Microprocessors

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Total Products: 5,357
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Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MC68360EM33L
MC68360EM33LNXP SemiconductorsIC MPU M683XX 33MHZ 240FQFPMicroprocessors240-FQFP (32x32)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
33MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
240-BFQFP
Supplier Device Package:
240-FQFP (32×32)
Additional Interfaces:
SCC, SMC, SPI
35
MC68360RC25L
MC68360RC25LNXP SemiconductorsIC MPU M683XX 25MHZ 241PGAMicroprocessors241-PGA (47.24x47.24)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Through Hole
Package / Case:
241-BEPGA
Supplier Device Package:
241-PGA (47.24×47.24)
Additional Interfaces:
SCC, SMC, SPI
1,745
MC68360RC33L
MC68360RC33LNXP SemiconductorsIC MPU M683XX 33MHZ 241PGAMicroprocessors241-PGA (47.24x47.24)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
33MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Through Hole
Package / Case:
241-BEPGA
Supplier Device Package:
241-PGA (47.24×47.24)
Additional Interfaces:
SCC, SMC, SPI
477
MC68360VR25L
MC68360VR25LNXP SemiconductorsIC MPU M683XX 25MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
Additional Interfaces:
SCC, SMC, SPI
733
MC68360VR25VL
MC68360VR25VLNXP SemiconductorsIC MPU M683XX 25MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
Additional Interfaces:
SCC, SMC, SPI
240
MC68360VR33L
MC68360VR33LNXP SemiconductorsIC MPU M683XX 33MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
33MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
Additional Interfaces:
SCC, SMC, SPI
236
MC68360ZP25L
MC68360ZP25LNXP SemiconductorsIC MPU M683XX 25MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BGA
Supplier Device Package:
357-PBGA (25×25)
Additional Interfaces:
SCC, SMC, SPI
262
MC68360ZP25VL
MC68360ZP25VLNXP SemiconductorsIC MPU M683XX 25MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BGA
Supplier Device Package:
357-PBGA (25×25)
Additional Interfaces:
SCC, SMC, SPI
358
MC68360ZQ25VL
MC68360ZQ25VLNXP SemiconductorsIC MPU M683XX 25MHZ 357BGAMicroprocessors357-PBGA (25x25)3.3V0°C – 70°C
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Mounting Type:
Surface Mount
1,032
MC68E360VR25VLR2
MC68E360VR25VLR2NXP SemiconductorsIC MPU M683XX 25MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
Additional Interfaces:
SCC, SMC, SPI
1,084
MC68EC000AA10
MC68EC000AA10NXP SemiconductorsIC MPU M680X0 10MHZ 64QFPMicroprocessors64-QFP (14x14)N/A0°C ~ 70°C (TA)
Core Processor:
EC000
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
10MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
64-QFP
Supplier Device Package:
64-QFP (14×14)
447
MC68EC000CAA16
MC68EC000CAA16NXP SemiconductorsIC MPU M680X0 16MHZ 64QFPMicroprocessors64-QFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
EC000
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
16MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
64-QFP
Supplier Device Package:
64-QFP (14×14)
439
MC68EC000EI10
MC68EC000EI10NXP SemiconductorsIC MPU M680X0 10MHZ 68PLCCMicroprocessors68-PLCC (24.21x24.21)N/A0°C ~ 70°C (TA)
Core Processor:
EC000
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
10MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
68-LCC (J-Lead)
Supplier Device Package:
68-PLCC (24.21×24.21)
647
MC68EC000EI12
MC68EC000EI12NXP SemiconductorsIC MPU M680X0 12MHZ 68PLCCMicroprocessors68-PLCC (24.21x24.21)N/A0°C ~ 70°C (TA)
Core Processor:
EC000
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
12MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
68-LCC (J-Lead)
Supplier Device Package:
68-PLCC (24.21×24.21)
955
MC68EC000EI12R2
MC68EC000EI12R2NXP SemiconductorsIC MPU M680X0 12MHZ 68PLCCMicroprocessors68-PLCC (24.21x24.21)N/A0°C ~ 70°C (TA)
Core Processor:
EC000
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
12MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
68-LCC (J-Lead)
Supplier Device Package:
68-PLCC (24.21×24.21)
392
MC68EC000EI16
MC68EC000EI16NXP SemiconductorsIC MPU M680X0 16MHZ 68PLCCMicroprocessors68-PLCC (24.21x24.21)N/A0°C ~ 70°C (TA)
Core Processor:
EC000
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
16MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
68-LCC (J-Lead)
Supplier Device Package:
68-PLCC (24.21×24.21)
606
MC68EC000EI16R2
MC68EC000EI16R2NXP SemiconductorsIC MPU M680X0 16MHZ 68PLCCMicroprocessors68-PLCC (24.21x24.21)N/A0°C ~ 70°C (TA)
Core Processor:
EC000
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
16MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
68-LCC (J-Lead)
Supplier Device Package:
68-PLCC (24.21×24.21)
114
MC68EC000EI20
MC68EC000EI20NXP SemiconductorsIC MPU M680X0 20MHZ 68PLCCMicroprocessors68-PLCC (24.21x24.21)N/A0°C ~ 70°C (TA)
Core Processor:
EC000
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
20MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
68-LCC (J-Lead)
Supplier Device Package:
68-PLCC (24.21×24.21)
134
MC68EC000EI20R
MC68EC000EI20RNXP SemiconductorsIC MPU M680X0 20MHZ 68PLCCMicroprocessors68-PLCC (24.21x24.21)N/A0°C ~ 70°C (TA)
Core Processor:
EC000
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
20MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
68-LCC (J-Lead)
Supplier Device Package:
68-PLCC (24.21×24.21)
71
MC68EC000EI8
MC68EC000EI8NXP SemiconductorsIC MPU M680X0 8MHZ 68PLCCMicroprocessors68-PLCC (24.21x24.21)N/A0°C ~ 70°C (TA)
Core Processor:
EC000
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
8MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
68-LCC (J-Lead)
Supplier Device Package:
68-PLCC (24.21×24.21)
770

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About Microprocessors

Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.

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