Microprocessors

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Total Products: 5,357
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Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MPC8569ECVJAQLJBMPC8569ECVJAQLJBNXP SemiconductorsIC MPU MPC85XX 1.067GHZ 783BGAMicroprocessors783-FCPBGA (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.067GHz
Co-Processors/DSP:
Communications; QUICC Engine, Security; SEC
RAM Controllers:
DDR2, DDR3, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (8), 1Gbps (4)
USB:
USB 2.0 (1)
Voltage – I/O:
1.0V, 1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
1,167
MPC8569EVJANKGBMPC8569EVJANKGBNXP SemiconductorsIC MPU MPC85XX 800MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Communications; QUICC Engine, Security; SEC
RAM Controllers:
DDR2, DDR3, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (8), 1Gbps (4)
USB:
USB 2.0 (1)
Voltage – I/O:
1.0V, 1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
993
MPC8569EVJAUNLBMPC8569EVJAUNLBNXP SemiconductorsIC MPU MPC85XX 1.333GHZ 783BGAMicroprocessors783-FCPBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.333GHz
Co-Processors/DSP:
Communications; QUICC Engine, Security; SEC
RAM Controllers:
DDR2, DDR3, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (8), 1Gbps (4)
USB:
USB 2.0 (1)
Voltage – I/O:
1.0V, 1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
865
MPC8569EVTAUNLBMPC8569EVTAUNLBNXP SemiconductorsIC MPU MPC85XX 1.333GHZ 783BGAMicroprocessors783-FCPBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.333GHz
Co-Processors/DSP:
Communications; QUICC Engine, Security; SEC
RAM Controllers:
DDR2, DDR3, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (8), 1Gbps (4)
USB:
USB 2.0 (1)
Voltage – I/O:
1.0V, 1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
99
MPC8569VJANKGBMPC8569VJANKGBNXP SemiconductorsIC MPU MPC85XX 800MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Communications; QUICC Engine
RAM Controllers:
DDR2, DDR3, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (8), 1Gbps (4)
USB:
USB 2.0 (1)
Voltage – I/O:
1.0V, 1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
729
MPC8569VTANKGBMPC8569VTANKGBNXP SemiconductorsIC MPU MPC85XX 800MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Communications; QUICC Engine
RAM Controllers:
DDR2, DDR3, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (8), 1Gbps (4)
USB:
USB 2.0 (1)
Voltage – I/O:
1.0V, 1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
352
N/AMPC8572CLVJAULENXP SemiconductorsIC MPU MPC85XX 1.333GHZ 1023BGAMicroprocessors1023-FCPBGA (33x33)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.333GHz
Co-Processors/DSP:
Signal Processing; SPE
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
1023-BBGA, FCBGA
Supplier Device Package:
1023-FCPBGA (33×33)
52
MPC8572CLVTAULDMPC8572CLVTAULDNXP SemiconductorsIC MPU MPC85XX 1.333GHZ 1023BGAMicroprocessors1023-FCBGA (33x33)1.5V, 1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.333GHz
Mounting Type:
Surface Mount
157
N/AMPC8572ECLVJAULENXP SemiconductorsIC MPU MPC85XX 1.333GHZ 1023BGAMicroprocessors1023-FCPBGA (33x33)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.333GHz
Co-Processors/DSP:
Signal Processing; SPE, Security; SEC
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
1023-BBGA, FCBGA
Supplier Device Package:
1023-FCPBGA (33×33)
432
MPC8572ECLVTAULDMPC8572ECLVTAULDNXP SemiconductorsIC MPU MPC85XX 1.333GHZ 1023BGAMicroprocessors1023-FCBGA (33x33)1.5V, 1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.333GHz
Mounting Type:
Surface Mount
651
MPC8572ECPXARLDMPC8572ECPXARLDNXP SemiconductorsIC MPU MPC85XX 1.067GHZ 1023BGAMicroprocessors1023-FCBGA (33x33)1.5V, 1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.067GHz
Mounting Type:
Surface Mount
646
N/AMPC8572ECVJARLENXP SemiconductorsIC MPU MPC85XX 1.067GHZ 1023BGAMicroprocessors1023-FCPBGA (33x33)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.067GHz
Co-Processors/DSP:
Signal Processing; SPE, Security; SEC
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
1023-BBGA, FCBGA
Supplier Device Package:
1023-FCPBGA (33×33)
1,261
N/AMPC8572ECVJAULENXP SemiconductorsIC MPU MPC85XX 1.333GHZ 1023BGAMicroprocessors1023-FCPBGA (33x33)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.333GHz
Co-Processors/DSP:
Signal Processing; SPE, Security; SEC
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
1023-BBGA, FCBGA
Supplier Device Package:
1023-FCPBGA (33×33)
908
N/AMPC8572ELVJAVNENXP SemiconductorsIC MPU MPC85XX 1.5GHZ 1023FCPBGAMicroprocessors1023-FCPBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.5GHz
Co-Processors/DSP:
Signal Processing; SPE, Security; SEC
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
1023-BBGA, FCBGA
Supplier Device Package:
1023-FCPBGA (33×33)
1,580
MPC8572ELVTAVNEMPC8572ELVTAVNENXP SemiconductorsIC MPU MPC85XX 1.5GHZ 1023FCBGAMicroprocessors1023-FCBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.5GHz
Co-Processors/DSP:
Signal Processing; SPE, Security; SEC
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
1023-BFBGA, FCBGA
Supplier Device Package:
1023-FCBGA (33×33)
230
MPC8572EPXATLDMPC8572EPXATLDNXP SemiconductorsIC MPU MPC85XX 1.2GHZ 1023FCBGAMicroprocessors1023-FCBGA (33x33)1.5V, 1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.2GHz
Mounting Type:
Surface Mount
587
MPC8572EPXAULDMPC8572EPXAULDNXP SemiconductorsIC MPU MPC85XX 1.333GHZ 1023BGAMicroprocessors1023-FCBGA (33x33)1.5V, 1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.333GHz
Mounting Type:
Surface Mount
57
MPC8572EPXAVNBMPC8572EPXAVNBNXP SemiconductorsIC MPU MPC85XX 1.5GHZ 1023FCBGAMicroprocessors1023-FCBGA (33x33)1.5V, 1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.5GHz
Mounting Type:
Surface Mount
1,239
MPC8572EPXAVNEMPC8572EPXAVNENXP SemiconductorsIC MPU MPC85XX 1.5GHZ 1023FCBGAMicroprocessors1023-FCBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.5GHz
Co-Processors/DSP:
Signal Processing; SPE, Security; SEC
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
1023-BFBGA, FCBGA
Supplier Device Package:
1023-FCBGA (33×33)
326
N/AMPC8572EVJARLENXP SemiconductorsIC MPU MPC85XX 1.067GHZ 1023BGAMicroprocessors1023-FCPBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.067GHz
Co-Processors/DSP:
Signal Processing; SPE, Security; SEC
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
1023-BBGA, FCBGA
Supplier Device Package:
1023-FCPBGA (33×33)
1,463

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About Microprocessors

Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.

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