10AX022E3F27I1HG

IC FPGA 240 I/O 672FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 240 13752320 220000 672-BBGA, FCBGA

Quantity 1,309 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case672-BBGA, FCBGANumber of I/O240Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs80330Number of Logic Elements/Cells220000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits13752320

Overview of 10AX022E3F27I1HG – Arria 10 GX FPGA, 220,000 Logic Elements, 672-BBGA (27×27)

The 10AX022E3F27I1HG is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) in a 672-ball BGA FCBGA package. It belongs to the Arria 10 device family of 20 nm mid-range FPGAs and SoCs designed for high-performance, power-efficient applications.

With 220,000 logic elements, 13,752,320 bits of embedded RAM and 240 general-purpose I/Os, this industrial-grade device targets midrange applications across wireless, wireline, broadcast, computing/storage, medical and military markets where integration, configurability and thermal robustness are required.

Key Features

  • Core logic — 220,000 logic elements provide substantial programmable fabric for complex FPGA designs and system integration.
  • Embedded memory — 13,752,320 total RAM bits to support buffering, packet processing and algorithm acceleration on-chip.
  • I/O capacity — 240 general-purpose I/Os to interface with external devices, memory and high-speed peripherals.
  • Arria 10 family architecture — Series-level features include variable-precision DSP blocks, embedded memory blocks, advanced clock networks and PLL clock sources, and support for hard IP such as PCIe and high-speed serial protocols as documented for Arria 10 devices.
  • Configuration and reliability — Device-level capabilities described for Arria 10 include dynamic and partial reconfiguration and SEU error detection and correction mechanisms.
  • Power and supply — Operates from a nominal core voltage range of 870 mV to 930 mV, reflecting design for power-sensitive midrange systems.
  • Package and mounting — 672-ball FBGA (27×27 mm) surface-mount package (672-BBGA, FCBGA) suitable for compact board-level integration.
  • Industrial temperature grade — Rated for operation from −40 °C to 100 °C for deployment in temperature-demanding environments.
  • Compliance — RoHS compliant per supplier information.

Typical Applications

  • Wireless infrastructure — Channel and switch cards in remote radio heads and mobile backhaul equipment leveraging high logic density and on-chip memory.
  • Wireline networking — 40G/100G muxponders, transponders and line cards that require flexible I/O, protocol hard IP and reconfigurable logic.
  • Broadcast and pro AV — Studio switches and video processing systems that benefit from large embedded RAM and DSP capabilities.
  • Computing and storage acceleration — Server acceleration, flash cache and cloud compute offload where programmable logic and high I/O counts enable custom acceleration functions.
  • Medical and defense systems — Diagnostic imaging, radar and secure communications where industrial temperature range and reconfigurability are important.

Unique Advantages

  • High programmable capacity: 220,000 logic elements enable implementation of complex algorithms and multi-function systems on a single device, reducing external component count.
  • Substantial on-chip RAM: 13.75 Mb of embedded memory supports large buffers and state storage without immediate external memory dependencies.
  • Flexible I/O and packaging: 240 I/Os and a 672-ball FCBGA (27×27) offer a dense board-level solution for compact system designs.
  • Industrial temperature rating: −40 °C to 100 °C operation expands deployment into thermally demanding and industrial environments.
  • Power-aware design: Core supply range of 870–930 mV and family-level power-management features support power-sensitive midrange applications.
  • Series-level ecosystem and features: Arria 10 family capabilities such as variable-precision DSP blocks, advanced clocking, PCIe hard IP, low-power serial transceivers and dynamic/partial reconfiguration provide design flexibility and upgrade paths.

Why Choose 10AX022E3F27I1HG?

The 10AX022E3F27I1HG combines the Arria 10 family’s 20 nm, power-efficient architecture with a large logic fabric, extensive embedded RAM and a robust I/O complement in a compact 672-BBGA package. Its industrial temperature rating and surface-mount package make it suitable for demanding embedded systems where configurability, on-chip resources and board density are key considerations.

This device is appropriate for engineers and system designers building midrange, high-performance applications that require significant programmable logic, memory and flexible interfacing, while leveraging Arria 10 family features such as advanced DSP, transceivers and reconfiguration capabilities for long-term scalability.

Request a quote or submit an RFQ to check availability and pricing for the 10AX022E3F27I1HG and get specification support for your design.

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