Electronic Parts Search

Suntsu Electronics is your reliable source for hard-to-find and obsolete electronic components. Our advanced part search tool makes it easy to quickly find the products you need. You can search by part number, manufacturer, or specifications to instantly access a comprehensive database of electronic components.

Part Search

CLEAR SEARCH
Total Products: 3,239
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AMIMX9331XVTXMABNXP SemiconductorsICMicroprocessors306-FCBGA (14x14)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
250MHz, 1.7GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR4
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
306-LFBGA, FCBGA
Supplier Device Package:
306-FCBGA (14×14)
176
N/AMIMX9332AVTYMABNXP SemiconductorsICMicroprocessorsN/AN/AN/A
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2, 1 Core, 64-Bit
RAM Controllers:
LPDDR4
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Graphics Acceleration:
No
Co-Processors/DSP:
Multimedia; NEON™ MPE
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Qualification:
Automotive
1,643
N/AMIMX9332CVTXMABNXP SemiconductorsICMicroprocessors306-FCBGA (14x14)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2, 1 Core, 64-Bit
Speed:
250MHz, 1.7GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR4
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
306-LFBGA, FCBGA
Supplier Device Package:
306-FCBGA (14×14)
546
N/AMIMX9332CVVXMABNXP SemiconductorsICMicroprocessorsN/AN/AN/A
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2, 1 Core, 64-Bit
RAM Controllers:
LPDDR4
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Graphics Acceleration:
No
Co-Processors/DSP:
Multimedia; NEON™ MPE
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Qualification:
Industrial
1,030
N/AMIMX9332XVTXMABNXP SemiconductorsICMicroprocessors306-FCBGA (14x14)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2, 1 Core, 64-Bit
Speed:
250MHz, 1.7GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR4
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
306-LFBGA, FCBGA
Supplier Device Package:
306-FCBGA (14×14)
354
N/AMIMX9351AVTYMABNXP SemiconductorsICMicroprocessorsN/AN/AN/A
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2 Core, 64-Bit
RAM Controllers:
LPDDR4
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Graphics Acceleration:
No
Co-Processors/DSP:
Multimedia; NEON™ MPE
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Qualification:
Automotive
71
N/AMIMX9351CVTXMABNXP SemiconductorsICMicroprocessors306-FCBGA (14x14)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
250MHz, 1.7GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR4
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
306-LFBGA, FCBGA
Supplier Device Package:
306-FCBGA (14×14)
895
N/AMIMX9351CVVXMABNXP SemiconductorsICMicroprocessorsN/AN/AN/A
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2 Core, 64-Bit
RAM Controllers:
LPDDR4
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Graphics Acceleration:
No
Co-Processors/DSP:
Multimedia; NEON™ MPE
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Qualification:
Industrial
1,306
N/AMIMX9351XVTXMABNXP SemiconductorsICMicroprocessors306-FCBGA (14x14)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
250MHz, 1.7GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR4
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
306-LFBGA, FCBGA
Supplier Device Package:
306-FCBGA (14×14)
453
N/AMIMX9352AVTYMABNXP SemiconductorsICMicroprocessorsN/AN/AN/A
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2, 1 Core, 64-Bit
RAM Controllers:
LPDDR4
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Graphics Acceleration:
No
Co-Processors/DSP:
Multimedia; NEON™ MPE
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Qualification:
Automotive
745
N/AMIMX9352CVTXMABNXP SemiconductorsICMicroprocessors306-FCBGA (14x14)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2, 1 Core, 64-Bit
Speed:
250MHz, 1.7GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR4
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V
Operating Temperature:
-40°C ~ 105°C (TJ)
Security Features:
Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
306-LFBGA, FCBGA
Supplier Device Package:
306-FCBGA (14×14)
338
N/AMIMX9352CVVXMABNXP SemiconductorsICMicroprocessorsN/AN/AN/A
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2, 1 Core, 64-Bit
RAM Controllers:
LPDDR4
