10AX016E4F29I3SG

The 10AX016E4F29I3SG is an Intel Arria 10 GX field programmable gate array (FPGA) IC intended for mid-range, high-performance and power-sensitive applications. It combines a large logic fabric, substantial on-chip memory, and a high I/O count in a compact 780‑ball FCBGA package.

Devices in the Arria 10 family are described as delivering higher performance and improved power efficiency; this part provides capacity and environmental specs that suit markets such as wireless and wireline infrastructure, broadcast, computing and storage, medical, and military systems.

Key Features

• Core / Family: Intel Arria 10 GX series FPGA family—20‑nm mid-range devices aimed at performance and power efficiency.
• Logic Capacity: 160,000 logic elements for complex digital designs.
• Embedded Memory: 10,086,400 total RAM bits to support on-chip buffering and state storage.
• I/O Count: 288 user I/Os to interface with external devices and subsystems.
• Power Supply: Nominal supply range 870 mV to 930 mV for core operation.
• Package & Mounting: 780‑BBGA FCBGA package (supplier package: 780‑FBGA, 29×29), surface-mount monting for PCB assembly.
• Operating Range & Grade: Industrial grade with an operating temperature range of -40 °C to 100 °C.
• Environmental Compliance: RoHS compliant.

Typical Applications

• Wireless infrastructure: Channel and switch cards in remote radio heads and mobile backhaul systems that require high logic and memory capacity.
• Wireline and optical networking: Line cards, muxponders and transponders where dense logic and multiple I/Os support aggregation and bridging functions.
• Broadcast and professional AV: Studio switches, transport and videoconferencing equipment benefitting from on-chip memory and I/O density.
• Computing and storage acceleration: Cache and server acceleration roles that use large logic arrays and embedded RAM for data-path processing.
• Medical and defense systems: Diagnostic imaging, radar and secure communications implementations requiring industrial temperature operation and high integration.

Unique Advantages

• High logic density: 160,000 logic elements enable integration of complex processing blocks and control logic on a single device.
• Substantial on-chip RAM: Over 10 million RAM bits reduce dependence on external memory for buffering and state retention.
• Generous I/O resources: 288 I/Os provide flexibility for interfacing to a wide range of peripherals, memory interfaces, and system signals.
• Industrial temperature capability: Rated from -40 °C to 100 °C to support deployment in thermally demanding environments.
• Compact BGA package: 780‑FBGA (29×29) surface-mount package balances board-space efficiency with high pin count.
• Low-voltage core operation: 870–930 mV supply range supports power-sensitive designs and aligns with Arria 10 family power-efficiency goals.

Why Choose 10AX016E4F29I3SG?

The 10AX016E4F29I3SG positions itself as a high-capacity Arria 10 GX FPGA option for engineers who need significant logic resources, large embedded memory, and extensive I/O in a single, industrial-grade package. Its specification set is suited to mid-range systems that balance performance and power considerations.

Selecting this part provides access to the Arria 10 device family characteristics—performance, power-efficiency emphasis, and series documentation—making it appropriate for designs in wireless/wireline infrastructure, professional AV, storage acceleration, medical imaging and defense applications that require scalable, on-chip integration.

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