10AX022E3F27E2SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 240 13752320 220000 672-BBGA, FCBGA |
|---|---|
| Quantity | 734 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FBGA, FC (27x27) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA, FCBGA | Number of I/O | 240 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 80330 | Number of Logic Elements/Cells | 220000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 13752320 |
Overview of 10AX022E3F27E2SG – Arria 10 GX FPGA, 220000 logic elements, 13,752,320 RAM bits
The 10AX022E3F27E2SG is an Intel Arria 10 GX field programmable gate array (FPGA) in a 672-BBGA FCBGA package. It combines a high logic capacity and substantial embedded RAM with mid-range, power-efficient 20 nm Arria 10 family architecture targeted at performance- and power-sensitive applications.
Designed for use in markets such as wireless, wireline, broadcast, computing/storage and medical systems, this device provides a balanced mix of logic, memory and I/O resources for complex, mid-range FPGA designs.
Key Features
- Logic Capacity 220,000 logic elements provide large-scale programmable logic suitable for complex functions and system integration.
- Embedded Memory Total RAM bits: 13,752,320, enabling on-chip buffering, caching and state storage for high-throughput designs.
- I/O Resources 240 I/Os support broad peripheral and external interface connectivity for multi-channel systems.
- Package and Mounting 672-BBGA (FCBGA) package, supplier package 672-FBGA, FC (27×27), designed for surface-mount assembly.
- Power Supply Range Core voltage range specified at 870 mV to 930 mV to match system power budgeting and sequencing requirements.
- Operating Range and Grade Extended grade with operating temperature 0 °C to 100 °C for deployment in a wide set of environments.
- Family-Level Capabilities As part of the Intel Arria 10 device family, the device benefits from a 20 nm mid-range FPGA architecture with features such as adaptive logic modules, variable-precision DSP blocks, embedded memory blocks, clock networks and PLL clock sources.
- High-Speed and System IP Arria 10 family documentation specifies support for external memory interfaces, PCIe Gen1/Gen2/Gen3 hard IP, enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet, and low-power serial transceivers for high-bandwidth links.
- Advanced Design and Reliability Family features include dynamic and partial reconfiguration, SEU error detection and correction mechanisms, power management options and incremental compilation workflows for design optimization and maintenance.
- Compliance RoHS compliant.
Typical Applications
- Wireless infrastructure Channel and switch cards in remote radio heads and mobile backhaul where programmable logic and DSP capability are required.
- Wireline networking 40G/100G muxponders, transponders and 100G line cards leveraging on-chip logic, memory and high-speed transceiver functionality.
- Broadcast and Pro AV Studio switches, videoconferencing and professional audio/video equipment requiring flexible I/O and on-chip processing.
- Computing and storage acceleration Flash cache, cloud server acceleration and server transport functions that use embedded RAM and high logic density for offload and acceleration tasks.
- Medical imaging Diagnostic imaging systems that benefit from programmable processing, large on-chip memory and deterministic I/O.
Unique Advantages
- High logic density: 220,000 logic elements provide headroom for integrating complex datapaths, control logic and custom accelerators on a single device.
- Large on-chip memory: 13,752,320 total RAM bits enable significant buffering and local data storage to reduce external memory dependence and latency.
- Comprehensive I/O: 240 I/Os in a 672-BBGA package facilitate broad peripheral connectivity and multi-channel system designs.
- Arria 10 family capabilities: Architecture-level features such as DSP blocks, PLL/clock networks and transceiver support simplify implementation of high-performance interfaces and signal processing functions.
- Operational robustness: Extended grade and 0 °C to 100 °C operating temperature provide suitability for a range of commercial and infrastructure environments.
- Standards-oriented system IP: On-family hard IP options (PCIe, PCS, serial transceivers) reduce development time for common high-speed interfaces.
Why Choose 10AX022E3F27E2SG?
The 10AX022E3F27E2SG Arria 10 GX FPGA delivers a balanced combination of high logic capacity, substantial embedded RAM and extensive I/O in a compact 672-BBGA package. Its 20 nm Arria 10 family architecture and built-in system IP make it well suited for mid-range designs that require both performance and power efficiency.
This device is appropriate for engineers building wireless infrastructure, high-speed networking, broadcast equipment, compute/storage accelerators and medical imaging systems who need on-chip memory, advanced DSP capabilities and flexible interface options backed by Arria 10 family documentation and development resources.
Request a quote or submit an inquiry to receive pricing and availability details for the 10AX022E3F27E2SG Arria 10 GX FPGA.

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