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Microprocessors

Suntsu Electronics: Your trusted provider of high-performance microprocessors. Our advanced part search tool streamlines the process of finding the ideal microprocessor for your application. Search by part number, manufacturer, or specifications related to your project’s requirements. Access our extensive database of microprocessors and discover the perfect solution for your computing needs.

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Total Products: 5,357
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Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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MC68340FE16E
MC68340FE16ENXP SemiconductorsIC MPU M683XX 16MHZ 144CQFPMicroprocessors144-CQFP (26.77x26.77)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
16MHz
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
144-BCQFP
Supplier Device Package:
144-CQFP (26.77×26.77)
Additional Interfaces:
USART
559
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MC68340FE16VE
MC68340FE16VENXP SemiconductorsIC MPU M683XX 16MHZ 144CQFPMicroprocessors144-CQFP (26.77x26.77)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
16MHz
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
144-BCQFP
Supplier Device Package:
144-CQFP (26.77×26.77)
Additional Interfaces:
USART
147
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MC68340FE25E
MC68340FE25ENXP SemiconductorsIC MPU M683XX 25MHZ 144CQFPMicroprocessors144-CQFP (26.77x26.77)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
144-BCQFP
Supplier Device Package:
144-CQFP (26.77×26.77)
Additional Interfaces:
USART
726
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N/A
MC68340FT16ENXP SemiconductorsIC MPU M683XX 16MHZ 144QFPMicroprocessors144-QFP (28x28)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
16MHz
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
144-BQFP
Supplier Device Package:
144-QFP (28×28)
Additional Interfaces:
USART
994
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N/A
MC68340FT25ENXP SemiconductorsIC MPU M683XX 25MHZ 144QFPMicroprocessors144-QFP (28x28)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
144-BQFP
Supplier Device Package:
144-QFP (28×28)
Additional Interfaces:
USART
511
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MC68340PV16E
MC68340PV16ENXP SemiconductorsIC MPU M683XX 16MHZ 144LQFPMicroprocessors144-LQFP (20x20)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
16MHz
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
144-LQFP
Supplier Device Package:
144-LQFP (20×20)
Additional Interfaces:
USART
800
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MC68340PV16VE
MC68340PV16VENXP SemiconductorsIC MPU M683XX 16MHZ 144LQFPMicroprocessors144-LQFP (20x20)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
16MHz
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
144-LQFP
Supplier Device Package:
144-LQFP (20×20)
Additional Interfaces:
USART
153
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MC68340PV25E
MC68340PV25ENXP SemiconductorsIC MPU M683XX 25MHZ 144LQFPMicroprocessors144-LQFP (20x20)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
144-LQFP
Supplier Device Package:
144-LQFP (20×20)
Additional Interfaces:
USART
1,105
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MC68360AI25L
MC68360AI25LNXP SemiconductorsIC MPU M683XX 25MHZ 240FQFPMicroprocessors240-FQFP (32x32)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
240-BFQFP
Supplier Device Package:
240-FQFP (32×32)
Additional Interfaces:
SCC, SMC, SPI
1,569
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MC68360AI25VL
MC68360AI25VLNXP SemiconductorsIC MPU M683XX 25MHZ 240FQFPMicroprocessors240-FQFP (32x32)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
240-BFQFP
Supplier Device Package:
240-FQFP (32×32)
Additional Interfaces:
SCC, SMC, SPI
1,705
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MC68360AI33L
MC68360AI33LNXP SemiconductorsIC MPU M683XX 33MHZ 240FQFPMicroprocessors240-FQFP (32x32)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
33MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
240-BFQFP
Supplier Device Package:
240-FQFP (32×32)
Additional Interfaces:
SCC, SMC, SPI
481
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MC68360CAI25L
MC68360CAI25LNXP SemiconductorsIC MPU M683XX 25MHZ 240FQFPMicroprocessors240-FQFP (32x32)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
5.0V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
240-BFQFP
Supplier Device Package:
240-FQFP (32×32)
Additional Interfaces:
SCC, SMC, SPI
368
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MC68360CEM25L
MC68360CEM25LNXP SemiconductorsIC MPU M683XX 25MHZ 240FQFPMicroprocessors240-FQFP (32x32)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
5.0V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
240-BFQFP
Supplier Device Package:
240-FQFP (32×32)
Additional Interfaces:
SCC, SMC, SPI
1,268
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MC68360CRC25L
MC68360CRC25LNXP SemiconductorsIC MPU M683XX 25MHZ 241PGAMicroprocessors241-PGA (47.24x47.24)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
5.0V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Package / Case:
241-BEPGA
Supplier Device Package:
241-PGA (47.24×47.24)
Additional Interfaces:
SCC, SMC, SPI
1,806
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MC68360CVR25L
MC68360CVR25LNXP SemiconductorsIC MPU M683XX 25MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
5.0V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
Additional Interfaces:
SCC, SMC, SPI
1,117
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MC68360CVR25LR2
MC68360CVR25LR2NXP SemiconductorsIC MPU M683XX 25MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
5.0V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
Additional Interfaces:
SCC, SMC, SPI
1,705
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MC68360CZP25L
MC68360CZP25LNXP SemiconductorsIC MPU M683XX 25MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
5.0V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BGA
Supplier Device Package:
357-PBGA (25×25)
Additional Interfaces:
SCC, SMC, SPI
806
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MC68360EM25K
MC68360EM25KNXP SemiconductorsIC MPU M683XX 25MHZ 240FQFPMicroprocessors240-FQFP (32x32)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
240-BFQFP
Supplier Device Package:
240-FQFP (32×32)
Additional Interfaces:
SCC, SMC, SPI
15
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MC68360EM25L
MC68360EM25LNXP SemiconductorsIC MPU M683XX 25MHZ 240FQFPMicroprocessors240-FQFP (32x32)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
240-BFQFP
Supplier Device Package:
240-FQFP (32×32)
Additional Interfaces:
SCC, SMC, SPI
1,444
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MC68360EM25VL
MC68360EM25VLNXP SemiconductorsIC MPU M683XX 25MHZ 240FQFPMicroprocessors240-FQFP (32x32)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
240-BFQFP
Supplier Device Package:
240-FQFP (32×32)
Additional Interfaces:
SCC, SMC, SPI
186
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About Microprocessors

Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.

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