 | | SB80C186-20 | Advanced Micro Devices | IC MPU I186 20MHZ | Microprocessors | N/A | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 16-Bit Operating Temperature: 0°C ~ 70°C (TA) | 494 | |
 | | SB80C188-12 | Advanced Micro Devices | IC MPU I186 12MHZ | Microprocessors | N/A | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 16-Bit Operating Temperature: 0°C ~ 70°C (TA) | 1,400 | |
 | | SB80C188-16 | Advanced Micro Devices | IC MPU I186 16MHZ | Microprocessors | N/A | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 16-Bit Operating Temperature: 0°C ~ 70°C (TA) | 1,207 | |
 | | SB80C188-20 | Advanced Micro Devices | IC MPU I186 20MHZ | Microprocessors | N/A | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 16-Bit Operating Temperature: 0°C ~ 70°C (TA) | 1,636 | |
 | | SB80L186-16 | Advanced Micro Devices | IC MPU I186 16MHZ 80SQFP | Microprocessors | 80-SQFP | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 16-Bit Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 80-SQFP | 1,041 | |
| N/A | | SC1201UFH-266F 33 | Advanced Micro Devices | 32 BIT MICROPROCESSOR, GEODE, X8 | Microprocessors | N/A | N/A | N/A | N/A | 1,398 | |
| N/A | | SC1201UFH-266FR 33 | Advanced Micro Devices | 32 BIT MICROPROCESSOR, GEODE, X8 | Microprocessors | N/A | N/A | N/A | N/A | 712 | |
 | N/A | XA2S100E-6FT256Q | Advanced Micro Devices | IC FPGA 182 I/O 256FTBGA | FPGAs | 256-FTBGA (17x17) | 1.71 V - 1.89 V | -40°C – 125°C | Number of Logic Elements/Cells: 2700 | 1,586 | |
 | N/A | XA2S100E-6TQ144I | Advanced Micro Devices | IC FPGA 102 I/O 144TQFP | FPGAs | 144-TQFP (20x20) | 1.71 V - 1.89 V | -40°C – 100°C | Number of Logic Elements/Cells: 2700 | 786 | |
 | N/A | XA2S100E-6TQ144Q | Advanced Micro Devices | IC FPGA 102 I/O 144TQFP | FPGAs | 144-TQFP (20x20) | 1.71 V - 1.89 V | -40°C – 125°C | Number of Logic Elements/Cells: 2700 | 81 | |
 | N/A | XA2S150E-6FT256I | Advanced Micro Devices | IC FPGA 182 I/O 256FTBGA | FPGAs | 256-FTBGA (17x17) | 1.71 V - 1.89 V | -40°C – 100°C | Number of Logic Elements/Cells: 3888 | 1,158 | |
 | N/A | XA2S150E-6FT256Q | Advanced Micro Devices | IC FPGA 182 I/O 256FTBGA | FPGAs | 256-FTBGA (17x17) | 1.71 V - 1.89 V | -40°C – 125°C | Number of Logic Elements/Cells: 3888 | 1,290 | |
 | N/A | XA2S200E-6FT256I | Advanced Micro Devices | IC FPGA 182 I/O 256FTBGA | FPGAs | 256-FTBGA (17x17) | 1.71 V - 1.89 V | -40°C – 100°C | Number of Logic Elements/Cells: 5292 | 856 | |
 | | XA2S200E-6FT256Q | Advanced Micro Devices | IC FPGA 182 I/O 256FTBGA | FPGAs | 256-FTBGA (17x17) | 1.71V ~ 1.89V | -40°C ~ 125°C (TJ) | Number of Logic Elements/Cells: 5292 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Supplier Device Package: 256-FTBGA (17×17) | 637 | |
 | | XA2S300E-6FT256I | Advanced Micro Devices | IC FPGA 182 I/O 256FTBGA | FPGAs | 256-FTBGA (17x17) | 1.71V ~ 1.89V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 6912 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 256-FTBGA (17×17) | 1,235 | |
 | N/A | XA2S300E-6FT256Q | Advanced Micro Devices | IC FPGA 182 I/O 256FTBGA | FPGAs | 256-FTBGA (17x17) | 1.71 V - 1.89 V | -40°C – 125°C | Number of Logic Elements/Cells: 6912 | 1,379 | |
 | | XA2S50E-6TQ144I | Advanced Micro Devices | IC FPGA 102 I/O 144TQFP | FPGAs | 144-TQFP (20x20) | 1.71V ~ 1.89V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 1728 Voltage – Supply: 1.71V ~ 1.89V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 144-TQFP (20×20) | 96 | |
 | N/A | XA2S50E-6TQ144Q | Advanced Micro Devices | IC FPGA 102 I/O 144TQFP | FPGAs | 144-TQFP (20x20) | 1.71 V - 1.89 V | -40°C – 125°C | Number of Logic Elements/Cells: 1728 | 244 | |
 | | XA3S1000-4FGG456I | Advanced Micro Devices | IC FPGA 333 I/O 456FBGA | FPGAs | 456-FBGA (23x23) | 1.14V ~ 1.26V | -40°C ~ 100°C (TJ) | Number of Logic Elements/Cells: 17280 Voltage – Supply: 1.14V ~ 1.26V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Supplier Device Package: 456-FBGA (23×23) | 66 | |
 | | XA3S1000-4FGG456Q | Advanced Micro Devices | IC FPGA 333 I/O 456FBGA | FPGAs | 456-FBGA (23x23) | 1.14 V - 1.26 V | -40°C – 125°C | Number of Logic Elements/Cells: 17280 | 157 | |