10AX022E3F29I2SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 288 13752320 220000 780-BBGA, FCBGA |
|---|---|
| Quantity | 1,420 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA, FC (29x29) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 288 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 80330 | Number of Logic Elements/Cells | 220000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 13752320 |
Overview of 10AX022E3F29I2SG – Arria 10 GX FPGA (780‑BBGA, FCBGA)
The 10AX022E3F29I2SG is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) device supplied in a 780‑ball FCBGA package (29×29 mm). It is a mid‑range, high‑performance, power‑efficient 20‑nm FPGA family member targeted at demanding embedded and communications applications.
With a large logic capacity, substantial on‑chip RAM, and a broad I/O complement, this device is suited for applications across wireless and wireline infrastructure, broadcast, computing and storage, medical imaging, and defense electronics where performance, integration, and industrial temperature operation are required.
Key Features
- Core Logic 220,000 logic elements provide a substantial fabric for implementing complex digital functions and custom accelerators.
- Embedded Memory 13,752,320 total RAM bits on‑chip to support buffering, caches, and intermediate data storage without external memory in many designs.
- I/O 288 user I/O pins to interface with peripherals, memory, and high‑speed transceivers (I/O count suited for multi‑lane and parallel interfaces).
- Power Supply Supported core voltage range from 870 mV to 930 mV to match system power rails and FPGA power‑management schemes.
- Package & Mounting 780‑ball FCBGA (29×29 mm) surface‑mount package for board‑level integration in space‑constrained designs.
- Operating Temperature Industrial temperature range of −40 °C to 100 °C for reliable operation in harsh environments.
- Compliance RoHS compliant for regulatory and environmental requirements.
Typical Applications
- Wireless Infrastructure Channel and switch cards in remote radio heads and mobile backhaul systems leveraging programmable logic for signal processing and control.
- Wireline Networking 40G/100G muxponders, transponders, and line cards where large logic capacity and extensive I/O enable high‑speed packet and framing functions.
- Broadcast & Pro AV Studio switches and professional video processing systems that require flexible I/O mapping and substantial on‑chip memory for frame buffering.
- Computing & Storage Acceleration Flash cache controllers and server acceleration modules where custom datapaths and memory bandwidth are essential.
- Medical & Defence Electronics Diagnostic imaging and radar/mission‑critical systems benefiting from industrial temperature rating and programmable hardware acceleration.
Unique Advantages
- Large programmable fabric: 220,000 logic elements enable complex system integration and implementation of multiple functions in a single device, reducing board count.
- Significant on‑chip RAM: 13,752,320 bits of embedded memory support high‑throughput buffering and local data storage to improve system performance and latency.
- High I/O density: 288 I/Os allow flexible interfacing to external devices, memory, and transceivers for multi‑lane and parallel interfaces.
- Industrial temperature capability: Rated −40 °C to 100 °C to meet thermal requirements of ruggedized and fielded equipment.
- Compact FCBGA packaging: 780‑ball, 29×29 mm package balances high pin count with a footprint suitable for dense board designs.
- Regulatory alignment: RoHS compliance supports environmental and manufacturing requirements for commercial and industrial deployments.
Why Choose 10AX022E3F29I2SG?
The 10AX022E3F29I2SG delivers a combination of large logic capacity, substantial embedded memory, and a high I/O count in an industrial‑rated FCBGA package. It is positioned for mid‑range applications that demand programmable throughput, flexible I/O, and reliable operation across a wide temperature range. Designers building communications, broadcast, compute acceleration, medical imaging, or defense systems can leverage this device to consolidate functions, enable hardware acceleration, and maintain system robustness.
Documentation and device resources for the Intel Arria 10 family provide further design guidance and references to device features and power‑management options to support development and deployment.
Request a quote or submit an inquiry to receive pricing, lead‑time, and availability information for the 10AX022E3F29I2SG Arria 10 GX FPGA.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018