 | | MPC870CZT133 | NXP Semiconductors | IC MPU MPC8XX 133MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | -40°C ~ 100°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: -40°C ~ 100°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 1 | |
 | | MPC870VR133 | NXP Semiconductors | IC MPU MPC8XX 133MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 649 | |
 | | MPC870VR66 | NXP Semiconductors | IC MPU MPC8XX 66MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 567 | |
 | | MPC870VR80 | NXP Semiconductors | IC MPU MPC8XX 80MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 442 | |
 | | MPC870ZT133 | NXP Semiconductors | IC MPU MPC8XX 133MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 451 | |
 | | MPC870ZT66 | NXP Semiconductors | IC MPU MPC8XX 66MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 1,416 | |
 | | MPC875CVR133 | NXP Semiconductors | IC MPU MPC8XX 133MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | -40°C ~ 100°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM, Security; SEC Ethernet: 10Mbps (1), 10/100Mbps (2) Operating Temperature: -40°C ~ 100°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 1,331 | |
 | | MPC875CVR66 | NXP Semiconductors | IC MPU MPC8XX 66MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | -40°C ~ 100°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM, Security; SEC Ethernet: 10Mbps (1), 10/100Mbps (2) Operating Temperature: -40°C ~ 100°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 443 | |
 | | MPC875CZT133 | NXP Semiconductors | IC MPU MPC8XX 133MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | -40°C ~ 100°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM, Security; SEC Ethernet: 10Mbps (1), 10/100Mbps (2) Operating Temperature: -40°C ~ 100°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 1,605 | |
 | | MPC875CZT66 | NXP Semiconductors | IC MPU MPC8XX 66MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | -40°C ~ 100°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM, Security; SEC Ethernet: 10Mbps (1), 10/100Mbps (2) Operating Temperature: -40°C ~ 100°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 915 | |
 | | MPC875VR133 | NXP Semiconductors | IC MPU MPC8XX 133MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM, Security; SEC Ethernet: 10Mbps (1), 10/100Mbps (2) Operating Temperature: 0°C ~ 95°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 1,420 | |
 | | MPC875VR66 | NXP Semiconductors | IC MPU MPC8XX 66MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM, Security; SEC Ethernet: 10Mbps (1), 10/100Mbps (2) Operating Temperature: 0°C ~ 95°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 341 | |
 | | MPC875VR66-NXP | NXP Semiconductors | IC MPU 66MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM, Security; SEC Ethernet: 10Mbps (1), 10/100Mbps (2) Operating Temperature: 0°C ~ 95°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 183 | |
 | | MPC875VR80 | NXP Semiconductors | IC MPU MPC8XX 80MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM, Security; SEC Ethernet: 10Mbps (1), 10/100Mbps (2) Operating Temperature: 0°C ~ 95°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 1,429 | |
 | | MPC875ZT133 | NXP Semiconductors | IC MPU MPC8XX 133MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM, Security; SEC Ethernet: 10Mbps (1), 10/100Mbps (2) Operating Temperature: 0°C ~ 95°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 112 | |
 | | MPC875ZT66 | NXP Semiconductors | IC MPU MPC8XX 66MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM, Security; SEC Ethernet: 10Mbps (1), 10/100Mbps (2) Operating Temperature: 0°C ~ 95°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) | 93 | |
 | | MPC880CVR133 | NXP Semiconductors | IC MPU MPC8XX 133MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | -40°C ~ 100°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Ethernet: 10Mbps (2), 10/100Mbps (2) Operating Temperature: -40°C ~ 100°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 1,103 | |
 | | MPC880CVR133-NXP | NXP Semiconductors | POWERQUICC 32 BIT POWER ARCHITEC | Microprocessors | 357-PBGA (25x25) | N/A | -40°C ~ 100°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Ethernet: 10Mbps (2), 10/100Mbps (2) Operating Temperature: -40°C ~ 100°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 1,563 | |
 | | MPC880CVR66 | NXP Semiconductors | IC MPU MPC8XX 66MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | -40°C ~ 100°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Ethernet: 10Mbps (2), 10/100Mbps (2) Operating Temperature: -40°C ~ 100°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 180 | |
 | | MPC880VR133 | NXP Semiconductors | IC MPU MPC8XX 133MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Ethernet: 10Mbps (2), 10/100Mbps (2) Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 1,004 | |