10AX022E3F27I2LG

IC FPGA 240 I/O 672FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 240 13752320 220000 672-BBGA, FCBGA

Quantity 124 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package672-FBGA, FC (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case672-BBGA, FCBGANumber of I/O240Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs80330Number of Logic Elements/Cells220000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits13752320

Overview of 10AX022E3F27I2LG – Arria 10 GX Field Programmable Gate Array (FPGA) IC, 672-BBGA

The 10AX022E3F27I2LG is an Intel Arria 10 GX family field programmable gate array (FPGA) device implemented in a 672-ball FCBGA package. It is part of the Arria 10 20 nm mid-range device family and is designed for high-performance, power-sensitive midrange applications across communications, broadcast, compute, medical, and defense markets.

This device combines substantial logic capacity and embedded memory with series-level features such as variable-precision DSP blocks, low-power serial transceivers and advanced configuration options to address demanding system-level functions while supporting industrial-grade operating conditions.

Key Features

  • Logic Capacity  Provides 220,000 logic elements for implementing complex custom logic, control and data-processing functions.
  • Embedded Memory  Includes 13,752,320 total RAM bits to support on-chip buffering, packet processing and local data storage.
  • I/O and Interfaces  Offers 240 user I/O pins. Series-level features include support for PCIe Gen1/2/3 hard IP and low-power serial transceivers suitable for high-speed serial links.
  • DSP Capability  Arria 10 devices incorporate variable-precision DSP blocks to accelerate signal processing and arithmetic-intensive workloads.
  • Power and Supply  Optimized for power-sensitive designs with device supply voltage in the range of 870 mV to 930 mV.
  • Package and Mounting  Surface-mount 672-BBGA (672-FBGA, FC, 27×27) package for dense system integration and reliable board-level mounting.
  • Operating Range and Grade  Industrial-grade device rated for operation from −40°C to 100°C.
  • Series-Level System Features  Arria 10 family-level capabilities include embedded memory configurations, clock networks with PLL options, dynamic and partial reconfiguration, and options for SoC-style integration as described in the device overview documentation.

Typical Applications

  • Wireless Infrastructure  Channel and switch cards in remote radio heads and mobile backhaul equipment, leveraging high logic density and low-power serial transceivers for signal processing and transport.
  • High-Speed Wireline Equipment  40G/100G line cards, muxponders and transponders where on-chip memory and PCIe/serial interface support are used for high-throughput packet handling.
  • Compute and Storage Acceleration  Server acceleration, flash cache and cloud computing server functions that benefit from abundant logic elements, embedded RAM and DSP resources.
  • Broadcast and Pro AV  Studio switches, videoconferencing and professional audio/video processing that require dense I/O and on-chip buffering.
  • Medical and Defense Systems  Diagnostic imaging, radar and secure communications applications that require industrial temperature range operation and configurable acceleration blocks.

Unique Advantages

  • High integration density: 220,000 logic elements and 13.75 Mb of embedded RAM enable complex system functions on a single device, reducing board-level component count.
  • Industrial operating range: Rated for −40°C to 100°C operation, supporting designs that must operate across extended temperature environments.
  • Flexible I/O and serial support: 240 I/O pins combined with Arria 10 series serial/transceiver capabilities provide flexible connectivity for high-speed links and external memories.
  • Power-aware architecture: Documented Arria 10 power-saving technologies and a tight supply voltage range (870 mV–930 mV) help manage system power in energy-sensitive applications.
  • Robust packaging for board integration: 672-ball FCBGA (27×27) surface-mount package simplifies placement in compact, high-density designs.

Why Choose 10AX022E3F27I2LG?

The 10AX022E3F27I2LG Arria 10 GX FPGA balances substantial logic and memory resources with series-level features for high-speed serial I/O and DSP acceleration, making it suitable for midrange, performance-driven designs that also demand power efficiency and industrial temperature capability. Its package and I/O complement integrations where board space and connectivity are key design constraints.

Backed by Intel Arria 10 device documentation and family-level design resources, this device is intended for engineers and system designers seeking a scalable, field-programmable platform that supports advanced configuration and reconfiguration workflows while meeting industrial environmental requirements.

Request a quote or submit an inquiry to receive pricing and availability for part number 10AX022E3F27I2LG and to discuss how this Arria 10 GX FPGA can be integrated into your next design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up