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Total Products: 3,238
ImageData
Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
Quote
N/A
MIMX9331XVTXMABNXP SemiconductorsICMicroprocessors306-FCBGA (14x14)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
250MHz, 1.7GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR4
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
306-LFBGA, FCBGA
Supplier Device Package:
306-FCBGA (14×14)
Additional Interfaces:
CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
349
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N/A
MIMX9332AVTYMABNXP SemiconductorsICMicroprocessorsN/AN/AN/A

N/A

1,970
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N/A
MIMX9332CVTXMABNXP SemiconductorsICMicroprocessors306-FCBGA (14x14)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2, 1 Core, 64-Bit
Speed:
250MHz, 1.7GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR4
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
306-LFBGA, FCBGA
Supplier Device Package:
306-FCBGA (14×14)
Additional Interfaces:
CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
1,113
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N/A
MIMX9332CVVXMABNXP SemiconductorsICMicroprocessorsN/AN/AN/A

N/A

677
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QUOTE
N/A
MIMX9332XVTXMABNXP SemiconductorsICMicroprocessors306-FCBGA (14x14)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2, 1 Core, 64-Bit
Speed:
250MHz, 1.7GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR4
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
306-LFBGA, FCBGA
Supplier Device Package:
306-FCBGA (14×14)
Additional Interfaces:
CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
340
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QUOTE
N/A
MIMX9351AVTYMABNXP SemiconductorsICMicroprocessorsN/AN/AN/A

N/A

459
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QUOTE
N/A
MIMX9351CVTXMABNXP SemiconductorsICMicroprocessors306-FCBGA (14x14)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
250MHz, 1.7GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR4
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
306-LFBGA, FCBGA
Supplier Device Package:
306-FCBGA (14×14)
Additional Interfaces:
CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
300
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QUOTE
N/A
MIMX9351CVVXMABNXP SemiconductorsICMicroprocessorsN/AN/AN/A

N/A

824
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QUOTE
N/A
MIMX9351XVTXMABNXP SemiconductorsICMicroprocessors306-FCBGA (14x14)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
250MHz, 1.7GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR4
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
306-LFBGA, FCBGA
Supplier Device Package:
306-FCBGA (14×14)
Additional Interfaces:
CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
1,574
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QUOTE
N/A
MIMX9352AVTYMABNXP SemiconductorsICMicroprocessorsN/AN/AN/A

N/A

1,185
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QUOTE
N/A
MIMX9352CVTXMABNXP SemiconductorsICMicroprocessors306-FCBGA (14x14)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2, 1 Core, 64-Bit
Speed:
250MHz, 1.7GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR4
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
306-LFBGA, FCBGA
Supplier Device Package:
306-FCBGA (14×14)
Additional Interfaces:
CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
563
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QUOTE
N/A
MIMX9352CVVXMABNXP SemiconductorsICMicroprocessorsN/AN/AN/A

N/A

1,645
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QUOTE
N/A
MIMX9352XVTXMABNXP SemiconductorsICMicroprocessors306-FCBGA (14x14)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2, 1 Core, 64-Bit
Speed:
250MHz, 1.7GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR4
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
306-LFBGA, FCBGA
Supplier Device Package:
306-FCBGA (14×14)
Additional Interfaces:
CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
795
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QUOTE
N/A
MIMXRT1181CVP2BNXP SemiconductorsICMicroprocessorsN/AN/AN/A

N/A

1,107
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QUOTE
N/A
MIMXRT1182CVP2BNXP SemiconductorsICMicroprocessorsN/AN/AN/A

N/A

1,910
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QUOTE
N/A
MIMXRT1187AVM8BNXP SemiconductorsICMicroprocessorsN/AN/AN/A

N/A

646
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QUOTE
N/A
MIMXRT1187CVM8BNXP SemiconductorsICMicroprocessorsN/AN/AN/A

N/A

879
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QUOTE
MPC5200BV400
MPC5200BV400NXP SemiconductorsIC MPU MPC52XX 400MHZ 272BGAMicroprocessors272-PBGA (27x27)N/A0°C ~ 70°C (TA)
Core Processor:
PowerPC G2_LE
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (1)
USB:
USB 1.1 (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
272-BBGA
Supplier Device Package:
272-PBGA (27×27)
Additional Interfaces:
AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
1,628
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QUOTE
MPC5200CBV266
MPC5200CBV266NXP SemiconductorsIC MPU MPC52XX 266MHZ 272BGAMicroprocessors272-PBGA (27x27)N/A-40°C ~ 85°C (TA)
Core Processor:
PowerPC G2_LE
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (1)
USB:
USB 1.1 (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
272-BBGA
Supplier Device Package:
272-PBGA (27×27)
Additional Interfaces:
AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
594
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QUOTE
MPC5200CBV400
MPC5200CBV400NXP SemiconductorsIC MPU MPC52XX 400MHZ 272BGAMicroprocessors272-PBGA (27x27)N/A-40°C ~ 85°C (TA)
Core Processor:
PowerPC G2_LE
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (1)
USB:
USB 1.1 (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
272-BBGA
Supplier Device Package:
272-PBGA (27×27)
Additional Interfaces:
AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
197
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QUOTE

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