10AX022E3F29E1HG

The 10AX022E3F29E1HG is an Intel Arria 10 GX field-programmable gate array (FPGA) offered in a 780-FBGA (29×29) surface-mount package. It is a 20 nm mid-range FPGA variant designed to deliver a balance of performance and power efficiency for bandwidth‑ and compute‑sensitive applications.

Target markets include wireless and wireline communications, broadcast, computing and storage, medical imaging, and defense systems where high logic density, embedded memory, and flexible I/O support are required.

Key Features

• Core Architecture Intel Arria 10 GX device family, implemented on a 20 nm process for mid-range FPGA applications and power-efficient performance.
• Logic Resources 220,000 logic elements suitable for complex custom logic, protocol processing, and algorithm implementation.
• Embedded Memory 13,752,320 total RAM bits to support on-chip buffering, packet processing, and mid-sized data storage requirements.
• I/O Capacity 288 general-purpose I/O pins to enable connectivity with external devices and memory interfaces.
• Serial Transceivers and Hard IP Includes low-power serial transceivers and hard IP blocks for high-speed interfaces such as PCIe Gen1/2/3, 10 Gbps Ethernet, and Interlaken as referenced in the device family documentation.
• Configuration and Reconfiguration Device supports dynamic and partial reconfiguration capability as described in the Arria 10 device overview for in-field logic updates.
• Power Supply Operates from a core voltage supply range of 870 mV to 930 mV, enabling low-voltage operation consistent with the device family.
• Package and Mounting Surface-mount 780-FBGA package (29×29) for high-density board designs; RoHS compliant.
• Thermal Grade Extended grade with an operating temperature range of 0 °C to 100 °C.

Typical Applications

• Wireless Infrastructure Channel and switch cards in remote radio heads and mobile backhaul implementations that require programmable logic and high-speed I/O.
• Wireline Communications 40G/100G muxponders, transponders, and line cards where embedded memory and transceiver hard IP accelerate packet and transport functions.
• Broadcast and Pro AV Studio switches, transport, and video processing systems benefitting from on-chip memory and reconfigurable logic for custom media pipelines.
• Computing & Storage Server acceleration, flash cache, and cloud compute offload tasks that leverage sizable logic density and embedded RAM.

Unique Advantages

• High logic density: 220,000 logic elements enable implementation of complex custom logic and datapath designs without external ASICs.
• Substantial on-chip memory: 13,752,320 total RAM bits reduce dependence on external memory for many buffering and caching tasks.
• Rich I/O and interface support: 288 I/O pins combined with family-level hard IP for PCIe and high-speed Ethernet simplify system integration for communication applications.
• Low-voltage core operation: 870–930 mV supply range supports low-power system designs and aligns with modern power-optimized platforms.
• Board-level packaging: 780-FBGA (29×29) surface-mount package provides a compact, solderable footprint for high-density PCBs.
• Vendor documentation and design guidance: Device family documentation covers power management, reconfiguration, and recommended design practices to support development and qualification.

Why Choose 10AX022E3F29E1HG?

The 10AX022E3F29E1HG Arria 10 GX FPGA combines significant logic capacity and embedded RAM with family-level high-speed serial transceivers and hard IP to address mid-range designs that require both performance and power efficiency. Its extended thermal grade and compact 780-FBGA package make it suitable for dense board implementations across communications, broadcast, and compute acceleration applications.

With device-level documentation and design resources available for the Arria 10 family, this part is positioned for engineers who need programmable, reconfigurable hardware backed by vendor guidance for complex system designs.

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