Microprocessors

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Total Products: 5,357
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Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MPC8560CPX667JB
MPC8560CPX667JBNXP SemiconductorsIC MPU MPC85XX 667MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
667MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
783-BFBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
Additional Interfaces:
I2C, PCI, RapidIO, SPI, TDM, UART
656
MPC8560CVT667JB
MPC8560CVT667JBNXP SemiconductorsIC MPU MPC85XX 667MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
667MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
783-BFBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
Additional Interfaces:
I2C, PCI, RapidIO, SPI, TDM, UART
1,053
MPC8560CVT667JC
MPC8560CVT667JCNXP SemiconductorsIC MPU MPC85XX 667MHZ 783FCBGAMicroprocessors783-FCBGA (29x29)2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
667MHz
Mounting Type:
Surface Mount
59
MPC8560PX667LC
MPC8560PX667LCNXP SemiconductorsIC MPU MPC85XX 667MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
667MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
783-BFBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
Additional Interfaces:
I2C, PCI, RapidIO, SPI, TDM, UART
811
MPC8560PX833LB
MPC8560PX833LBNXP SemiconductorsIC MPU MPC85XX 833MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
833MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
783-BFBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
Additional Interfaces:
I2C, PCI, RapidIO, SPI, TDM, UART
1,037
MPC8560VT667LB
MPC8560VT667LBNXP SemiconductorsIC MPU MPC85XX 667MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
667MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
783-BFBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
Additional Interfaces:
I2C, PCI, RapidIO, SPI, TDM, UART
1,044
MPC8560VT667LC
MPC8560VT667LCNXP SemiconductorsIC MPU MPC85XX 667MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
667MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
783-BFBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
Additional Interfaces:
I2C, PCI, RapidIO, SPI, TDM, UART
193
MPC8560VT833LB
MPC8560VT833LBNXP SemiconductorsIC MPU MPC85XX 833MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
833MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
783-BFBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
Additional Interfaces:
I2C, PCI, RapidIO, SPI, TDM, UART
82
MPC8560VT833LC
MPC8560VT833LCNXP SemiconductorsIC MPU MPC85XX 833MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
833MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
783-BFBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
Additional Interfaces:
I2C, PCI, RapidIO, SPI, TDM, UART
1,145
MPC8560VTAQFB
MPC8560VTAQFBNXP SemiconductorsIC MPU MPC85XX 1.0GHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
783-BFBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
Additional Interfaces:
I2C, PCI, RapidIO, SPI, TDM, UART
1,667
MPC8560VTAQFC
MPC8560VTAQFCNXP SemiconductorsIC MPU MPC85XX 1.0GHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Mounting Type:
Surface Mount
315
MPC8568ECVTAQGG
MPC8568ECVTAQGGNXP SemiconductorsIC MPU MPC85XX 1.0GHZ 1023FCPBGAMicroprocessors1023-FCPBGA (33x33)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Mounting Type:
Surface Mount
1,070
MPC8568EVTAQGG
MPC8568EVTAQGGNXP SemiconductorsIC MPU MPC85XX 1.0GHZ 1023FCPBGAMicroprocessors1023-FCPBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Communications; QUICC Engine, Security; SEC
RAM Controllers:
DDR, DDR2, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
1023-BBGA, FCBGA
Supplier Device Package:
1023-FCPBGA (33×33)
Additional Interfaces:
DUART, HSSI, I2C, PCI, RapidIO, UART
824
MPC8568EVTAUJJ
MPC8568EVTAUJJNXP SemiconductorsIC MPU MPC85XX 1.333GHZ 1023BGAMicroprocessors1023-FCPBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.333GHz
Co-Processors/DSP:
Communications; QUICC Engine, Security; SEC
RAM Controllers:
DDR, DDR2, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
1023-BBGA, FCBGA
Supplier Device Package:
1023-FCPBGA (33×33)
Additional Interfaces:
DUART, HSSI, I2C, PCI, RapidIO, UART
836
MPC8568VTAQGG
MPC8568VTAQGGNXP SemiconductorsIC MPU MPC85XX 1.0GHZ 1023FCPBGAMicroprocessors1023-FCPBGA (33x33)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Mounting Type:
Surface Mount
360
MPC8568VTAUJJ
MPC8568VTAUJJNXP SemiconductorsIC MPU MPC85XX 1.333GHZ 1023BGAMicroprocessors1023-FCPBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.333GHz
Co-Processors/DSP:
Communications; QUICC Engine
RAM Controllers:
DDR, DDR2, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
1023-BBGA, FCBGA
Supplier Device Package:
1023-FCPBGA (33×33)
Additional Interfaces:
DUART, HSSI, I2C, PCI, RapidIO, UART
1,090
N/A
MPC8569CVJANKGBNXP SemiconductorsPOWERQUICC 32 BIT POWER ARCHITECMicroprocessorsN/AN/AN/A

N/A

570
MPC8569CVJAQLJB
MPC8569CVJAQLJBNXP SemiconductorsIC MPU MPC85XX 1.067GHZ 783BGAMicroprocessors783-FCPBGA (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.067GHz
Co-Processors/DSP:
Communications; QUICC Engine
RAM Controllers:
DDR2, DDR3, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (8), 1Gbps (4)
USB:
USB 2.0 (1)
Voltage – I/O:
1.0V, 1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
Additional Interfaces:
DUART, HSSI, I2C, MMC/SD, PCI, RapidIO, SPI, TDM, UART
1,172
MPC8569CVTAQLJB
MPC8569CVTAQLJBNXP SemiconductorsIC MPU MPC85XX 1.067GHZ 783BGAMicroprocessors783-FCPBGA (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.067GHz
Co-Processors/DSP:
Communications; QUICC Engine
RAM Controllers:
DDR2, DDR3, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (8), 1Gbps (4)
USB:
USB 2.0 (1)
Voltage – I/O:
1.0V, 1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
Additional Interfaces:
DUART, HSSI, I2C, MMC/SD, PCI, RapidIO, SPI, TDM, UART
352
N/A
MPC8569ECVJANKGBNXP SemiconductorsPOWERQUICC 32 BIT POWER ARCHITECMicroprocessorsN/AN/AN/A

N/A

1,311

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About Microprocessors

Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.

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