
896-FBGA (31×31)
1,153
5AGXMB3G4F31I3GN/A5AGXMB3G4F31I3GIntelIC FPGA 384 I/O 896FBGAFPGAs896-FBGA (31x31)1.12V ~ 1.18V-40°C ~ 100°C (TJ)
Number of LABs/CLBs:
17110
Number of Logic Elements/Cells:
362000
Total RAM Bits:
19822592
Number of I/O:
384
Voltage – Supply:
1.12V ~ 1.18V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
896-BBGA, FCBGA
Supplier Device Package:
896-FBGA (31×31)
1,135
5AGXMB3G4F31I3N5AGXMB3G4F31I3NIntelIC FPGA 384 I/O 896FBGAFPGAs896-FBGA (31x31)1.12 V - 1.18 V-40°C – 100°C
Grade:
Industrial
Number of Gates:
N/A
Number of I/O:
384
Number of LABs/CLBs:
17110
Number of Logic Elements/Cells:
362000
Qualification:
N/A
Total RAM Bits:
19822592
1,491

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