10AX022C3U19E2SG

IC FPGA 240 I/O 484UBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 240 13752320 220000 484-BFBGA

Quantity 556 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-UBGA (19x19)GradeExtendedOperating Temperature0°C – 100°C
Package / Case484-BFBGANumber of I/O240Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs80330Number of Logic Elements/Cells220000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits13752320

Overview of 10AX022C3U19E2SG – Arria 10 GX Field Programmable Gate Array (FPGA) IC

The 10AX022C3U19E2SG is an Intel Arria 10 GX series FPGA device built on a 20 nm mid-range FPGA architecture. It combines substantial programmable logic capacity, embedded memory, and high-speed I/O to address performance-sensitive, power-conscious applications across communications, broadcast, computing, medical, and defense markets.

As a member of the Arria 10 family, this device emphasizes performance and power efficiency, offering integrated transceiver and interface capabilities and a package suited for high-density board designs.

Key Features

  • Core Capacity  220,000 logic elements for implementing complex logic, control, and datapath functions.
  • Embedded Memory  13,752,320 total RAM bits of on-chip memory to support buffering, packet processing, and local data storage.
  • I/O and Connectivity  240 I/O pins and integrated low-power serial transceiver capability (series-level feature) to support high-speed links and interface flexibility.
  • DSP and Processing  Variable-precision DSP blocks and series-level support for SoC-style integration, enabling signal processing and hardware acceleration tasks.
  • High-speed Protocol Support  Series documentation lists PCIe Gen1/Gen2/Gen3 hard IP and 10 Gbps Ethernet support for common high-bandwidth protocols.
  • Power and Voltage  Supply voltage range from 870 mV to 930 mV and platform-level power-saving technologies aimed at improving energy efficiency.
  • Package & Mounting  484-BFBGA package in a 484-UBGA (19×19) footprint with surface-mount mounting for compact, high-density board layouts.
  • Operating Range & Grade  Extended grade with an operating temperature range of 0°C to 100°C.
  • Environmental Compliance  RoHS compliant.

Typical Applications

  • Wireless Infrastructure  Channel and switch cards in remote radio heads and mobile backhaul nodes that require programmable logic and transceiver connectivity.
  • Wireline Networking  40G/100G muxponders, transponders, and 100G line cards for packet aggregation, bridging, and high-speed transport functions.
  • Broadcast & Media  Studio switching, transport servers, videoconferencing, and professional audio/video processing where low-latency, flexible logic is needed.
  • Computing & Storage  Flash cache, cloud server acceleration, and other server offload functions that benefit from programmable acceleration and on-chip memory.
  • Medical & Defense Systems  Diagnostic imaging, scanner control, radar, missile guidance, and secure communications that leverage DSP blocks and configurable logic.

Unique Advantages

  • Substantial Logic Resources: 220,000 logic elements provide headroom for complex algorithms, packet engines, and custom accelerators.
  • Large On‑Chip Memory: Over 13.7 million RAM bits reduce dependence on external memory for many buffering and local storage needs.
  • Integrated High‑Speed Interfaces: 240 I/Os combined with series-level transceiver and protocol hard IP options simplify high-bandwidth system design.
  • Power‑Efficient Architecture: Part of the Arria 10 family designed for improved performance-per-watt through platform power-saving features.
  • High‑Density Packaging: 484-BFBGA (484-UBGA 19×19) surface-mount package supports compact PCB layouts with high I/O count.
  • Extended Operating Grade: 0°C to 100°C rating and Extended grade classification for deployments requiring broader commercial thermal range.

Why Choose 10AX022C3U19E2SG?

The 10AX022C3U19E2SG positions itself as a flexible, high-capacity FPGA option within the Intel Arria 10 family, offering a balance of logic density, embedded memory, and connectivity to meet mid-range performance and power targets. Its feature set aligns with designs that require programmable acceleration, complex signal processing, and multi-protocol interface support.

Engineers and procurement teams can deploy this device in communications, compute acceleration, broadcast, medical, and defense applications where scalable logic, integrated memory, and high-speed I/O reduce system complexity and BOM count. The Arria 10 family documentation and device resources provide guidance for integration and platform-level design considerations.

Request a quote or contact sales to discuss availability, pricing, and lead times for the 10AX022C3U19E2SG and to get assistance matching this device to your design requirements.

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