 | | APA750-BGG456 | Microchip Technology | IC FPGA 356 I/O 456BGA | FPGAs | 456-PBGA (35x35) | 2.3 V - 2.7 V | 0°C – 70°C | Number of LABs/CLBs: 32768 Number of Logic Elements/Cells: 32768 | 278 | |
 | | APA750-BGG456I | Microchip Technology | IC FPGA 356 I/O 456BGA | FPGAs | 456-PBGA (35x35) | 2.3 V - 2.7 V | -40°C – 85°C | Number of LABs/CLBs: 32768 Number of Logic Elements/Cells: 32768 | 218 | |
 | | APA750-FG896 | Microchip Technology | IC FPGA 562 I/O 896FBGA | FPGAs | 896-FBGA (31x31) | 2.3 V - 2.7 V | 0°C – 70°C | Number of LABs/CLBs: 32768 Number of Logic Elements/Cells: 32768 | 1,125 | |
 | | APA750-FG896A | Microchip Technology | IC FPGA 562 I/O 896FBGA | FPGAs | 896-FBGA (31x31) | 2.375 V - 2.625 V | -40°C – 125°C | Number of LABs/CLBs: 32768 Number of Logic Elements/Cells: 32768 | 1,305 | |
 | | APA750-FG896I | Microchip Technology | IC FPGA 562 I/O 896FBGA | FPGAs | 896-FBGA (31x31) | 2.3 V - 2.7 V | -40°C – 85°C | Number of LABs/CLBs: 32768 Number of Logic Elements/Cells: 32768 | 1,792 | |
 | | APA750-FGG896 | Microchip Technology | IC FPGA 562 I/O 896FBGA | FPGAs | 896-FBGA (31x31) | 2.3 V - 2.7 V | 0°C – 70°C | Number of LABs/CLBs: 32768 Number of Logic Elements/Cells: 32768 | 714 | |
 | | APA750-FGG896A | Microchip Technology | IC FPGA 562 I/O 896FBGA | FPGAs | 896-FBGA (31x31) | 2.375 V - 2.625 V | -40°C – 125°C | Number of LABs/CLBs: 32768 Number of Logic Elements/Cells: 32768 | 1,084 | |
 | | APA750-FGG896I | Microchip Technology | IC FPGA 562 I/O 896FBGA | FPGAs | 896-FBGA (31x31) | 2.3 V - 2.7 V | -40°C – 85°C | Number of LABs/CLBs: 32768 Number of Logic Elements/Cells: 32768 | 148 | |
 | | APA750-PQ208 | Microchip Technology | IC FPGA 158 I/O 208QFP | FPGAs | 208-PQFP (28x28) | 2.3 V - 2.7 V | 0°C – 70°C | Number of LABs/CLBs: 32768 Number of Logic Elements/Cells: 32768 | 453 | |
 | | APA750-PQ208A | Microchip Technology | IC FPGA 158 I/O 208QFP | FPGAs | 208-PQFP (28x28) | 2.375 V - 2.625 V | -40°C – 125°C | Number of LABs/CLBs: 32768 Number of Logic Elements/Cells: 32768 | 263 | |
 | | APA750-PQ208I | Microchip Technology | IC FPGA 158 I/O 208QFP | FPGAs | 208-PQFP (28x28) | 2.3 V - 2.7 V | -40°C – 85°C | Number of LABs/CLBs: 32768 Number of Logic Elements/Cells: 32768 | 609 | |
 | | APA750-PQG208 | Microchip Technology | IC FPGA 158 I/O 208QFP | FPGAs | 208-PQFP (28x28) | 2.3 V - 2.7 V | 0°C – 70°C | Number of LABs/CLBs: 32768 Number of Logic Elements/Cells: 32768 | 823 | |
 | | APA750-PQG208A | Microchip Technology | IC FPGA 158 I/O 208QFP | FPGAs | 208-PQFP (28x28) | 2.375 V - 2.625 V | -40°C – 125°C | Number of LABs/CLBs: 32768 Number of Logic Elements/Cells: 32768 | 617 | |
 | | APA750-PQG208I | Microchip Technology | IC FPGA 158 I/O 208QFP | FPGAs | 208-PQFP (28x28) | 2.3 V - 2.7 V | -40°C – 85°C | Number of LABs/CLBs: 32768 Number of Logic Elements/Cells: 32768 | 1,499 | |
 | | AT32AP7000-CTUR | Microchip Technology | IC MCU 32BIT ROMLESS 256CTBGA | Microcontrollers | 256-CTBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, I2C, Memory Card, PS/2, SPI, SSC, UART/USART, USB Peripherals: AC’97, DMA, I2S, LCD, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.65V ~ 1.95V Data Converters: D/A 2x16b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-CTBGA (17×17) | 1,277 | |
 | | AT32AP7000-CTUT | Microchip Technology | IC MCU 32BIT ROMLESS 256CTBGA | Microcontrollers | 256-CTBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, I2C, Memory Card, PS/2, SPI, SSC, UART/USART, USB Peripherals: AC’97, DMA, I2S, LCD, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.65V ~ 1.95V Data Converters: D/A 2x16b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-CTBGA (17×17) | 763 | |
 | | AT32AP7001-ALUT | Microchip Technology | IC MCU 32BIT ROMLESS 208LQFP | Microcontrollers | 208-LQFP (28x28) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, I2C, Memory Card, PS/2, SPI, SSC, UART/USART, USB Peripherals: AC’97, DMA, I2S, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.65V ~ 1.95V Data Converters: D/A 2x16b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-LQFP (28×28) | 182 | |
 | | AT32AP7002-CTUR | Microchip Technology | IC MCU 32BIT ROMLESS 196CTBGA | Microcontrollers | 196-CTBGA (12x12) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, I2C, Memory Card, PS/2, SPI, SSC, UART/USART, USB Peripherals: AC’97, DMA, I2S, LCD, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.65V ~ 1.95V Data Converters: D/A 2x16b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 196-CTBGA (12×12) Package / Case: 196-TFBGA, CSBGA | 1,878 | |
 | | AT32AP7002-CTUT | Microchip Technology | IC MCU 32BIT ROMLESS 196CTBGA | Microcontrollers | 196-CTBGA (12x12) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, I2C, Memory Card, PS/2, SPI, SSC, UART/USART, USB Peripherals: AC’97, DMA, I2S, LCD, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.65V ~ 1.95V Data Converters: D/A 2x16b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 196-CTBGA (12×12) Package / Case: 196-TFBGA, CSBGA | 175 | |
 | | AT32AP7200-CFUR | Microchip Technology | IC MCU 32BIT ROMLESS 324TFBGA | Microcontrollers | 324-TFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, I2C, Memory Card, SPI, SSC, UART/USART Peripherals: AC’97, DMA, I2S, LCD, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.08V ~ 3.6V Data Converters: D/A 2x16b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 324-TFBGA (15×15) | 655 | |