10AX022E3F27E1HG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 240 13752320 220000 672-BBGA, FCBGA |
|---|---|
| Quantity | 1,026 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FBGA (27x27) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA, FCBGA | Number of I/O | 240 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 80330 | Number of Logic Elements/Cells | 220000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 13752320 |
Overview of 10AX022E3F27E1HG – Arria 10 GX FPGA, 220,000 Logic Elements, 672‑FBGA
The 10AX022E3F27E1HG is an Intel Arria 10 GX field-programmable gate array (FPGA) in a 672‑BBGA/FCBGA package intended for surface-mount applications. It belongs to the Arria 10 device family, a 20 nm mid-range FPGA family described as delivering higher performance and improved power efficiency for power-sensitive designs.
This device provides 220,000 logic elements, 13,752,320 total RAM bits, and 240 I/Os, making it suitable for mid-range applications that require significant logic density, embedded memory capacity, and flexible I/O resources. Key electrical and environmental characteristics include a core supply range of 870 mV to 930 mV and an operating temperature range of 0 °C to 100 °C.
Key Features
- Core Logic 220,000 logic elements provide substantial programmable resources for implementing complex digital functions and custom accelerators.
- Embedded Memory 13,752,320 total RAM bits for on-chip buffering, state storage, and memory-intensive algorithms.
- I/O Density 240 general-purpose I/O pins to support multiple interfaces and parallel buses in board-level designs.
- Package & Mounting 672‑BBGA (672‑FBGA, 27×27) package for surface-mount PCB assembly, enabling compact board layouts.
- Power & Voltage Core voltage supply specified from 870 mV to 930 mV to match design power domains and regulators.
- Temperature Grade Extended grade operation across 0 °C to 100 °C for applications requiring above-commercial temperature range performance.
- RoHS Compliance Device is RoHS compliant for regulatory and environmental requirements.
- Arria 10 Family Capabilities Device is part of the Arria 10 family, which includes features such as adaptive logic modules, variable-precision DSP blocks, embedded memory blocks, clock networks with PLLs, and support for high-speed serial transceivers and hard IP (PCIe Gen1/2/3, 10 Gbps Ethernet) as described in the product family documentation.
Typical Applications
- Wireless Infrastructure Channel and switch cards in remote radio heads and mobile backhaul designs that require programmable signal processing and I/O flexibility.
- Wireline Networking Line cards, muxponder/transponder subsystems, and aggregation equipment where mid-range FPGA performance and embedded memory are needed.
- Broadcast & Pro AV Studio switches, professional audio/video processing, and transport functions that benefit from on-chip buffering and programmable logic.
- Computing & Storage Cloud server acceleration, flash cache, and storage controllers that leverage logic density and embedded RAM.
- Medical & Imaging Diagnostic imaging and scanner subsystems that require custom processing pipelines and significant on-chip memory.
Unique Advantages
- High logic density: 220,000 logic elements allow implementation of complex algorithms and multi-function designs without immediate need for additional FPGAs.
- Substantial on-chip RAM: 13,752,320 total RAM bits reduce external memory dependence for many buffering and stateful processing tasks.
- Flexible I/O count: 240 I/Os support multiple peripheral interfaces and high-pin-count system integrations on a single device.
- Compact surface-mount package: 672‑FBGA (27×27) packaging enables dense PCB layouts while maintaining robust thermal and electrical characteristics.
- Family-level system features: As part of the Arria 10 family, the device benefits from series capabilities such as DSP blocks, PLL-based clocking, and support for high-speed serial and protocol hard IP, aiding faster system integration.
- Extended temperature operation: Rated 0 °C to 100 °C to accommodate designs that require above-commercial temperature ranges.
Why Choose 10AX022E3F27E1HG?
This Arria 10 GX FPGA provides a balanced combination of programmable logic density, embedded RAM capacity, and a high I/O count within a compact 672‑FBGA surface-mount package. It is positioned for mid-range, performance-sensitive applications where on-chip memory and substantial logic resources reduce system complexity and external component count.
Designed within the Arria 10 family, this device aligns with development flows targeting 20 nm mid-range FPGAs and SoCs, offering long-term value through scalable device family features and documented device family capabilities for transceivers, DSP, and clocking resources.
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