 | | XMSP432P401RIPZR | Texas Instruments | IC MCU 32BIT 256KB FLASH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Connectivity: I2C, IrDA, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.62V ~ 3.7V Data Converters: A/D 26x14b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 659 | |
 | | XOMAP3503BCBB | Texas Instruments | IC MPU OMAP-35XX 600MHZ 515FCBGA | Microprocessors | 515-POP-FCBGA (12x12) | N/A | 0°C ~ 90°C (TJ) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD Display & Interface Controllers: LCD USB: USB 1.x (3), USB 2.0 (1) Operating Temperature: 0°C ~ 90°C (TJ) Mounting Type: Surface Mount Package / Case: 515-VFBGA, FCBGA Supplier Device Package: 515-POP-FCBGA (12×12) Additional Interfaces: HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | 542 | |
 | | XOMAP3515BCBB | Texas Instruments | IC MPU OMAP-35XX 600MHZ 515FCBGA | Microprocessors | 515-POP-FCBGA (12x12) | N/A | 0°C ~ 90°C (TJ) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD Graphics Acceleration: Yes Display & Interface Controllers: LCD USB: USB 1.x (3), USB 2.0 (1) Operating Temperature: 0°C ~ 90°C (TJ) Mounting Type: Surface Mount Package / Case: 515-VFBGA, FCBGA Supplier Device Package: 515-POP-FCBGA (12×12) Additional Interfaces: HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | 1,248 | |
 | | XOMAP3525BCBB | Texas Instruments | IC MPU OMAP-35XX 600MHZ 515FCBGA | Microprocessors | 515-POP-FCBGA (12x12) | N/A | 0°C ~ 90°C (TJ) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; C64x+, Multimedia; NEON™ SIMD Graphics Acceleration: Yes Display & Interface Controllers: LCD USB: USB 1.x (3), USB 2.0 (1) Operating Temperature: 0°C ~ 90°C (TJ) Mounting Type: Surface Mount Package / Case: 515-VFBGA, FCBGA Supplier Device Package: 515-POP-FCBGA (12×12) Additional Interfaces: HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | 519 | |
 | | XOMAP3530BCBB | Texas Instruments | IC MPU OMAP-35XX 600MHZ 515FCBGA | Microprocessors | 515-POP-FCBGA (12x12) | N/A | 0°C ~ 90°C (TJ) | Core Processor: ARM® Cortex®-A8 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; C64x+, Multimedia; NEON™ SIMD Graphics Acceleration: Yes Display & Interface Controllers: LCD USB: USB 1.x (3), USB 2.0 (1) Operating Temperature: 0°C ~ 90°C (TJ) Mounting Type: Surface Mount Package / Case: 515-VFBGA, FCBGA Supplier Device Package: 515-POP-FCBGA (12×12) Additional Interfaces: HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART | 791 | |
| N/A | | XOMAPL137AZKB3 | Texas Instruments | IC MPU OMAP-L1X 300MHZ 256BGA | Microprocessors | 256-BGA | N/A | 0°C ~ 90°C (TJ) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; C674x, System Control; CP15 Display & Interface Controllers: LCD USB: USB 1.1 + PHY (1), USB 2.0 + PHY (1) Operating Temperature: 0°C ~ 90°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 256-BGA Additional Interfaces: HPI, I2C, McASP, MMC/SD, SPI, UART | 947 | |
 | | XOMAPL137BZKB3 | Texas Instruments | IC MPU OMAP-L1X 375MHZ 256BGA | Microprocessors | 256-BGA (17x17) | N/A | 0°C ~ 90°C (TJ) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; C674x, System Control; CP15 Display & Interface Controllers: LCD USB: USB 1.1 + PHY (1), USB 2.0 + PHY (1) Operating Temperature: 0°C ~ 90°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 256-BGA (17×17) Additional Interfaces: HPI, I2C, McASP, MMC/SD, SPI, UART | 758 | |
 | | XOMAPL137DZKBA3 | Texas Instruments | IC MPU OMAP-L1X 375MHZ 256BGA | Microprocessors | 256-BGA (17x17) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; C674x, System Control; CP15 Display & Interface Controllers: LCD USB: USB 1.1 + PHY (1), USB 2.0 + PHY (1) Operating Temperature: -40°C ~ 105°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 256-BGA (17×17) Additional Interfaces: HPI, I2C, McASP, MMC/SD, SPI, UART | 833 | |
