10AX022E3F29I1SG

The 10AX022E3F29I1SG is an Intel Arria 10 GX family FPGA offering a mid-range, 20 nm architecture optimized for performance and power efficiency. This device provides a large programmable fabric with 220,000 logic elements, 13,752,320 total RAM bits and 288 device I/O, targeting high-performance, power-sensitive applications.

Packaged in a 780-BBGA (780-FBGA, 29×29) surface-mount package, the device is rated for industrial operation from −40 °C to 100 °C and operates from a supply range of 870 mV to 930 mV. It is RoHS compliant.

Key Features

• Core Capacity — 220,000 logic elements for implementing complex programmable logic and system functions.
• On-Chip Memory — 13,752,320 total RAM bits to support large buffering, packetization, and data-path storage needs.
• I/O and Package — 288 device I/O in a 780-BBGA (780-FBGA, 29×29) surface-mount package for high-density board integration.
• Operating Range — Industrial-grade operation from −40 °C to 100 °C and a supply voltage window of 870 mV to 930 mV.
• Arria 10 Family Capabilities — Family-level features include variable-precision DSP blocks, embedded memory blocks, advanced clock networks and PLLs, PCIe Gen1/2/3 hard IP, enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet, low-power serial transceivers, and SoC integration options.
• Regulatory — RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

• Wireless infrastructure — Channel and switch cards and remote radio head functions where high logic density and on-chip memory accelerate signal processing.
• Wireline networking — 40G/100G muxponders, transponders, and line cards that require programmable logic, high I/O counts, and support for high-speed serial protocols.
• Broadcast and pro AV — Studio switches, transport and videoconferencing equipment that leverage on-chip memory and logic for media processing and routing.
• Computing and storage — Flash cache, server acceleration and cloud infrastructure tasks that need customizable data-paths and embedded memory.
• Medical and defense systems — Diagnostic imaging, radar, and guidance applications that benefit from the device’s industrial temperature range and high logic/memory capacity.

Unique Advantages

• Large programmable fabric: 220,000 logic elements enable integration of complex algorithms and custom accelerators on a single device.
• Substantial on-chip memory: 13,752,320 RAM bits reduce external memory dependence for buffering and real-time data handling.
• High I/O density and compact package: 288 I/O in a 780-FBGA (29×29) package supports dense board-level integration and flexible interfacing.
• Industrial-ready operating range: −40 °C to 100 °C and a defined supply window (870 mV–930 mV) support deployment in temperature- and power-sensitive environments.
• Arria 10 family ecosystem: Access to documented family-level features such as DSP blocks, PLLs, PCIe hard IP and high-speed transceiver capabilities for system-level design options.
• RoHS compliant: Meets common environmental and manufacturing requirements for modern electronics production.

Why Choose 10AX022E3F29I1SG?

The 10AX022E3F29I1SG positions itself as a high-capacity Arria 10 GX FPGA suitable for mid-range designs that demand substantial logic resources, significant on-chip memory, and a high I/O count within an industrial operating envelope. Its specification set supports applications across wireless, wireline, broadcast, computing, medical and defense markets where programmable performance and power efficiency matter.

As part of the Intel Arria 10 family, the device benefits from family-level architectural features and documentation that support system integration and development. Designers seeking a robust, industry-rated FPGA with sizable logic and memory resources will find this device appropriate for scalable, performance-focused implementations.

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