Microprocessors

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Total Products: 5,357
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Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AMPC8572EVJATLENXP SemiconductorsIC MPU MPC85XX 1.2GHZ 1023FCPBGAMicroprocessors1023-FCPBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.2GHz
Co-Processors/DSP:
Signal Processing; SPE, Security; SEC
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
1023-BBGA, FCBGA
Supplier Device Package:
1023-FCPBGA (33×33)
796
N/AMPC8572EVJAULENXP SemiconductorsIC MPU MPC85XX 1.333GHZ 1023BGAMicroprocessors1023-FCPBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.333GHz
Co-Processors/DSP:
Signal Processing; SPE, Security; SEC
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
1023-BBGA, FCBGA
Supplier Device Package:
1023-FCPBGA (33×33)
1,947
N/AMPC8572EVJAVNENXP SemiconductorsIC MPU MPC85XX 1.5GHZ 1023FCPBGAMicroprocessors1023-FCPBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.5GHz
Co-Processors/DSP:
Signal Processing; SPE, Security; SEC
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
1023-BBGA, FCBGA
Supplier Device Package:
1023-FCPBGA (33×33)
232
MPC8572EVTARLDMPC8572EVTARLDNXP SemiconductorsIC MPU MPC85XX 1.067GHZ 1023BGAMicroprocessors1023-FCBGA (33x33)1.5V, 1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.067GHz
Mounting Type:
Surface Mount
609
MPC8572EVTATLDMPC8572EVTATLDNXP SemiconductorsIC MPU MPC85XX 1.2GHZ 1023FCBGAMicroprocessors1023-FCBGA (33x33)1.5V, 1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.2GHz
Mounting Type:
Surface Mount
645
MPC8572EVTATLEMPC8572EVTATLENXP SemiconductorsIC MPU MPC85XX 1.2GHZ 1023FCBGAMicroprocessors1023-FCBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.2GHz
Co-Processors/DSP:
Signal Processing; SPE, Security; SEC
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
1023-BFBGA, FCBGA
Supplier Device Package:
1023-FCBGA (33×33)
1,097
MPC8572EVTAULEMPC8572EVTAULENXP SemiconductorsIC MPU MPC85XX 1.333GHZ 1023BGAMicroprocessors1023-FCBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.333GHz
Co-Processors/DSP:
Signal Processing; SPE, Security; SEC
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
1023-BFBGA, FCBGA
Supplier Device Package:
1023-FCBGA (33×33)
1,430
MPC8572EVTAVNBMPC8572EVTAVNBNXP SemiconductorsIC MPU MPC85XX 1.5GHZ 1023FCBGAMicroprocessors1023-FCBGA (33x33)1.5V, 1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.5GHz
Mounting Type:
Surface Mount
959
MPC8572EVTAVNEMPC8572EVTAVNENXP SemiconductorsIC MPU MPC85XX 1.5GHZ 1023FCBGAMicroprocessors1023-FCBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.5GHz
Co-Processors/DSP:
Signal Processing; SPE, Security; SEC
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
1023-BFBGA, FCBGA
Supplier Device Package:
1023-FCBGA (33×33)
211
N/AMPC8572LVJAULENXP SemiconductorsIC MPU MPC85XX 1.333GHZ 1023BGAMicroprocessors1023-FCPBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.333GHz
Co-Processors/DSP:
Signal Processing; SPE
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
1023-BBGA, FCBGA
Supplier Device Package:
1023-FCPBGA (33×33)
559
N/AMPC8572LVJAVNENXP SemiconductorsIC MPU MPC85XX 1.5GHZ 1023FCPBGAMicroprocessors1023-FCPBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.5GHz
Co-Processors/DSP:
Signal Processing; SPE
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
1023-BBGA, FCBGA
Supplier Device Package:
1023-FCPBGA (33×33)
611
MPC8572LVTAVNEMPC8572LVTAVNENXP SemiconductorsIC MPU MPC85XX 1.5GHZ 1023FCBGAMicroprocessors1023-FCBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.5GHz
Co-Processors/DSP:
Signal Processing; SPE
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
1023-BFBGA, FCBGA
Supplier Device Package:
1023-FCBGA (33×33)
798
N/AMPC8572VJATLENXP SemiconductorsIC MPU MPC85XX 1.2GHZ 1023FCBGAMicroprocessors1023-FCBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.2GHz
Co-Processors/DSP:
Signal Processing; SPE
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (3)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
1023-BBGA, FCBGA
Supplier Device Package:
1023-FCBGA (33×33)
405
N/AMPC8572VJAULENXP SemiconductorsIC MPU MPC85XX 1.333GHZ 1023BGAMicroprocessors1023-FCPBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.333GHz
Co-Processors/DSP:
Signal Processing; SPE
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
1023-BBGA, FCBGA
Supplier Device Package:
1023-FCPBGA (33×33)
1,950
N/AMPC8572VJAVNENXP SemiconductorsIC MPU MPC85XX 1.5GHZ 1023FCPBGAMicroprocessors1023-FCPBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.5GHz
Co-Processors/DSP:
Signal Processing; SPE
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
1023-BBGA, FCBGA
Supplier Device Package:
1023-FCPBGA (33×33)
958
MPC8572VTAULEMPC8572VTAULENXP SemiconductorsMPC8572 - POWERQUICC III 32-BITMicroprocessorsN/AN/AN/A
Voltage – I/O:
1.5 V – 3.3 V
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
1,083
MPC857DSLCVR66BMPC857DSLCVR66BNXP SemiconductorsIC MPU MPC8XX 66MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A-40°C ~ 115°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
66MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1), 10/100Mbps (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 115°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
788
MPC857DSLVR50BMPC857DSLVR50BNXP SemiconductorsIC MPU MPC8XX 50MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
50MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1), 10/100Mbps (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
1,166
MPC857TCVR66BMPC857TCVR66BNXP SemiconductorsIC MPU MPC8XX 66MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A-40°C ~ 115°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
66MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1), 10/100Mbps (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 115°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
149
MPC857TVR100BMPC857TVR100BNXP SemiconductorsIC MPU MPC8XX 100MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
100MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1), 10/100Mbps (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
281

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About Microprocessors

Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.

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