10AX022C3U19E2SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 240 13752320 220000 484-BFBGA |
|---|---|
| Quantity | 556 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-UBGA (19x19) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BFBGA | Number of I/O | 240 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 80330 | Number of Logic Elements/Cells | 220000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 13752320 |
Overview of 10AX022C3U19E2SG – Arria 10 GX Field Programmable Gate Array (FPGA) IC
The 10AX022C3U19E2SG is an Intel Arria 10 GX series FPGA device built on a 20 nm mid-range FPGA architecture. It combines substantial programmable logic capacity, embedded memory, and high-speed I/O to address performance-sensitive, power-conscious applications across communications, broadcast, computing, medical, and defense markets.
As a member of the Arria 10 family, this device emphasizes performance and power efficiency, offering integrated transceiver and interface capabilities and a package suited for high-density board designs.
Key Features
- Core Capacity 220,000 logic elements for implementing complex logic, control, and datapath functions.
- Embedded Memory 13,752,320 total RAM bits of on-chip memory to support buffering, packet processing, and local data storage.
- I/O and Connectivity 240 I/O pins and integrated low-power serial transceiver capability (series-level feature) to support high-speed links and interface flexibility.
- DSP and Processing Variable-precision DSP blocks and series-level support for SoC-style integration, enabling signal processing and hardware acceleration tasks.
- High-speed Protocol Support Series documentation lists PCIe Gen1/Gen2/Gen3 hard IP and 10 Gbps Ethernet support for common high-bandwidth protocols.
- Power and Voltage Supply voltage range from 870 mV to 930 mV and platform-level power-saving technologies aimed at improving energy efficiency.
- Package & Mounting 484-BFBGA package in a 484-UBGA (19×19) footprint with surface-mount mounting for compact, high-density board layouts.
- Operating Range & Grade Extended grade with an operating temperature range of 0°C to 100°C.
- Environmental Compliance RoHS compliant.
Typical Applications
- Wireless Infrastructure Channel and switch cards in remote radio heads and mobile backhaul nodes that require programmable logic and transceiver connectivity.
- Wireline Networking 40G/100G muxponders, transponders, and 100G line cards for packet aggregation, bridging, and high-speed transport functions.
- Broadcast & Media Studio switching, transport servers, videoconferencing, and professional audio/video processing where low-latency, flexible logic is needed.
- Computing & Storage Flash cache, cloud server acceleration, and other server offload functions that benefit from programmable acceleration and on-chip memory.
- Medical & Defense Systems Diagnostic imaging, scanner control, radar, missile guidance, and secure communications that leverage DSP blocks and configurable logic.
Unique Advantages
- Substantial Logic Resources: 220,000 logic elements provide headroom for complex algorithms, packet engines, and custom accelerators.
- Large On‑Chip Memory: Over 13.7 million RAM bits reduce dependence on external memory for many buffering and local storage needs.
- Integrated High‑Speed Interfaces: 240 I/Os combined with series-level transceiver and protocol hard IP options simplify high-bandwidth system design.
- Power‑Efficient Architecture: Part of the Arria 10 family designed for improved performance-per-watt through platform power-saving features.
- High‑Density Packaging: 484-BFBGA (484-UBGA 19×19) surface-mount package supports compact PCB layouts with high I/O count.
- Extended Operating Grade: 0°C to 100°C rating and Extended grade classification for deployments requiring broader commercial thermal range.
Why Choose 10AX022C3U19E2SG?
The 10AX022C3U19E2SG positions itself as a flexible, high-capacity FPGA option within the Intel Arria 10 family, offering a balance of logic density, embedded memory, and connectivity to meet mid-range performance and power targets. Its feature set aligns with designs that require programmable acceleration, complex signal processing, and multi-protocol interface support.
Engineers and procurement teams can deploy this device in communications, compute acceleration, broadcast, medical, and defense applications where scalable logic, integrated memory, and high-speed I/O reduce system complexity and BOM count. The Arria 10 family documentation and device resources provide guidance for integration and platform-level design considerations.
Request a quote or contact sales to discuss availability, pricing, and lead times for the 10AX022C3U19E2SG and to get assistance matching this device to your design requirements.

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