Microprocessors

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Total Products: 5,357
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Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MC68EC000EI8R2
MC68EC000EI8R2NXP SemiconductorsIC MPU M680X0 8MHZ 68PLCCMicroprocessors68-PLCC (24.21x24.21)N/A0°C ~ 70°C (TA)
Core Processor:
EC000
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
8MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
68-LCC (J-Lead)
Supplier Device Package:
68-PLCC (24.21×24.21)
154
MC68EC020AA16
MC68EC020AA16NXP SemiconductorsIC MPU M680X0 16MHZ 100QFPMicroprocessors100-QFP (14x20)N/A0°C ~ 70°C (TA)
Core Processor:
68020
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
16MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
100-BQFP
Supplier Device Package:
100-QFP (14×20)
1,843
MC68EC020AA25
MC68EC020AA25NXP SemiconductorsIC MPU M680X0 25MHZ 100QFPMicroprocessors100-QFP (14x20)N/A0°C ~ 70°C (TA)
Core Processor:
68020
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
100-BQFP
Supplier Device Package:
100-QFP (14×20)
1,706
MC68EC020AA25R
MC68EC020AA25RNXP SemiconductorsIC MPU M680X0 25MHZ 100QFPMicroprocessors100-QFP (14x20)N/A0°C ~ 70°C (TA)
Core Processor:
68020
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
100-BQFP
Supplier Device Package:
100-QFP (14×20)
1,365
MC68EC020FG25
MC68EC020FG25NXP SemiconductorsIC MPU M680X0 25MHZ 100QFPMicroprocessors100-QFP (14x20)N/A0°C ~ 70°C (TA)
Core Processor:
68020
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
100-BQFP
Supplier Device Package:
100-QFP (14×20)
1,800
MC68EC030CFE25C
MC68EC030CFE25CNXP SemiconductorsIC MPU M680X0 25MHZ 132CQFPMicroprocessors132-CQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
68030
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
132-BCQFP
Supplier Device Package:
132-CQFP (24×24)
Additional Interfaces:
SCI, SPI
1,020
MC68EC030FE25C
MC68EC030FE25CNXP SemiconductorsIC MPU M680X0 25MHZ 132CQFPMicroprocessors132-CQFP (24x24)N/A0°C ~ 70°C (TA)
Core Processor:
68030
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
132-BCQFP
Supplier Device Package:
132-CQFP (24×24)
Additional Interfaces:
SCI, SPI
152
MC68EC030FE25CB1
MC68EC030FE25CB1NXP SemiconductorsIC MPU M680X0 25MHZ 132CQFPMicroprocessors132-CQFP (24x24)N/A0°C ~ 70°C (TA)
Core Processor:
68030
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
132-BCQFP
Supplier Device Package:
132-CQFP (24×24)
Additional Interfaces:
SCI, SPI
421
MC68EC030FE40C
MC68EC030FE40CNXP SemiconductorsIC MPU M680X0 40MHZ 132CQFPMicroprocessors132-CQFP (24x24)N/A0°C ~ 70°C (TA)
Core Processor:
68030
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
40MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
132-BCQFP
Supplier Device Package:
132-CQFP (24×24)
Additional Interfaces:
SCI, SPI
60
MC68EC040FE33A-NXP
MC68EC040FE33A-NXPNXP SemiconductorsMPU M68000 2 BIT HCMOS 33MHZ 184MicroprocessorsN/AN/AN/A

N/A

777
MC68EC040FE40A
MC68EC040FE40ANXP SemiconductorsIC MPU M680X0 40MHZ 184CQFPMicroprocessors184-CQFP (31.3x31.3)N/A0°C ~ 70°C (TA)
Core Processor:
68040
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
40MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
184-BCQFP
Supplier Device Package:
184-CQFP (31.3×31.3)
Additional Interfaces:
SCI, SPI
188
MC68EC040RC20A
MC68EC040RC20ANXP SemiconductorsIC MPU M680X0 20MHZ 179PGAMicroprocessors179-PGA (47.24x47.24)N/A0°C ~ 70°C (TA)
Core Processor:
68040
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
20MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Through Hole
Package / Case:
179-BEPGA
Supplier Device Package:
179-PGA (47.24×47.24)
Additional Interfaces:
SCI, SPI
1,260
MC68EC040RC25A
MC68EC040RC25ANXP SemiconductorsIC MPU M680X0 25MHZ 179PGAMicroprocessors179-PGA (47.24x47.24)N/A0°C ~ 70°C (TA)
Core Processor:
68040
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Through Hole
Package / Case:
179-BEPGA
Supplier Device Package:
179-PGA (47.24×47.24)
Additional Interfaces:
SCI, SPI
880
MC68EC040RC33A
MC68EC040RC33ANXP SemiconductorsIC MPU M680X0 33MHZ 179PGAMicroprocessors179-PGA (47.24x47.24)N/A0°C ~ 70°C (TA)
Core Processor:
68040
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
33MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Through Hole
Package / Case:
179-BEPGA
Supplier Device Package:
179-PGA (47.24×47.24)
Additional Interfaces:
SCI, SPI
914
N/A
MC68EC040RC33A-NXPNXP SemiconductorsMICROPROCESSOR, 32 BIT, MC68000MicroprocessorsN/AN/AN/A

N/A

783
MC68EC060RC50
MC68EC060RC50NXP SemiconductorsIC MPU M680X0 50MHZ 206PGAMicroprocessors206-PGA (47.25x47.25)N/A0°C ~ 70°C (TA)
Core Processor:
68060
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
50MHz
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Through Hole
Package / Case:
206-BPGA
Supplier Device Package:
206-PGA (47.25×47.25)
Additional Interfaces:
SCI, SPI
1,650
MC68EC060RC75
MC68EC060RC75NXP SemiconductorsIC MPU M680X0 75MHZ 206PGAMicroprocessors206-PGA (47.25x47.25)N/A0°C ~ 70°C (TA)
Core Processor:
68060
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
75MHz
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Through Hole
Package / Case:
206-BPGA
Supplier Device Package:
206-PGA (47.25×47.25)
Additional Interfaces:
SCI, SPI
420
N/A
MC68EC060ZU66NXP SemiconductorsIC MPU M680X0 66MHZ 304TBGAMicroprocessors304-TBGA (31x31)N/A0°C ~ 70°C (TA)
Core Processor:
68060
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
66MHz
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
304-LBGA Exposed Pad
Supplier Device Package:
304-TBGA (31×31)
Additional Interfaces:
SCI, SPI
31
N/A
MC68EC060ZU75NXP SemiconductorsIC MPU M680X0 75MHZ 304TBGAMicroprocessors304-TBGA (31x31)N/A0°C ~ 70°C (TA)
Core Processor:
68060
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
75MHz
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
304-LBGA Exposed Pad
Supplier Device Package:
304-TBGA (31×31)
Additional Interfaces:
SCI, SPI
319
MC68EN302AG20BT
MC68EN302AG20BTNXP SemiconductorsIC MPU M683XX 20MHZ 144LQFPMicroprocessors144-LQFP (20x20)N/A0°C ~ 70°C (TA)
Core Processor:
M68000
Number of Cores/Bus Width:
1 Core, 8/16-Bit
Speed:
20MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
144-LQFP
Supplier Device Package:
144-LQFP (20×20)
Additional Interfaces:
GCI, IDL, ISDN, NMSI, PCM, SCPI
1,197

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About Microprocessors

Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.

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