 | | MPC862PCZQ80B | NXP Semiconductors | IC MPU MPC8XX 80MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | 3.3V | -40°C – 115°C | Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 1 | |
 | | MPC862PVR100B | NXP Semiconductors | IC MPU MPC8XX 100MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 105°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Ethernet: 10Mbps (4), 10/100Mbps (1) Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 431 | |
 | | MPC862PVR66B | NXP Semiconductors | IC MPU MPC8XX 66MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 105°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Ethernet: 10Mbps (4), 10/100Mbps (1) Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 1,761 | |
 | | MPC862PZQ100B | NXP Semiconductors | IC MPU MPC8XX 100MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 105°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Ethernet: 10Mbps (4), 10/100Mbps (1) Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 1,178 | |
 | | MPC862TCVR80B | NXP Semiconductors | IC MPU MPC8XX 80MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | -40°C ~ 115°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Ethernet: 10Mbps (4), 10/100Mbps (1) Operating Temperature: -40°C ~ 115°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 744 | |
 | | MPC862TZQ100B | NXP Semiconductors | IC MPU MPC8XX 100MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 105°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Ethernet: 10Mbps (4), 10/100Mbps (1) Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 820 | |
 | | MPC866PCVR100A | NXP Semiconductors | IC MPU MPC8XX 100MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | -40°C ~ 100°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Ethernet: 10Mbps (4), 10/100Mbps (1) Operating Temperature: -40°C ~ 100°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 96 | |
 | | MPC866PCZP100A | NXP Semiconductors | IC MPU MPC8XX 100MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | -40°C ~ 100°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Ethernet: 10Mbps (4), 10/100Mbps (1) Operating Temperature: -40°C ~ 100°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 722 | |
 | | MPC866PVR100A | NXP Semiconductors | IC MPU MPC8XX 100MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Ethernet: 10Mbps (4), 10/100Mbps (1) Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 615 | |
 | | MPC866PVR133A | NXP Semiconductors | IC MPU MPC8XX 133MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Ethernet: 10Mbps (4), 10/100Mbps (1) Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 487 | |
 | | MPC866PZP100A | NXP Semiconductors | IC MPU MPC8XX 100MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Ethernet: 10Mbps (4), 10/100Mbps (1) Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 516 | |
 | | MPC866PZP133A | NXP Semiconductors | IC MPU MPC8XX 133MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Ethernet: 10Mbps (4), 10/100Mbps (1) Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 893 | |
 | | MPC866TCVR100A | NXP Semiconductors | IC MPU MPC8XX 100MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | -40°C ~ 100°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Ethernet: 10Mbps (4), 10/100Mbps (1) Operating Temperature: -40°C ~ 100°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 1,254 | |
 | | MPC866TCZP100A | NXP Semiconductors | IC MPU MPC8XX 100MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | -40°C ~ 100°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Ethernet: 10Mbps (4), 10/100Mbps (1) Operating Temperature: -40°C ~ 100°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 1,787 | |
 | | MPC866TVR100A | NXP Semiconductors | IC MPU MPC8XX 100MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Ethernet: 10Mbps (4), 10/100Mbps (1) Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 1,491 | |
 | | MPC866TVR133A | NXP Semiconductors | IC MPU MPC8XX 133MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Ethernet: 10Mbps (4), 10/100Mbps (1) Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 966 | |
 | | MPC866TZP100A | NXP Semiconductors | IC MPU MPC8XX 100MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Ethernet: 10Mbps (4), 10/100Mbps (1) Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 190 | |
 | | MPC866TZP133A | NXP Semiconductors | IC MPU MPC8XX 133MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Ethernet: 10Mbps (4), 10/100Mbps (1) Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 1,074 | |
 | | MPC870CVR133 | NXP Semiconductors | IC MPU MPC8XX 133MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | -40°C ~ 100°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: -40°C ~ 100°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 924 | |
 | | MPC870CVR66 | NXP Semiconductors | IC MPU MPC8XX 66MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | -40°C ~ 100°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: -40°C ~ 100°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 241 | |