Microprocessors

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Total Products: 5,357
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Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
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LS1026AXE8MQALS1026AXE8MQANXP SemiconductorsIC MPU QORIQ 1.2GHZ 780FCPBGAMicroprocessors780-FCPBGA (23x23)N/A-40°C ~ 105°C
Core Processor:
ARM® Cortex®-A72
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
1.2GHz
RAM Controllers:
DDR4
Ethernet:
10GbE (2), 2.5GbE (1), 1GbE (4)
SATA:
SATA 6Gbps (1)
USB:
USB 3.0 (3) + PHY
Operating Temperature:
-40°C ~ 105°C
Security Features:
Secure Boot, TrustZone®
Mounting Type:
Surface Mount
Package / Case:
780-FBGA, FCBGA
Supplier Device Package:
780-FCPBGA (23×23)
1,430
LS1026AXE8P1ALS1026AXE8P1ANXP SemiconductorsIC MPU QORIQ 1.4GHZ 780FCPBGAMicroprocessors780-FCPBGA (23x23)N/A-40°C ~ 105°C
Core Processor:
ARM® Cortex®-A72
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
1.4GHz
RAM Controllers:
DDR4
Ethernet:
10GbE (2), 2.5GbE (1), 1GbE (4)
SATA:
SATA 6Gbps (1)
USB:
USB 3.0 (3) + PHY
Operating Temperature:
-40°C ~ 105°C
Security Features:
Secure Boot, TrustZone®
Mounting Type:
Surface Mount
Package / Case:
780-FBGA, FCBGA
Supplier Device Package:
780-FCPBGA (23×23)
800
LS1026AXE8Q1ALS1026AXE8Q1ANXP SemiconductorsIC MPU QORIQ 1.6GHZ 780FCPBGAMicroprocessors780-FCPBGA (23x23)N/A-40°C ~ 105°C
Core Processor:
ARM® Cortex®-A72
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
1.6GHz
RAM Controllers:
DDR4
Ethernet:
10GbE (2), 2.5GbE (1), 1GbE (4)
SATA:
SATA 6Gbps (1)
USB:
USB 3.0 (3) + PHY
Operating Temperature:
-40°C ~ 105°C
Security Features:
Secure Boot, TrustZone®
Mounting Type:
Surface Mount
Package / Case:
780-FBGA, FCBGA
Supplier Device Package:
780-FCPBGA (23×23)
376
LS1026AXE8T1ALS1026AXE8T1ANXP SemiconductorsIC MPU QORIQ 1.8GHZ 780FCPBGAMicroprocessors780-FCPBGA (23x23)N/A-40°C ~ 105°C
Core Processor:
ARM® Cortex®-A72
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
1.8GHz
RAM Controllers:
DDR4
Ethernet:
10GbE (2), 2.5GbE (1), 1GbE (4)
SATA:
SATA 6Gbps (1)
USB:
USB 3.0 (3) + PHY
Operating Temperature:
-40°C ~ 105°C
Security Features:
Secure Boot, TrustZone®
Mounting Type:
Surface Mount
Package / Case:
780-FBGA, FCBGA
Supplier Device Package:
780-FCPBGA (23×23)
262
LS1026AXN8MQALS1026AXN8MQANXP SemiconductorsIC MPU QORLQ LS1 1.2GHZ 780FBGAMicroprocessors780-FBGA (23x23)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A72
Speed:
1.2GHz
RAM Controllers:
DDR4
Graphics Acceleration:
No
Ethernet:
10GbE (2), 2.5GbE (3), 1GbE (8)
SATA:
SATA 6Gbps (1)
USB:
USB 3.0 + PHY (3)
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
Secure Boot, TrustZone
Mounting Type:
Surface Mount
Package / Case:
780-BFBGA
Supplier Device Package:
780-FBGA (23×23)
36
LS1026AXN8P1ALS1026AXN8P1ANXP SemiconductorsIC MPU QORIQ 1.4GHZ 780FCPBGAMicroprocessors780-FCPBGA (23x23)N/A-40°C ~ 105°C
Core Processor:
ARM® Cortex®-A72
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
1.4GHz
RAM Controllers:
DDR4
Ethernet:
10GbE (2), 2.5GbE (1), 1GbE (4)
SATA:
SATA 6Gbps (1)
USB:
USB 3.0 (3) + PHY
Operating Temperature:
-40°C ~ 105°C
Security Features:
Secure Boot, TrustZone®
Mounting Type:
Surface Mount
Package / Case:
780-FBGA, FCBGA
Supplier Device Package:
780-FCPBGA (23×23)
221
