10AX022C4U19E3LG

The 10AX022C4U19E3LG is an Intel Arria 10 GX field programmable gate array (FPGA) supplied in a 484‑BFBGA package. It delivers substantial programmable logic and on‑chip memory combined with a package and I/O count suited for mid‑range, performance‑sensitive designs.

As part of the Arria 10 device family — built on a 20 nm architecture — this FPGA targets applications across wireless and wireline communications, broadcast, computing and storage, and other markets that require a balance of performance and power efficiency. Key hardware data points include 220,000 logic elements, 13,752,320 bits of embedded RAM, and 240 I/O pins.

Key Features

• Logic Capacity — 220,000 logic elements for implementing complex custom logic, protocol handling, and hardware acceleration.
• Embedded Memory — 13,752,320 total RAM bits providing on‑chip storage for buffers, lookup tables, and state machines.
• I/O — 240 user I/O pins, enabling broad external interfacing options for high‑density connectivity.
• Package — 484‑BFBGA (supplier package listed as 484‑UBGA, 19 × 19) optimized for surface‑mount board assembly and compact system integration.
• Power Supply Range — Core voltage support from 870 mV to 980 mV, allowing designers to plan power delivery for the FPGA core.
• Operating Temperature & Grade — Extended grade with an operating range of 0 °C to 100 °C suitable for controlled ambient environments.
• Mounting — Surface mount device for standard PCB assembly processes.
• Standards & Compliance — RoHS compliant.
• Arria 10 Family Attributes — Part of the Arria 10 series, which emphasizes higher performance and power efficiency for mid‑range FPGA applications (family overview provided in Intel documentation).

Typical Applications

• Wireless Infrastructure: Channel and switch cards in remote radio heads and mobile backhaul equipment where programmable logic and I/O density support RF front‑end control and data aggregation.
• Wireline Communications: Line cards, muxponders and transponders — including 40G/100G applications referenced for the Arria 10 family — leveraging on‑chip logic and memory for packet processing and protocol bridging.
• Broadcast and Professional AV: Studio switches, transport and video processing systems benefiting from high logic capacity and on‑chip RAM for real‑time media handling.
• Computing & Storage Acceleration: Server acceleration and flash cache roles that use programmable logic and embedded memory for custom offload and acceleration functions.

Unique Advantages

• High programmable capacity: 220,000 logic elements allow complex algorithm implementation and parallel processing objectives without immediate external logic expansion.
• Substantial on‑chip RAM: 13,752,320 bits of embedded RAM reduce dependence on external memory for buffering and local data storage.
• Generous I/O count: 240 I/O pins support multiple high‑density interfaces and simplify routing of parallel and serialized signals.
• Compact BGA footprint: 484‑BFBGA (484‑UBGA, 19×19) enables a high pin count in a compact board area for space‑constrained systems.
• Power and thermal planning data: Core voltage window (870–980 mV) and defined operating temperature (0 °C–100 °C) provide clear bounds for power delivery and thermal design.
• Documented platform: Backed by Arria 10 family documentation and device overview material, helping teams reference family capabilities and design guidance.

Why Choose 10AX022C4U19E3LG?

The 10AX022C4U19E3LG Arria 10 GX FPGA delivers a blend of high logic density, meaningful embedded memory, and extensive I/O in a compact BFBGA package. Its specification set is aimed at mid‑range applications that need programmable performance with defined power and thermal parameters.

Design teams targeting wireless and wireline communications, broadcast/video processing, or compute acceleration can use this device to implement complex custom hardware functions while leveraging Arria 10 family documentation for design guidance. The combination of capacity, I/O, and package makes it suitable for systems where integration density and predictable electrical/thermal planning are priorities.

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