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Total Products: 5,357
ImageData
Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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MPC8313ECZQADDC
MPC8313ECZQADDCNXP SemiconductorsIC MPU MPC83XX 267MHZ 516TEPBGAMicroprocessors516-TEPBGA (27x27)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
267MHz
Co-Processors/DSP:
Security; SEC 2.2
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Cryptography
Mounting Type:
Surface Mount
Package / Case:
516-BBGA Exposed Pad
Supplier Device Package:
516-TEPBGA (27×27)
Additional Interfaces:
DUART, HSSI, I2C, PCI, SPI
1,550
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MPC8313ECZQAFFC
MPC8313ECZQAFFCNXP SemiconductorsIC MPU MPC83XX 333MHZ 516TEPBGAMicroprocessors516-TEPBGA (27x27)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Co-Processors/DSP:
Security; SEC 2.2
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Cryptography
Mounting Type:
Surface Mount
Package / Case:
516-BBGA Exposed Pad
Supplier Device Package:
516-TEPBGA (27×27)
Additional Interfaces:
DUART, HSSI, I2C, PCI, SPI
138
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MPC8313ECZQAGDC
MPC8313ECZQAGDCNXP SemiconductorsIC MPU MPC83XX 400MHZ 516TEPBGAMicroprocessors516-TEPBGA (27x27)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Security; SEC 2.2
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Cryptography
Mounting Type:
Surface Mount
Package / Case:
516-BBGA Exposed Pad
Supplier Device Package:
516-TEPBGA (27×27)
Additional Interfaces:
DUART, HSSI, I2C, PCI, SPI
616
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QUOTE
MPC8313EVRADDB
MPC8313EVRADDBNXP SemiconductorsIC MPU MPC83XX 267MHZ 516TEPBGAMicroprocessors516-TEPBGA (27x27)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
267MHz
Mounting Type:
Surface Mount
441
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MPC8313EVRADDC
MPC8313EVRADDCNXP SemiconductorsIC MPU POWERQUICC II PRO 516PBGAMicroprocessors516-TEPBGA (27x27)N/AN/A
Mounting Type:
Surface Mount
Package / Case:
516-BBGA Exposed Pad
Supplier Device Package:
516-TEPBGA (27×27)
852
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MPC8313EVRAFF
MPC8313EVRAFFNXP SemiconductorsIC MPU MPC83XX 333MHZ 516TEPBGAMicroprocessors516-TEPBGA (27x27)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Mounting Type:
Surface Mount
139
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MPC8313EVRAFFB
MPC8313EVRAFFBNXP SemiconductorsIC MPU MPC83XX 333MHZ 516TEPBGAMicroprocessors516-TEPBGA (27x27)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Mounting Type:
Surface Mount
817
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QUOTE
MPC8313EVRAFFC
MPC8313EVRAFFCNXP SemiconductorsIC MPU MPC83XX 333MHZ 516TEPBGAMicroprocessors516-TEPBGA (27x27)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Co-Processors/DSP:
Security; SEC 2.2
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography
Mounting Type:
Surface Mount
Package / Case:
516-BBGA Exposed Pad
Supplier Device Package:
516-TEPBGA (27×27)
Additional Interfaces:
DUART, HSSI, I2C, PCI, SPI
688
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QUOTE
MPC8313EVRAGDB
MPC8313EVRAGDBNXP SemiconductorsIC MPU MPC83XX 400MHZ 516TEPBGAMicroprocessors516-TEPBGA (27x27)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Mounting Type:
Surface Mount
150
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MPC8313EVRAGDC
MPC8313EVRAGDCNXP SemiconductorsIC MPU POWERQUICC II PRO 516PBGAMicroprocessors516-TEPBGA (27x27)N/AN/A
Mounting Type:
Surface Mount
Package / Case:
516-BBGA Exposed Pad
Supplier Device Package:
516-TEPBGA (27×27)
398
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N/A
MPC8313EZQADDCNXP SemiconductorsIC MPU MPC83XX 267MHZ 516TEPBGAMicroprocessors516-TEPBGA (27x27)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
267MHz
Co-Processors/DSP:
Security; SEC 2.2
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography
Mounting Type:
Surface Mount
Package / Case:
516-BBGA Exposed Pad
Supplier Device Package:
516-TEPBGA (27×27)
Additional Interfaces:
DUART, HSSI, I2C, PCI, SPI
745
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MPC8313EZQAFFB
MPC8313EZQAFFBNXP SemiconductorsIC MPU MPC83XX 333MHZ 516TEPBGAMicroprocessors516-TEPBGA (27x27)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Mounting Type:
Surface Mount
235
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MPC8313EZQAFFC
MPC8313EZQAFFCNXP SemiconductorsIC MPU MPC83XX 333MHZ 516TEPBGAMicroprocessors516-TEPBGA (27x27)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Co-Processors/DSP:
Security; SEC 2.2
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography
Mounting Type:
Surface Mount
Package / Case:
516-BBGA Exposed Pad
Supplier Device Package:
516-TEPBGA (27×27)
Additional Interfaces:
DUART, HSSI, I2C, PCI, SPI
1,271
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QUOTE
MPC8313EZQAGDC
MPC8313EZQAGDCNXP SemiconductorsIC MPU MPC83XX 400MHZ 516TEPBGAMicroprocessors516-TEPBGA (27x27)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Security; SEC 2.2
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography
Mounting Type:
Surface Mount
Package / Case:
516-BBGA Exposed Pad
Supplier Device Package:
516-TEPBGA (27×27)
Additional Interfaces:
DUART, HSSI, I2C, PCI, SPI
804
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MPC8313VRADDB
MPC8313VRADDBNXP SemiconductorsIC MPU MPC83XX 267MHZ 516TEPBGAMicroprocessors516-TEPBGA (27x27)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
267MHz
Mounting Type:
Surface Mount
448
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QUOTE
MPC8313VRADDC
MPC8313VRADDCNXP SemiconductorsIC MPU POWERQUICC II PRO 516PBGAMicroprocessors516-TEPBGA (27x27)N/AN/A
Mounting Type:
Surface Mount
Package / Case:
516-BBGA Exposed Pad
Supplier Device Package:
516-TEPBGA (27×27)
1,227
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QUOTE
MPC8313VRAFF
MPC8313VRAFFNXP SemiconductorsIC MPU MPC83XX 333MHZ 516TEPBGAMicroprocessors516-TEPBGA (27x27)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Mounting Type:
Surface Mount
1,758
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QUOTE
MPC8313VRAFFB
MPC8313VRAFFBNXP SemiconductorsIC MPU MPC83XX 333MHZ 516TEPBGAMicroprocessors516-TEPBGA (27x27)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Mounting Type:
Surface Mount
8
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QUOTE
MPC8313VRAFFC
MPC8313VRAFFCNXP SemiconductorsIC MPU MPC83XX 333MHZ 516TEPBGAMicroprocessors516-TEPBGA (27x27)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300c3
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
USB:
USB 2.0 + PHY (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
516-BBGA Exposed Pad
Supplier Device Package:
516-TEPBGA (27×27)
Additional Interfaces:
DUART, HSSI, I2C, PCI, SPI
2
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QUOTE
MPC8313VRAGDC
MPC8313VRAGDCNXP SemiconductorsIC MPU POWERQUICC II PRO 516PBGAMicroprocessors516-TEPBGA (27x27)N/AN/A
Mounting Type:
Surface Mount
Package / Case:
516-BBGA Exposed Pad
Supplier Device Package:
516-TEPBGA (27×27)
486
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QUOTE

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