LS1026AXN8Q1ALS1026AXN8Q1ANXP SemiconductorsIC MPU QORIQ 1.6GHZ 780FCPBGAMicroprocessors780-FCPBGA (23x23)N/A-40°C ~ 105°C
Core Processor:
ARM® Cortex®-A72
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
1.6GHz
RAM Controllers:
DDR4
Ethernet:
10GbE (2), 2.5GbE (1), 1GbE (4)
SATA:
SATA 6Gbps (1)
USB:
USB 3.0 (3) + PHY
Operating Temperature:
-40°C ~ 105°C
Security Features:
Secure Boot, TrustZone®
Mounting Type:
Surface Mount
Package / Case:
780-FBGA, FCBGA
Supplier Device Package:
780-FCPBGA (23×23)
672
LS1026AXN8T1ALS1026AXN8T1ANXP SemiconductorsIC MPU QORIQ 1.8GHZ 780FCPBGAMicroprocessors780-FCPBGA (23x23)N/A-40°C ~ 105°C
Core Processor:
ARM® Cortex®-A72
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
1.8GHz
RAM Controllers:
DDR4
Ethernet:
10GbE (2), 2.5GbE (1), 1GbE (4)
SATA:
SATA 6Gbps (1)
USB:
USB 3.0 (3) + PHY
Operating Temperature:
-40°C ~ 105°C
Security Features:
Secure Boot, TrustZone®
Mounting Type:
Surface Mount
Package / Case:
780-FBGA, FCBGA
Supplier Device Package:
780-FCPBGA (23×23)
285
LS1027ASN7KQALS1027ASN7KQANXP SemiconductorsIC MPU QORIQ LAYER 1GHZ 448FBGAMicroprocessors448-FBGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A72
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
1GHz
RAM Controllers:
DDR3L SDRAM, DDR4 SDRAM
Ethernet:
1Gbps (1), 2.5Gbps (5)
SATA:
SATA 6Gbps (1)
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
448-BFBGA
Supplier Device Package:
448-FBGA (17×17)
682
LS1027AXE7HNALS1027AXE7HNANXP SemiconductorsIC MPU QORIQ 800MHZ 448FBGAMicroprocessors448-FBGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A72
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
800MHz
RAM Controllers:
DDR3L SDRAM, DDR4 SDRAM
Ethernet:
1Gbps (1), 2.5Gbps (5)
SATA:
SATA 6Gbps (1)
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
448-BFBGA
Supplier Device Package:
448-FBGA (17×17)
782
LS1027AXN7HNALS1027AXN7HNANXP SemiconductorsIC MPU QORIQ 800MHZ 448FBGAMicroprocessors448-FBGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A72
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
800MHz
RAM Controllers:
DDR3L SDRAM, DDR4 SDRAM
Ethernet:
1Gbps (1), 2.5Gbps (5)
SATA:
SATA 6Gbps (1)
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
448-BFBGA
Supplier Device Package:
448-FBGA (17×17)
1,242
LS1027AXN7PQALS1027AXN7PQANXP SemiconductorsIC MPU QORIQ 1.5GHZ 448FBGAMicroprocessors448-FBGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A72
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
1.5GHz
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
Yes
Ethernet:
1Gbps (1), 2.5Gbps (5)
SATA:
SATA 6Gbps (1)
USB:
USB 3.0 (2)
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Secure Boot, TrustZone®
Mounting Type:
Surface Mount
Package / Case:
448-BFBGA
Supplier Device Package:
448-FBGA (17×17)
92
LS1028ASN7KQALS1028ASN7KQANXP SemiconductorsIC MPU QORIQ LAYER 1GHZ 448FBGAMicroprocessors448-FBGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A72
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
1GHz
RAM Controllers:
DDR3L SDRAM, DDR4 SDRAM
Ethernet:
1Gbps (1), 2.5Gbps (5)
SATA:
SATA 6Gbps (1)
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
448-BFBGA
Supplier Device Package:
448-FBGA (17×17)
454
LS1028AXE7KQALS1028AXE7KQANXP SemiconductorsIC MPU QORIQ LAYER 1GHZ 448FBGAMicroprocessors448-FBGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A72
