10AX022E3F27E2SG

IC FPGA 240 I/O 672FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 240 13752320 220000 672-BBGA, FCBGA

Quantity 734 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package672-FBGA, FC (27x27)GradeExtendedOperating Temperature0°C – 100°C
Package / Case672-BBGA, FCBGANumber of I/O240Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs80330Number of Logic Elements/Cells220000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits13752320

Overview of 10AX022E3F27E2SG – Arria 10 GX FPGA, 220000 logic elements, 13,752,320 RAM bits

The 10AX022E3F27E2SG is an Intel Arria 10 GX field programmable gate array (FPGA) in a 672-BBGA FCBGA package. It combines a high logic capacity and substantial embedded RAM with mid-range, power-efficient 20 nm Arria 10 family architecture targeted at performance- and power-sensitive applications.

Designed for use in markets such as wireless, wireline, broadcast, computing/storage and medical systems, this device provides a balanced mix of logic, memory and I/O resources for complex, mid-range FPGA designs.

Key Features

  • Logic Capacity  220,000 logic elements provide large-scale programmable logic suitable for complex functions and system integration.
  • Embedded Memory  Total RAM bits: 13,752,320, enabling on-chip buffering, caching and state storage for high-throughput designs.
  • I/O Resources  240 I/Os support broad peripheral and external interface connectivity for multi-channel systems.
  • Package and Mounting  672-BBGA (FCBGA) package, supplier package 672-FBGA, FC (27×27), designed for surface-mount assembly.
  • Power Supply Range  Core voltage range specified at 870 mV to 930 mV to match system power budgeting and sequencing requirements.
  • Operating Range and Grade  Extended grade with operating temperature 0 °C to 100 °C for deployment in a wide set of environments.
  • Family-Level Capabilities  As part of the Intel Arria 10 device family, the device benefits from a 20 nm mid-range FPGA architecture with features such as adaptive logic modules, variable-precision DSP blocks, embedded memory blocks, clock networks and PLL clock sources.
  • High-Speed and System IP  Arria 10 family documentation specifies support for external memory interfaces, PCIe Gen1/Gen2/Gen3 hard IP, enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet, and low-power serial transceivers for high-bandwidth links.
  • Advanced Design and Reliability  Family features include dynamic and partial reconfiguration, SEU error detection and correction mechanisms, power management options and incremental compilation workflows for design optimization and maintenance.
  • Compliance  RoHS compliant.

Typical Applications

  • Wireless infrastructure  Channel and switch cards in remote radio heads and mobile backhaul where programmable logic and DSP capability are required.
  • Wireline networking  40G/100G muxponders, transponders and 100G line cards leveraging on-chip logic, memory and high-speed transceiver functionality.
  • Broadcast and Pro AV  Studio switches, videoconferencing and professional audio/video equipment requiring flexible I/O and on-chip processing.
  • Computing and storage acceleration  Flash cache, cloud server acceleration and server transport functions that use embedded RAM and high logic density for offload and acceleration tasks.
  • Medical imaging  Diagnostic imaging systems that benefit from programmable processing, large on-chip memory and deterministic I/O.

Unique Advantages

  • High logic density: 220,000 logic elements provide headroom for integrating complex datapaths, control logic and custom accelerators on a single device.
  • Large on-chip memory: 13,752,320 total RAM bits enable significant buffering and local data storage to reduce external memory dependence and latency.
  • Comprehensive I/O: 240 I/Os in a 672-BBGA package facilitate broad peripheral connectivity and multi-channel system designs.
  • Arria 10 family capabilities: Architecture-level features such as DSP blocks, PLL/clock networks and transceiver support simplify implementation of high-performance interfaces and signal processing functions.
  • Operational robustness: Extended grade and 0 °C to 100 °C operating temperature provide suitability for a range of commercial and infrastructure environments.
  • Standards-oriented system IP: On-family hard IP options (PCIe, PCS, serial transceivers) reduce development time for common high-speed interfaces.

Why Choose 10AX022E3F27E2SG?

The 10AX022E3F27E2SG Arria 10 GX FPGA delivers a balanced combination of high logic capacity, substantial embedded RAM and extensive I/O in a compact 672-BBGA package. Its 20 nm Arria 10 family architecture and built-in system IP make it well suited for mid-range designs that require both performance and power efficiency.

This device is appropriate for engineers building wireless infrastructure, high-speed networking, broadcast equipment, compute/storage accelerators and medical imaging systems who need on-chip memory, advanced DSP capabilities and flexible interface options backed by Arria 10 family documentation and development resources.

Request a quote or submit an inquiry to receive pricing and availability details for the 10AX022E3F27E2SG Arria 10 GX FPGA.

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