10AX022E3F27E2LG

IC FPGA 240 I/O 672FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 240 13752320 220000 672-BBGA, FCBGA

Quantity 151 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package672-FBGA, FC (27x27)GradeExtendedOperating Temperature0°C – 100°C
Package / Case672-BBGA, FCBGANumber of I/O240Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs80330Number of Logic Elements/Cells220000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits13752320

Overview of 10AX022E3F27E2LG – Arria 10 GX FPGA, 672-BBGA

The 10AX022E3F27E2LG is an Intel Arria 10 GX field programmable gate array (FPGA) in a 672-ball BGA package designed for mid-range, high-performance and power-efficient applications. Built on the Arria 10 device family, this device targets demanding communications, computing, broadcast, medical and defense use cases where a combination of logic capacity, embedded memory and serial/parallel I/O is required.

Its architecture combines a large logic fabric with embedded RAM and hardened interfaces, delivering a platform suited for high-throughput interfaces, complex signal processing and system acceleration while maintaining a focus on power efficiency.

Key Features

  • Logic Capacity  Provides 220,000 logic elements to implement complex digital designs and system-level functions.
  • Embedded Memory  Includes 13,752,320 total RAM bits to support large on-chip buffers, frame storage and data-path requirements.
  • I/O and Packaging  240 user I/O pins in a 672-BBGA (FCBGA) package (27 × 27 mm supplier package) with surface-mount mounting for compact board integration.
  • Transceivers and Interface IP  Device family documentation highlights support for high-speed serial transceivers and hardened IP such as PCIe Gen1/2/3 and 10 Gbps Ethernet, enabling integration of common host and network interfaces.
  • DSP and Processing  Arria 10 series documentation references variable-precision DSP blocks and an adaptive logic module suitable for signal processing and compute-acceleration tasks.
  • Power and Supply  Operates from an on-chip/core voltage supply range of 870 mV to 930 mV, consistent with the device’s 20 nm power-efficient architecture.
  • Operating Range and Grade  Extended-grade device with an operating temperature range of 0 °C to 100 °C, and RoHS compliance for environmental conformity.
  • Memory and External Interfaces  Documentation indicates broad support for external memory interfaces and memory standards appropriate for high-bandwidth applications.

Typical Applications

  • Wireless Infrastructure  Channel and switch cards in remote radio heads and mobile backhaul systems leveraging on-chip DSP and high-speed I/O for baseband and transport functions.
  • Wireline Networking  40G/100G muxponders, transponders and line cards that require hardened serial interfaces and large on-chip memory for packet buffering and protocol processing.
  • Broadcast and Pro AV  Studio switches, signal processing and transport equipment that need deterministic logic, embedded RAM and high-throughput serial connectivity.
  • Compute and Storage Acceleration  Server acceleration, flash cache controllers and cloud offload functions that benefit from DSP blocks, large logic capacity and PCIe hard IP.
  • Medical and Imaging  Diagnostic scanners and imaging systems that use embedded memory and DSP resources for real-time image processing and data aggregation.

Unique Advantages

  • High logic density: 220,000 logic elements enable large-scale integration of control, processing and protocol functions on a single device, reducing BOM and board complexity.
  • Substantial on-chip memory: 13,752,320 total RAM bits support deep buffering, frame storage and complex state machines without immediate dependence on external memory.
  • Comprehensive I/O and package: 240 I/O in a 672-BBGA surface-mount package provides a balance of pin count and compact footprint for dense system designs.
  • Hardened interface IP and transceivers: Family-level support for PCIe Gen1/2/3 and 10 Gbps Ethernet simplifies integration of common host and network links.
  • Power-efficient 20 nm architecture: Device family documentation emphasizes performance with power-saving technologies, aligning with designs that require throughput and energy efficiency.
  • Extended temperature and RoHS compliant: Extended-grade operation from 0 °C to 100 °C and RoHS compliance support broader deployment options and regulatory needs.

Why Choose 10AX022E3F27E2LG?

The 10AX022E3F27E2LG Arria 10 GX FPGA brings together a high logic element count, large embedded memory, robust I/O and hardened interface IP in a compact 672-BBGA package. It is positioned for mid-range systems that require substantial programmable logic and on-chip RAM for signal processing, protocol handling and system acceleration while keeping power efficiency in focus.

This device suits engineering teams developing communications equipment, compute accelerators, broadcast infrastructure or imaging systems that need scalable logic capacity, embedded memory and proven interface support from the Arria 10 device family.

Request a quote or submit an inquiry to receive pricing and availability information for 10AX022E3F27E2LG. Our team can provide lead-time details and support for your procurement and design planning.

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