10AX022E3F27E1SG

IC FPGA 240 I/O 672FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 240 13752320 220000 672-BBGA, FCBGA

Quantity 530 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusDiscontinued
Manufacturer Standard Lead Time13 Weeks
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeExtendedOperating Temperature0°C – 100°C
Package / Case672-BBGA, FCBGANumber of I/O240Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs80330Number of Logic Elements/Cells220000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits13752320

Overview of 10AX022E3F27E1SG – Arria 10 GX FPGA, 672‑BBGA FCBGA

The 10AX022E3F27E1SG is an Intel Arria 10 GX field-programmable gate array (FPGA) in a 672‑ball FCBGA package. It is part of the Arria 10 device family, a 20‑nm mid-range FPGA architecture targeted at performance-sensitive and power-efficient system designs.

Designed for applications across wireless, wireline, broadcast, computing and storage, medical and defense markets, this device combines high logic capacity, embedded RAM, and a broad I/O complement to enable complex system integration in a compact surface‑mount package.

Key Features

  • High-density logic — 220,000 logic elements provide substantial programmable resources for mid-range to high-performance designs.
  • Embedded memory — 13,752,320 total RAM bits for on‑chip buffering, state storage and data-path acceleration.
  • I/O capacity — 240 general-purpose I/O pins to support wide external connectivity and memory interfaces.
  • Package & mounting — 672‑BBGA (672‑FBGA, 27×27) surface‑mount package optimized for high‑density board layouts.
  • Power and supply — Operating core voltage range specified at 870 mV to 930 mV for core power planning.
  • Operating temperature (grade) — Extended grade with an operating range of 0 °C to 100 °C suitable for many commercial and rugged embedded environments.
  • Arria 10 family capabilities — Arria 10 devices include architecture-level features such as adaptive logic modules, variable‑precision DSP blocks, embedded memory blocks, clock network options, and high‑speed serial/transceiver support and PCIe Hard IP (family-level characteristics documented in the Arria 10 device overview).
  • RoHS compliant — Meets RoHS requirements for lead‑free assembly and regulatory alignment.

Typical Applications

  • Wireless infrastructure — Channel and switch card functions in radio heads and mobile backhaul equipment where programmable logic and embedded memory support signal processing and control tasks.
  • Wireline communications — Line cards, muxponders and transponders for 40G/100G systems that require high logic density and extensive I/O.
  • Broadcast and pro‑AV — Studio switches and video processing appliances that benefit from on‑chip RAM and flexible I/O for high‑bandwidth media paths.
  • Compute and storage acceleration — Cloud and server acceleration tasks, including flash cache and custom data‑path implementations that use DSP blocks and embedded memory.
  • Medical and defense systems — Diagnostic imaging, radar and secure comms designs leveraging programmable logic and extended operating temperature grade.

Unique Advantages

  • Highly integrated programmable fabric: 220,000 logic elements and 13.7M bits of embedded RAM reduce the need for external logic and memory, simplifying BOM and board area.
  • Scalable system I/O: 240 I/O pins enable broad external interface options and support for multiple memory and peripheral interfaces on a single device.
  • Compact, manufacturable package: 672‑BBGA FCBGA (27×27) surface‑mount package facilitates dense board layouts while supporting high I/O counts.
  • Design flexibility from Arria 10 architecture: Family features such as DSP blocks, embedded memory types, clock network options and Hard IP for high‑speed interfaces provide building blocks for diverse applications.
  • Extended temperature operation: Rated 0 °C to 100 °C to meet design needs for a wide range of embedded and commercial deployments.
  • Regulatory readiness: RoHS compliance supports lead‑free assembly and regulatory alignment for global manufacturing.

Why Choose 10AX022E3F27E1SG?

The 10AX022E3F27E1SG combines Arria 10 family architectural strengths with substantial logic and memory resources, a high I/O count and a compact 672‑ball FCBGA package. It is positioned for designers who need a balance of performance, integration and power-aware operation in mid‑range FPGA applications.

This device is suitable for system designers building wireless and wireline infrastructure, broadcast equipment, compute/storage accelerators and embedded signal‑processing platforms that require programmable flexibility, on‑chip memory and wide interface support backed by Arria 10 documentation and device resources.

Request a quote or submit a purchasing inquiry to receive pricing and availability information for the 10AX022E3F27E1SG Arria 10 GX FPGA.

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