10AX022E3F27I2LG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 240 13752320 220000 672-BBGA, FCBGA |
|---|---|
| Quantity | 124 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FBGA, FC (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA, FCBGA | Number of I/O | 240 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 80330 | Number of Logic Elements/Cells | 220000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 13752320 |
Overview of 10AX022E3F27I2LG – Arria 10 GX Field Programmable Gate Array (FPGA) IC, 672-BBGA
The 10AX022E3F27I2LG is an Intel Arria 10 GX family field programmable gate array (FPGA) device implemented in a 672-ball FCBGA package. It is part of the Arria 10 20 nm mid-range device family and is designed for high-performance, power-sensitive midrange applications across communications, broadcast, compute, medical, and defense markets.
This device combines substantial logic capacity and embedded memory with series-level features such as variable-precision DSP blocks, low-power serial transceivers and advanced configuration options to address demanding system-level functions while supporting industrial-grade operating conditions.
Key Features
- Logic Capacity Provides 220,000 logic elements for implementing complex custom logic, control and data-processing functions.
- Embedded Memory Includes 13,752,320 total RAM bits to support on-chip buffering, packet processing and local data storage.
- I/O and Interfaces Offers 240 user I/O pins. Series-level features include support for PCIe Gen1/2/3 hard IP and low-power serial transceivers suitable for high-speed serial links.
- DSP Capability Arria 10 devices incorporate variable-precision DSP blocks to accelerate signal processing and arithmetic-intensive workloads.
- Power and Supply Optimized for power-sensitive designs with device supply voltage in the range of 870 mV to 930 mV.
- Package and Mounting Surface-mount 672-BBGA (672-FBGA, FC, 27×27) package for dense system integration and reliable board-level mounting.
- Operating Range and Grade Industrial-grade device rated for operation from −40°C to 100°C.
- Series-Level System Features Arria 10 family-level capabilities include embedded memory configurations, clock networks with PLL options, dynamic and partial reconfiguration, and options for SoC-style integration as described in the device overview documentation.
Typical Applications
- Wireless Infrastructure Channel and switch cards in remote radio heads and mobile backhaul equipment, leveraging high logic density and low-power serial transceivers for signal processing and transport.
- High-Speed Wireline Equipment 40G/100G line cards, muxponders and transponders where on-chip memory and PCIe/serial interface support are used for high-throughput packet handling.
- Compute and Storage Acceleration Server acceleration, flash cache and cloud computing server functions that benefit from abundant logic elements, embedded RAM and DSP resources.
- Broadcast and Pro AV Studio switches, videoconferencing and professional audio/video processing that require dense I/O and on-chip buffering.
- Medical and Defense Systems Diagnostic imaging, radar and secure communications applications that require industrial temperature range operation and configurable acceleration blocks.
Unique Advantages
- High integration density: 220,000 logic elements and 13.75 Mb of embedded RAM enable complex system functions on a single device, reducing board-level component count.
- Industrial operating range: Rated for −40°C to 100°C operation, supporting designs that must operate across extended temperature environments.
- Flexible I/O and serial support: 240 I/O pins combined with Arria 10 series serial/transceiver capabilities provide flexible connectivity for high-speed links and external memories.
- Power-aware architecture: Documented Arria 10 power-saving technologies and a tight supply voltage range (870 mV–930 mV) help manage system power in energy-sensitive applications.
- Robust packaging for board integration: 672-ball FCBGA (27×27) surface-mount package simplifies placement in compact, high-density designs.
Why Choose 10AX022E3F27I2LG?
The 10AX022E3F27I2LG Arria 10 GX FPGA balances substantial logic and memory resources with series-level features for high-speed serial I/O and DSP acceleration, making it suitable for midrange, performance-driven designs that also demand power efficiency and industrial temperature capability. Its package and I/O complement integrations where board space and connectivity are key design constraints.
Backed by Intel Arria 10 device documentation and family-level design resources, this device is intended for engineers and system designers seeking a scalable, field-programmable platform that supports advanced configuration and reconfiguration workflows while meeting industrial environmental requirements.
Request a quote or submit an inquiry to receive pricing and availability for part number 10AX022E3F27I2LG and to discuss how this Arria 10 GX FPGA can be integrated into your next design.

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