 | | MPC880VR66 | NXP Semiconductors | IC MPU MPC8XX 66MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Ethernet: 10Mbps (2), 10/100Mbps (2) Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 1,030 | |
 | | MPC880VR80 | NXP Semiconductors | IC MPU MPC8XX 80MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Ethernet: 10Mbps (2), 10/100Mbps (2) Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 507 | |
 | | MPC880ZP133 | NXP Semiconductors | IC MPU MPC8XX 133MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Ethernet: 10Mbps (2), 10/100Mbps (2) Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 1,166 | |
 | | MPC880ZP66 | NXP Semiconductors | IC MPU MPC8XX 66MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Ethernet: 10Mbps (2), 10/100Mbps (2) Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 1,686 | |
 | | MPC885CVR133 | NXP Semiconductors | IC MPU MPC8XX 133MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | -40°C ~ 100°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM, Security; SEC Ethernet: 10Mbps (3), 10/100Mbps (2) Operating Temperature: -40°C ~ 100°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 655 | |
 | | MPC885CVR66 | NXP Semiconductors | IC MPU MPC8XX 66MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | -40°C ~ 100°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM, Security; SEC Ethernet: 10Mbps (3), 10/100Mbps (2) Operating Temperature: -40°C ~ 100°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 539 | |
 | | MPC885CZP133 | NXP Semiconductors | IC MPU MPC8XX 133MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | -40°C ~ 100°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM, Security; SEC Ethernet: 10Mbps (3), 10/100Mbps (2) Operating Temperature: -40°C ~ 100°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 867 | |
 | | MPC885CZP66 | NXP Semiconductors | IC MPU MPC8XX 66MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | -40°C ~ 100°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM, Security; SEC Ethernet: 10Mbps (3), 10/100Mbps (2) Operating Temperature: -40°C ~ 100°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 560 | |
 | | MPC885VR133 | NXP Semiconductors | IC MPU MPC8XX 133MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM, Security; SEC Ethernet: 10Mbps (3), 10/100Mbps (2) Operating Temperature: 0°C ~ 95°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 107 | |
 | | MPC885VR66 | NXP Semiconductors | IC MPU MPC8XX 66MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM, Security; SEC Ethernet: 10Mbps (3), 10/100Mbps (2) Operating Temperature: 0°C ~ 95°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 1,015 | |
 | | MPC885VR66-NXP | NXP Semiconductors | IC MPU MPC8XX 66MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM, Security; SEC Ethernet: 10Mbps (3), 10/100Mbps (2) Operating Temperature: 0°C ~ 95°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 988 | |
 | | MPC885VR80 | NXP Semiconductors | IC MPU MPC8XX 80MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM, Security; SEC Ethernet: 10Mbps (3), 10/100Mbps (2) Operating Temperature: 0°C ~ 95°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 86 | |
 | | MPC885ZP133 | NXP Semiconductors | IC MPU MPC8XX 133MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM, Security; SEC Ethernet: 10Mbps (3), 10/100Mbps (2) Operating Temperature: 0°C ~ 95°C (TA) Security Features: Cryptography Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 710 | |
| N/A | N/A | MPD23749DREP | Texas Instruments | IC QUAD DIFF LINE DVR 16-SOIC | Drivers, Receivers, Transceivers | - | N/A | N/A | N/A | 547 | |
| N/A | N/A | MPD23752DREP | Texas Instruments | IC QUAD DIFF LINE DVR 16-SOIC | Drivers, Receivers, Transceivers | - | N/A | N/A | N/A | 749 | |
 | N/A | MPD23796ZQWT | Texas Instruments | IC MCU | Microcontrollers | N/A | N/A | N/A | N/A | 996 | |
 | | MPF050T-1FCSG325E | Microchip Technology | MPF050T-1FCSG325E | FPGAs | 325-BGA (11x11) | 970 mV - 1.08 V | 0°C – 100°C | Number of LABs/CLBs: 48000 Number of Logic Elements/Cells: 3774874 | 688 | |
 | | MPF050T-1FCSG325I | Microchip Technology | MPF050T-1FCSG325I | FPGAs | 325-BGA (11x11) | 970 mV - 1.08 V | -40°C – 100°C | Number of LABs/CLBs: 48000 Number of Logic Elements/Cells: 3774874 | 485 | |
 | | MPF050T-1FCSG325T2 | Microchip Technology | MPF050T-1FCSG325T2 | FPGAs | 325-BGA (11x11) | 970 mV - 1.08 V | -40°C – 125°C | Number of LABs/CLBs: 48000 Number of Logic Elements/Cells: 48000 | 488 | |
 | | MPF050T-1FCVG484E | Microchip Technology | MPF050T-1FCVG484E | FPGAs | 484-FBGA (19x19) | 970 mV - 1.08 V | 0°C – 100°C | Number of LABs/CLBs: 48000 Number of Logic Elements/Cells: 3774874 | 456 | |