10AX022C3U19I2LG

IC FPGA 240 I/O 484UBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 240 13752320 220000 484-BFBGA

Quantity 1,144 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-UBGA (19x19)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BFBGANumber of I/O240Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs80330Number of Logic Elements/Cells220000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits13752320

Overview of 10AX022C3U19I2LG – Arria 10 GX FPGA, 484-BFBGA

The 10AX022C3U19I2LG is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) IC designed for midrange, high-performance and power-sensitive applications. It is part of the Arria 10 family of 20 nm devices and provides a combination of programmable logic, embedded memory and integrated high-speed interfaces.

This device is offered in a 484-BFBGA (484-UBGA, 19×19) surface-mount package, is rated for industrial operation, and targets markets such as wireless, wireline, broadcast, computing and storage, medical and defense where programmable, reconfigurable logic and high I/O density are required.

Key Features

  • Logic Capacity  Approximately 220,000 logic elements to implement complex digital functions and custom acceleration.
  • Embedded Memory  13,752,320 total RAM bits of on‑chip memory for buffering, lookup tables and fast local storage.
  • I/O and Package  240 user I/O pins in a 484-BFBGA (484-UBGA, 19×19) surface-mount package suited for high-density board designs.
  • DSP and Compute  Variable-precision DSP blocks and adaptive logic modules for arithmetic-intensive operations and signal processing tasks.
  • High-speed Interfaces & IP  Integrated support for PCIe Gen1/Gen2/Gen3 hard IP, enhanced PCS for Interlaken and 10 Gbps Ethernet, and low-power serial transceivers for demanding serial links.
  • Clocking and PLLs  Comprehensive clock networks with PLL clock sources, including fractional synthesis and I/O PLLs for flexible timing architectures.
  • External Memory Support  Built-in external memory interface features and support for industry memory standards used with Arria 10 devices.
  • Power Supply  Core supply range specified at 870 mV to 930 mV to support targeted power architectures.
  • Operating Range  Industrial-grade operating temperature range from −40 °C to 100 °C for deployment in demanding environments.
  • Standards & Compliance  RoHS compliant.

Typical Applications

  • Wireless Infrastructure  Channel and switch cards in remote radio heads and mobile backhaul where programmable logic and DSP resources accelerate RF and baseband processing.
  • Wireline Networking  Line cards, muxponders and transponders (including 40G/100G elements) that require high-speed serial interfaces and protocol hard IP.
  • Broadcast and AV  Studio switches, professional video and transport equipment that need deterministic processing and flexible I/O.
  • Compute & Storage  Server acceleration, flash cache and cloud infrastructure tasks that leverage on-chip logic and memory for low-latency data processing.
  • Medical & Defense  Diagnostic imaging, radar and electronic warfare systems that require reconfigurable compute and robust thermal/voltage tolerance.

Unique Advantages

  • High Logic Density:  220,000 logic elements enable implementation of complex custom logic and acceleration within a single device.
  • Large On‑Chip Memory:  Over 13.7 Mb of embedded RAM reduces dependence on external memory for many buffering and lookup tasks.
  • Integrated High‑Speed IP:  Built-in PCIe and Ethernet/Interlaken PCS IP plus low-power transceivers simplify high-bandwidth interface design.
  • Flexible Clocking:  Robust clock networks and PLL options support varied timing topologies and fractional synthesis needs.
  • Industrial Thermal Range:  −40 °C to 100 °C rating supports deployment in temperature-challenging environments.
  • Compact, High‑Density Package:  484‑BFBGA (19×19) package offers a balance of I/O count and board area for dense system designs.

Why Choose 10AX022C3U19I2LG?

The 10AX022C3U19I2LG Arria 10 GX FPGA combines substantial logic capacity, significant embedded memory, and integrated high-speed interface IP in an industrial-grade, surface-mount 484-BFBGA package. It is positioned for midrange designs that require reconfigurable compute, efficient DSP resources, and reliable operation across a wide temperature range.

This device is suitable for engineering teams building wireless infrastructure, networking equipment, broadcast systems, compute/storage accelerators, and mission-critical imaging or defense electronics that benefit from programmable logic, embedded memory and standardized high-speed interfaces.

Request a quote or submit an inquiry today to obtain pricing and availability for the 10AX022C3U19I2LG Arria 10 GX FPGA.

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