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
1GHz
RAM Controllers:
DDR3L SDRAM, DDR4 SDRAM
Ethernet:
1Gbps (1), 2.5Gbps (5)
SATA:
SATA 6Gbps (1)
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
448-BFBGA
Supplier Device Package:
448-FBGA (17×17)
1,526
LS1028AXN7NQALS1028AXN7NQANXP SemiconductorsIC MPU QORIQ 1.3GHZ 448FBGAMicroprocessors448-FBGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A72
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
1.3GHz
RAM Controllers:
DDR3L SDRAM, DDR4 SDRAM
Ethernet:
1Gbps (1), 2.5Gbps (5)
SATA:
SATA 6Gbps (1)
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
448-BFBGA
Supplier Device Package:
448-FBGA (17×17)
344
N/AN/ALS102MASE7BFANXP SemiconductorsIC MPU QORLQ LS1 650MHZ 448PBGAMicroprocessors448-PBGA w/Heat Spreader (23x23)N/A0°C ~ 70°C (TA)
Core Processor:
ARM1136JF-S
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
650MHz
RAM Controllers:
DDR2
Graphics Acceleration:
No
Ethernet:
GbE (2)
USB:
USB 2.0 + PHY (1)
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
448-FBGA Exposed Pad
Supplier Device Package:
448-PBGA w/Heat Spreader (23×23)
397
N/AN/ALS102MASE7EHANXP SemiconductorsIC MPU QORLQ LS1 650MHZ 448PBGAMicroprocessors448-PBGA w/Heat Spreader (23x23)N/A0°C ~ 70°C (TA)
Core Processor:
ARM1136JF-S
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
650MHz
RAM Controllers:
DDR2
Graphics Acceleration:
No
Ethernet:
GbE (2)
USB:
USB 2.0 + PHY (1)
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
448-FBGA Exposed Pad
Supplier Device Package:
448-PBGA w/Heat Spreader (23×23)
632
N/ALS1043ABE9MQBNXP SemiconductorsLAYERSCAPE 64-BIT ARM CORTEX-A53Microprocessors780-FBGA (23x23)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
4 Core, 64-Bit
Speed:
1.2GHz
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
No
Ethernet:
1GbE (7), 10GbE (1), 2.5GbE (2)
SATA:
SATA 6Gbps (1)
USB:
USB 3.0 + PHY (3)
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Boot Security
Mounting Type:
Surface Mount
Package / Case:
780-BFBGA
Supplier Device Package:
780-FBGA (23×23)
1,439
N/ALS1043ABE9PQBNXP SemiconductorsTRAYS (ALT: LS1043ABE9PQB)Microprocessors780-FBGA (23x23)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53
Ethernet:
1GbE (7), 10GbE (1), 2.5GbE (2)
Graphics Acceleration:
No
Mounting Type:
Surface Mount
Number of Cores/Bus Width:
4 Core, 64-Bit
Operating Temperature:
-40°C ~ 105°C (TA)
Package / Case:
780-BFBGA
RAM Controllers:
DDR3L, DDR4
SATA:
SATA 6Gbps (1)
Security Features:
ARM TZ, Boot Security
Speed:
1.4GHz
Supplier Device Package:
780-FBGA (23×23)
USB:
USB 3.0 + PHY (3)
614
N/ALS1043ACE9MQBNXP SemiconductorsLAYERSCAPE 64-BIT ARM CORTEX-A53Microprocessors780-FBGA (23x23)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
4 Core, 64-Bit
Speed:
1.6GHz
RAM Controllers:
DDR3L, DDR4
Graphics Acceleration:
No
Ethernet:
1GbE (4), 2.5GbE (2), 10GbE (1)
SATA:
SATA 6Gbps (1)
USB:
USB 3.0 + PHY (3)
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
ARM TZ, Boot Security
Mounting Type:
Surface Mount
Package / Case:
780-BFBGA
Supplier Device Package:
780-FBGA (23×23)
1,900

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About Microprocessors

Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.

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