10AX022E3F29E2SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 288 13752320 220000 780-BBGA, FCBGA |
|---|---|
| Quantity | 1,070 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA, FC (29x29) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 288 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 80330 | Number of Logic Elements/Cells | 220000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 13752320 |
Overview of 10AX022E3F29E2SG – Arria 10 GX FPGA, 220,000 Logic Elements, 13,752,320‑bit RAM, 288 I/O, 780‑FBGA
The 10AX022E3F29E2SG is an Intel Arria 10 GX field‑programmable gate array in a 780‑FBGA (29×29) surface‑mount package. It integrates 220,000 logic elements and 13,752,320 bits of embedded RAM with 288 user I/O pins, delivering a high‑capacity midrange FPGA option for performance‑ and power‑sensitive designs.
Packaged and graded for extended operation (0 °C to 100 °C) and RoHS compliant, this device targets midrange applications that require a dense logic fabric, substantial on‑chip memory, and a compact BGA footprint.
Key Features
- High Logic Capacity — 220,000 logic elements provide the programmable fabric needed for complex logic, datapath and control implementations.
- On‑Chip Memory — 13,752,320 total RAM bits enable large buffering, FIFOs, and local data storage without immediate dependence on external memory.
- I/O and Package — 288 user I/O pins in a 780‑BBGA / FCBGA (780‑FBGA, 29×29) package support dense board routing while keeping the device in a compact surface‑mount form factor.
- Power and Voltage — Core supply specified between 870 mV and 930 mV to match platform power planning and enable low‑voltage operation.
- Extended Grade and Temperature Range — Extended grade device rated for 0 °C to 100 °C operation for applications that require a wider operating window than commercial‑only devices.
- Arria 10 Family Architecture — Based on the Arria 10 device family (20‑nm midrange FPGA architecture) which emphasizes performance and power efficiency for midrange applications.
- Family‑Level Connectivity and IP — Arria 10 device documentation lists features such as PCIe Gen1/Gen2/Gen3 hard IP and low‑power serial transceivers at the device‑family level for designs that require integrated high‑speed interfaces.
- Manufacturing and Mounting — Surface mount device, delivered in industry‑standard BGA format for automated assembly and reliable board integration.
- Regulatory Compliance — RoHS compliant for environmental and regulatory alignment in regulated product builds.
Typical Applications
- Wireless Infrastructure — Channel and switch cards, remote radio heads and mobile backhaul equipment that need programmable datapath and control with significant on‑chip memory.
- Wireline Networking — 40G/100G line cards, muxponders, and transponders where dense logic and embedded memory support packet processing and protocol bridging.
- Broadcast and Pro AV — Studio switches and video transport equipment that require configurable logic for format handling, routing and timing.
- Computing and Storage — Server acceleration, flash cache and cloud computing functions that can leverage FPGA logic and embedded RAM for application‑specific offload.
Unique Advantages
- Substantial Programmable Capacity: 220,000 logic elements let you implement complex finite state machines, datapaths and custom accelerators on a single device.
- Significant On‑Chip Memory: 13.75 Mb of embedded RAM reduces external memory dependency for buffering, queues and localized data processing, simplifying board design.
- Compact, High‑Density Packaging: 780‑FBGA (29×29) strikes a balance between I/O count and PCB area for space‑constrained systems.
- Low‑Voltage Core Operation: 870–930 mV supply range supports low‑power system architectures and careful power budgeting.
- Extended Operating Grade: 0 °C to 100 °C rating provides headroom for applications demanding a wider operating temperature range than standard commercial parts.
- Arria 10 Family Resources: Design guidance and device documentation for the Arria 10 family, including device overview and errata, support development and validation activities.
Why Choose 10AX022E3F29E2SG?
The 10AX022E3F29E2SG positions itself as a high‑capacity Arria 10 GX FPGA option for designers who need a balance of programmable logic, embedded memory and a compact BGA package. Its 220,000 logic elements and 13,752,320 bits of on‑chip RAM make it suitable for midrange systems that demand substantial local processing and buffering while maintaining a small board footprint.
With an extended operating range, low‑voltage core specification and RoHS compliance, this device fits applications where power efficiency, thermal considerations and regulatory compliance matter. Backed by Arria 10 family documentation and device‑level guidance, it supports structured development and system integration for a variety of networking, wireless, broadcast and compute/storage use cases.
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