10AX022E3F29I2SG

IC FPGA 288 I/O 780FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 288 13752320 220000 780-BBGA, FCBGA

Quantity 1,420 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package780-FBGA, FC (29x29)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case780-BBGA, FCBGANumber of I/O288Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs80330Number of Logic Elements/Cells220000
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits13752320

Overview of 10AX022E3F29I2SG – Arria 10 GX FPGA (780‑BBGA, FCBGA)

The 10AX022E3F29I2SG is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) device supplied in a 780‑ball FCBGA package (29×29 mm). It is a mid‑range, high‑performance, power‑efficient 20‑nm FPGA family member targeted at demanding embedded and communications applications.

With a large logic capacity, substantial on‑chip RAM, and a broad I/O complement, this device is suited for applications across wireless and wireline infrastructure, broadcast, computing and storage, medical imaging, and defense electronics where performance, integration, and industrial temperature operation are required.

Key Features

  • Core Logic  220,000 logic elements provide a substantial fabric for implementing complex digital functions and custom accelerators.
  • Embedded Memory  13,752,320 total RAM bits on‑chip to support buffering, caches, and intermediate data storage without external memory in many designs.
  • I/O  288 user I/O pins to interface with peripherals, memory, and high‑speed transceivers (I/O count suited for multi‑lane and parallel interfaces).
  • Power Supply  Supported core voltage range from 870 mV to 930 mV to match system power rails and FPGA power‑management schemes.
  • Package & Mounting  780‑ball FCBGA (29×29 mm) surface‑mount package for board‑level integration in space‑constrained designs.
  • Operating Temperature  Industrial temperature range of −40 °C to 100 °C for reliable operation in harsh environments.
  • Compliance  RoHS compliant for regulatory and environmental requirements.

Typical Applications

  • Wireless Infrastructure  Channel and switch cards in remote radio heads and mobile backhaul systems leveraging programmable logic for signal processing and control.
  • Wireline Networking  40G/100G muxponders, transponders, and line cards where large logic capacity and extensive I/O enable high‑speed packet and framing functions.
  • Broadcast & Pro AV  Studio switches and professional video processing systems that require flexible I/O mapping and substantial on‑chip memory for frame buffering.
  • Computing & Storage Acceleration  Flash cache controllers and server acceleration modules where custom datapaths and memory bandwidth are essential.
  • Medical & Defence Electronics  Diagnostic imaging and radar/mission‑critical systems benefiting from industrial temperature rating and programmable hardware acceleration.

Unique Advantages

  • Large programmable fabric: 220,000 logic elements enable complex system integration and implementation of multiple functions in a single device, reducing board count.
  • Significant on‑chip RAM: 13,752,320 bits of embedded memory support high‑throughput buffering and local data storage to improve system performance and latency.
  • High I/O density: 288 I/Os allow flexible interfacing to external devices, memory, and transceivers for multi‑lane and parallel interfaces.
  • Industrial temperature capability: Rated −40 °C to 100 °C to meet thermal requirements of ruggedized and fielded equipment.
  • Compact FCBGA packaging: 780‑ball, 29×29 mm package balances high pin count with a footprint suitable for dense board designs.
  • Regulatory alignment: RoHS compliance supports environmental and manufacturing requirements for commercial and industrial deployments.

Why Choose 10AX022E3F29I2SG?

The 10AX022E3F29I2SG delivers a combination of large logic capacity, substantial embedded memory, and a high I/O count in an industrial‑rated FCBGA package. It is positioned for mid‑range applications that demand programmable throughput, flexible I/O, and reliable operation across a wide temperature range. Designers building communications, broadcast, compute acceleration, medical imaging, or defense systems can leverage this device to consolidate functions, enable hardware acceleration, and maintain system robustness.

Documentation and device resources for the Intel Arria 10 family provide further design guidance and references to device features and power‑management options to support development and deployment.

Request a quote or submit an inquiry to receive pricing, lead‑time, and availability information for the 10AX022E3F29I2SG Arria 10 GX FPGA.

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