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Graphics Acceleration:
No
Co-Processors/DSP:
Multimedia; NEON™ MPE
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Qualification:
Industrial
898
N/AMIMX9352XVTXMABNXP SemiconductorsICMicroprocessors306-FCBGA (14x14)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A55, ARM® Cortex®-M33
Number of Cores/Bus Width:
2, 1 Core, 64-Bit
Speed:
250MHz, 1.7GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR4
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, LVDS, MIPI-CSI, MIPI-DSI
Ethernet:
GBE (2)
USB:
USB 2.0 (2)
Voltage – I/O:
1.8V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Mounting Type:
Surface Mount
Package / Case:
306-LFBGA, FCBGA
Supplier Device Package:
306-FCBGA (14×14)
1,753
N/AMIMXRT1181CVP2BNXP SemiconductorsICMicroprocessors144-MAPBGA (10x10)N/A-40 °C – 105 °C
Speed:
300 MHz
Core Processor:
ARM® Cortex®-M33
Number of Cores/Bus Width:
1 Core, 32-Bit
RAM Controllers:
LPDDR4
Ethernet:
1Gbps (3)
Graphics Acceleration:
No
Qualification:
Industrial
277
N/AMIMXRT1182CVP2BNXP SemiconductorsICMicroprocessors144-MAPBGA (10x10)N/A-40 °C – 105 °C
Speed:
300 MHz
Core Processor:
ARM® Cortex®-M33
Number of Cores/Bus Width:
1 Core, 32-Bit
RAM Controllers:
LPDDR4
Ethernet:
1Gbps (3)
Graphics Acceleration:
No
Qualification:
Industrial
1,072
N/AMIMXRT1187AVM8BNXP SemiconductorsICMicroprocessors289-MAPBGA (14x14)N/A-40 °C – 125 °C
Speed:
800 MHz
Core Processor:
ARM® Cortex®-M33
Number of Cores/Bus Width:
2 Core, 32-Bit
RAM Controllers:
DDR3
Ethernet:
1Gbps (5)
USB:
USB 2.0 OTG + PHY (2)
Grade:
Automotive
Graphics Acceleration:
No
Qualification:
Automotive
1,008
N/AMIMXRT1187CVM8BNXP SemiconductorsICMicroprocessors289-MAPBGA (14x14)N/A-40 °C – 105 °C
Speed:
800 MHz
Core Processor:
ARM® Cortex®-M33
Number of Cores/Bus Width:
2 Core, 32-Bit
RAM Controllers:
DDR3
Ethernet:
1Gbps (5)
USB:
USB 2.0 OTG + PHY (2)
Graphics Acceleration:
No
Qualification:
Industrial
313
MPC5200BV400MPC5200BV400NXP SemiconductorsIC MPU MPC52XX 400MHZ 272BGAMicroprocessors272-PBGA (27x27)N/A0°C ~ 70°C (TA)
Core Processor:
PowerPC G2_LE
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (1)
USB:
USB 1.1 (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
272-BBGA
Supplier Device Package:
272-PBGA (27×27)
736
MPC5200CBV266MPC5200CBV266NXP SemiconductorsIC MPU MPC52XX 266MHZ 272BGAMicroprocessors272-PBGA (27x27)N/A-40°C ~ 85°C (TA)
Core Processor:
PowerPC G2_LE
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (1)
USB:
USB 1.1 (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
272-BBGA
Supplier Device Package:
272-PBGA (27×27)
1,048
MPC5200CBV400MPC5200CBV400NXP SemiconductorsIC MPU MPC52XX 400MHZ 272BGAMicroprocessors272-PBGA (27x27)N/A-40°C ~ 85°C (TA)
Core Processor:
PowerPC G2_LE
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (1)
USB:
USB 1.1 (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
272-BBGA
Supplier Device Package:
272-PBGA (27×27)
779

We’ve Got You Covered!

If you can’t find the parts you’re looking for in our database, don’t worry! We’re here to help. Simply fill out the form below with the part number you need and your contact information, and we’ll locate it for you. If you prefer to speak to someone directly, our sales team is available at 949.783.7300.

























    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.


    Global Sourcing Capabilities

    Tap into our global network of suppliers to find the components you need. We simplify procurement, even for hard-to-find parts, saving you time and ensuring smooth production.

    Second Sourcing  Second Sourcing Solutions

    Don’t let supply chain disruptions delay your project. We’ll help you identify alternative components and secure reliable secondary sources to keep your production on track.

    Obsolescence Management  Obsolescence Management

    Outsmart obsolescence and ensure your designs stay in production. We’ll help you navigate component lifecycles, secure long-term supply, and find smart alternatives when parts are discontinued.

    Shortage Mitigation  Shortage Mitigation

    Forget supply chain worries. Our team specializes in navigating the unpredictable component market, leveraging our global network and deep expertise to help you find the necessary components when you need them.

























      I agree to receive newsletters and promotional emails. I can unsubscribe at any time.


      keyboard_arrow_up