10AX022E3F27I1HG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 240 13752320 220000 672-BBGA, FCBGA |
|---|---|
| Quantity | 1,309 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA, FCBGA | Number of I/O | 240 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 80330 | Number of Logic Elements/Cells | 220000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 13752320 |
Overview of 10AX022E3F27I1HG – Arria 10 GX FPGA, 220,000 Logic Elements, 672-BBGA (27×27)
The 10AX022E3F27I1HG is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) in a 672-ball BGA FCBGA package. It belongs to the Arria 10 device family of 20 nm mid-range FPGAs and SoCs designed for high-performance, power-efficient applications.
With 220,000 logic elements, 13,752,320 bits of embedded RAM and 240 general-purpose I/Os, this industrial-grade device targets midrange applications across wireless, wireline, broadcast, computing/storage, medical and military markets where integration, configurability and thermal robustness are required.
Key Features
- Core logic — 220,000 logic elements provide substantial programmable fabric for complex FPGA designs and system integration.
- Embedded memory — 13,752,320 total RAM bits to support buffering, packet processing and algorithm acceleration on-chip.
- I/O capacity — 240 general-purpose I/Os to interface with external devices, memory and high-speed peripherals.
- Arria 10 family architecture — Series-level features include variable-precision DSP blocks, embedded memory blocks, advanced clock networks and PLL clock sources, and support for hard IP such as PCIe and high-speed serial protocols as documented for Arria 10 devices.
- Configuration and reliability — Device-level capabilities described for Arria 10 include dynamic and partial reconfiguration and SEU error detection and correction mechanisms.
- Power and supply — Operates from a nominal core voltage range of 870 mV to 930 mV, reflecting design for power-sensitive midrange systems.
- Package and mounting — 672-ball FBGA (27×27 mm) surface-mount package (672-BBGA, FCBGA) suitable for compact board-level integration.
- Industrial temperature grade — Rated for operation from −40 °C to 100 °C for deployment in temperature-demanding environments.
- Compliance — RoHS compliant per supplier information.
Typical Applications
- Wireless infrastructure — Channel and switch cards in remote radio heads and mobile backhaul equipment leveraging high logic density and on-chip memory.
- Wireline networking — 40G/100G muxponders, transponders and line cards that require flexible I/O, protocol hard IP and reconfigurable logic.
- Broadcast and pro AV — Studio switches and video processing systems that benefit from large embedded RAM and DSP capabilities.
- Computing and storage acceleration — Server acceleration, flash cache and cloud compute offload where programmable logic and high I/O counts enable custom acceleration functions.
- Medical and defense systems — Diagnostic imaging, radar and secure communications where industrial temperature range and reconfigurability are important.
Unique Advantages
- High programmable capacity: 220,000 logic elements enable implementation of complex algorithms and multi-function systems on a single device, reducing external component count.
- Substantial on-chip RAM: 13.75 Mb of embedded memory supports large buffers and state storage without immediate external memory dependencies.
- Flexible I/O and packaging: 240 I/Os and a 672-ball FCBGA (27×27) offer a dense board-level solution for compact system designs.
- Industrial temperature rating: −40 °C to 100 °C operation expands deployment into thermally demanding and industrial environments.
- Power-aware design: Core supply range of 870–930 mV and family-level power-management features support power-sensitive midrange applications.
- Series-level ecosystem and features: Arria 10 family capabilities such as variable-precision DSP blocks, advanced clocking, PCIe hard IP, low-power serial transceivers and dynamic/partial reconfiguration provide design flexibility and upgrade paths.
Why Choose 10AX022E3F27I1HG?
The 10AX022E3F27I1HG combines the Arria 10 family’s 20 nm, power-efficient architecture with a large logic fabric, extensive embedded RAM and a robust I/O complement in a compact 672-BBGA package. Its industrial temperature rating and surface-mount package make it suitable for demanding embedded systems where configurability, on-chip resources and board density are key considerations.
This device is appropriate for engineers and system designers building midrange, high-performance applications that require significant programmable logic, memory and flexible interfacing, while leveraging Arria 10 family features such as advanced DSP, transceivers and reconfiguration capabilities for long-term scalability.
Request a quote or submit an RFQ to check availability and pricing for the 10AX022E3F27I1HG and get specification support for your design.

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