Microprocessors

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Total Products: 5,357
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Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MC68340FE16EMC68340FE16ENXP SemiconductorsIC MPU M683XX 16MHZ 144CQFPMicroprocessors144-CQFP (26.77x26.77)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
16MHz
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
144-BCQFP
Supplier Device Package:
144-CQFP (26.77×26.77)
1,859
MC68340FE16VEMC68340FE16VENXP SemiconductorsIC MPU M683XX 16MHZ 144CQFPMicroprocessors144-CQFP (26.77x26.77)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
16MHz
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
144-BCQFP
Supplier Device Package:
144-CQFP (26.77×26.77)
777
MC68340FE25EMC68340FE25ENXP SemiconductorsIC MPU M683XX 25MHZ 144CQFPMicroprocessors144-CQFP (26.77x26.77)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
144-BCQFP
Supplier Device Package:
144-CQFP (26.77×26.77)
1,782
N/AMC68340FT16ENXP SemiconductorsIC MPU M683XX 16MHZ 144QFPMicroprocessors144-QFP (28x28)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
16MHz
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
144-BQFP
Supplier Device Package:
144-QFP (28×28)
665
N/AMC68340FT25ENXP SemiconductorsIC MPU M683XX 25MHZ 144QFPMicroprocessors144-QFP (28x28)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
144-BQFP
Supplier Device Package:
144-QFP (28×28)
489
MC68340PV16EMC68340PV16ENXP SemiconductorsIC MPU M683XX 16MHZ 144LQFPMicroprocessors144-LQFP (20x20)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
16MHz
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
144-LQFP
Supplier Device Package:
144-LQFP (20×20)
1,481
MC68340PV16VEMC68340PV16VENXP SemiconductorsIC MPU M683XX 16MHZ 144LQFPMicroprocessors144-LQFP (20x20)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
16MHz
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
144-LQFP
Supplier Device Package:
144-LQFP (20×20)
1,035
MC68340PV25EMC68340PV25ENXP SemiconductorsIC MPU M683XX 25MHZ 144LQFPMicroprocessors144-LQFP (20x20)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
144-LQFP
Supplier Device Package:
144-LQFP (20×20)
1,169
MC68360AI25LMC68360AI25LNXP SemiconductorsIC MPU M683XX 25MHZ 240FQFPMicroprocessors240-FQFP (32x32)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
240-BFQFP
Supplier Device Package:
240-FQFP (32×32)
1,240
MC68360AI25VLMC68360AI25VLNXP SemiconductorsIC MPU M683XX 25MHZ 240FQFPMicroprocessors240-FQFP (32x32)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
240-BFQFP
Supplier Device Package:
240-FQFP (32×32)
313
MC68360AI33LMC68360AI33LNXP SemiconductorsIC MPU M683XX 33MHZ 240FQFPMicroprocessors240-FQFP (32x32)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
33MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
240-BFQFP
Supplier Device Package:
240-FQFP (32×32)
545
MC68360CAI25LMC68360CAI25LNXP SemiconductorsIC MPU M683XX 25MHZ 240FQFPMicroprocessors240-FQFP (32x32)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
5.0V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
240-BFQFP
Supplier Device Package:
240-FQFP (32×32)
76
MC68360CEM25LMC68360CEM25LNXP SemiconductorsIC MPU M683XX 25MHZ 240FQFPMicroprocessors240-FQFP (32x32)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
5.0V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
240-BFQFP
Supplier Device Package:
240-FQFP (32×32)
1,181
MC68360CRC25LMC68360CRC25LNXP SemiconductorsIC MPU M683XX 25MHZ 241PGAMicroprocessors241-PGA (47.24x47.24)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
5.0V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Package / Case:
241-BEPGA
Supplier Device Package:
241-PGA (47.24×47.24)
1,244
MC68360CVR25LMC68360CVR25LNXP SemiconductorsIC MPU M683XX 25MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
5.0V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
439
MC68360CVR25LR2MC68360CVR25LR2NXP SemiconductorsIC MPU M683XX 25MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
5.0V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
1,353
MC68360CZP25LMC68360CZP25LNXP SemiconductorsIC MPU M683XX 25MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
5.0V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BGA
Supplier Device Package:
357-PBGA (25×25)
1,367
MC68360EM25KMC68360EM25KNXP SemiconductorsIC MPU M683XX 25MHZ 240FQFPMicroprocessors240-FQFP (32x32)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
240-BFQFP
Supplier Device Package:
240-FQFP (32×32)
1,138
MC68360EM25LMC68360EM25LNXP SemiconductorsIC MPU M683XX 25MHZ 240FQFPMicroprocessors240-FQFP (32x32)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
240-BFQFP
Supplier Device Package:
240-FQFP (32×32)
350
MC68360EM25VLMC68360EM25VLNXP SemiconductorsIC MPU M683XX 25MHZ 240FQFPMicroprocessors240-FQFP (32x32)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
240-BFQFP
Supplier Device Package:
240-FQFP (32×32)
841

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About Microprocessors

Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.

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