 | | XOMAPL138ZCE | Texas Instruments | IC MPU OMAP-L1X 300MHZ 361NFBGA | Microprocessors | 361-NFBGA (13x13) | N/A | 0°C ~ 90°C (TJ) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; C674x, System Control; CP15 Display & Interface Controllers: LCD USB: USB 1.1 + PHY (1), USB 2.0 + PHY (1) Operating Temperature: 0°C ~ 90°C (TJ) Security Features: Boot Security, Cryptography Mounting Type: Surface Mount Supplier Device Package: 361-NFBGA (13×13) Additional Interfaces: HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART | 904 | |
 | | XOMAPL138ZWT | Texas Instruments | IC MPU OMAP-L1X 300MHZ 361NFBGA | Microprocessors | 361-NFBGA (16x16) | N/A | 0°C ~ 90°C (TJ) | Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; C674x, System Control; CP15 Display & Interface Controllers: LCD USB: USB 1.1 + PHY (1), USB 2.0 + PHY (1) Operating Temperature: 0°C ~ 90°C (TJ) Security Features: Boot Security, Cryptography Mounting Type: Surface Mount Supplier Device Package: 361-NFBGA (16×16) Additional Interfaces: HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART | 52 | |
 | | XPC823CZT66B2T | NXP Semiconductors | IC MPU MPC8XX 66MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | -40°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM Display & Interface Controllers: LCD, Video Operating Temperature: -40°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) Additional Interfaces: I2C, SMC, SCC, SPI, UART | 910 | |
| N/A | | XPC823ECZT66BA | NXP Semiconductors | IC MPU 66MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | -40°C ~ 95°C (TJ) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM Display & Interface Controllers: LCD, Video Operating Temperature: -40°C ~ 95°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) Additional Interfaces: I2C, SMC, SCC, SPI, UART | 1,208 | |
 | | XPC823EVR66B2 | NXP Semiconductors | IC MPU MPC8XX 66MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM Display & Interface Controllers: LCD, Video Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) Additional Interfaces: I2C, SMC, SCC, SPI, UART | 736 | |
 | | XPC823EVR75B2 | NXP Semiconductors | IC MPU MPC8XX 75MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM Display & Interface Controllers: LCD, Video Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) Additional Interfaces: I2C, SMC, SCC, SPI, UART | 700 | |
| N/A | N/A | XPC823EZT66BA | NXP Semiconductors | IC MPU 66MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TJ) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM Display & Interface Controllers: LCD, Video Operating Temperature: 0°C ~ 95°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) Additional Interfaces: I2C, SMC, SCC, SPI, UART | 97 | |
| N/A | | XPC823EZT75BA | NXP Semiconductors | IC MPU 75MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TJ) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM Display & Interface Controllers: LCD, Video Operating Temperature: 0°C ~ 95°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) Additional Interfaces: I2C, SMC, SCC, SPI, UART | 537 | |
 | | XPC823ZT66B2T | NXP Semiconductors | IC MPU MPC8XX 66MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM Display & Interface Controllers: LCD, Video Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) Additional Interfaces: I2C, SMC, SCC, SPI, UART | 752 | |
 | | XPC823ZT75B2T | NXP Semiconductors | IC MPU MPC8XX 75MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM Display & Interface Controllers: LCD, Video Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) Additional Interfaces: I2C, SMC, SCC, SPI, UART | 714 | |
 | | XPC823ZT81B2T | NXP Semiconductors | IC MPU MPC8XX 81MHZ 256BGA | Microprocessors | 256-PBGA (23x23) | N/A | 0°C ~ 95°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM Display & Interface Controllers: LCD, Video Operating Temperature: 0°C ~ 95°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-PBGA (23×23) Additional Interfaces: I2C, SMC, SCC, SPI, UART | 1,031 | |
 | | XPC8240LVV200E | NXP Semiconductors | IC MPU MPC82XX 200MHZ 352TBGA | Microprocessors | 352-TBGA (35x35) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC 603e Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DRAM, SDRAM Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 352-TBGA (35×35) Additional Interfaces: I2C, I²O, PCI, UART | 779 | |