10AX022E3F29I2LG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 288 13752320 220000 780-BBGA, FCBGA |
|---|---|
| Quantity | 521 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA, FC (29x29) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 288 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 80330 | Number of Logic Elements/Cells | 220000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 13752320 |
Overview of 10AX022E3F29I2LG – Arria 10 GX FPGA, 220,000 logic elements, 780‑BBGA (FCBGA)
The 10AX022E3F29I2LG is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) in a 780‑BBGA (FCBGA) package. It is a 20‑nm mid‑range FPGA family device designed for high‑performance, power‑sensitive applications across communications, broadcast, computing, medical, and defense markets.
With a large logic capacity, substantial embedded RAM, and a broad I/O count, this device targets midrange designs that require a balance of performance, integration and power efficiency in industrial temperature environments.
Key Features
- Logic Capacity — 220,000 logic elements provide significant programmable logic resources for complex designs and midrange system integration.
- Embedded Memory — 13,752,320 total RAM bits to support on‑chip buffering, packet processing, and local data storage requirements.
- I/O — 288 I/O pins to enable flexible external interfacing and high‑density connectivity options.
- Package — 780‑BBGA (FCBGA); supplier device package listed as 780‑FBGA, FC (29×29) for a compact, high‑pin‑count footprint.
- Power — Core supply operating range from 870 mV to 930 mV, enabling designs that target specific power and performance points.
- Operating Range & Grade — Industrial grade with an operating temperature range of −40 °C to 100 °C for use in temperature‑challenging environments.
- Device Family Traits — As part of the Intel Arria 10 family, the device is described as delivering higher performance and power efficiency for mid‑range FPGA applications (from the device overview).
Typical Applications
- Wireless Infrastructure — Channel and switch cards in remote radio heads and mobile backhaul applications that require programmable logic and local memory.
- Wireline Networking — Muxponder, transponder and line card functions in 40G/100G systems where logic density and I/O count support packet processing and aggregation.
- Broadcast & Pro AV — Studio switches and video processing applications leveraging on‑chip RAM and high I/O for media routing and buffering.
- Computing & Storage — Server acceleration, flash caching and cloud compute offload tasks that benefit from programmable logic and embedded memory.
- Medical & Defense Systems — Diagnostic imaging, radar, and guidance/control applications that require industrial temperature operation and significant logic/memory resources.
Unique Advantages
- High programmable capacity: 220,000 logic elements enable complex algorithm implementation and system integration on a single device, reducing external component count.
- Substantial on‑chip RAM: Over 13.7 million bits of embedded RAM support buffering and local data manipulation to improve system throughput and reduce external memory dependence.
- Flexible I/O density: 288 I/O pins allow multiple peripheral interfaces and high‑bandwidth connections without immediate reliance on additional interface chips.
- Industrial temperature rating: −40 °C to 100 °C operation and industrial grade classification allow deployment in temperature‑demanding environments.
- Compact high‑pin package: 780‑BBGA (supplier: 780‑FBGA, FC (29×29)) delivers a high‑pin‑count solution in a compact form factor for space‑constrained boards.
- Configurable power operation: Narrow core supply window (870 mV–930 mV) supports targeted power/performance tuning in system power budgets.
Why Choose 10AX022E3F29I2LG?
The 10AX022E3F29I2LG Arria 10 GX FPGA positions itself for midrange designs that require a balance of programmable logic capacity, embedded memory, and robust I/O in an industrial temperature package. It is suitable for applications where power efficiency and integration help reduce BOM and support consolidated system designs.
Its combination of 220,000 logic elements, 13,752,320 RAM bits, and 288 I/O makes it a practical choice for communications, broadcast, compute acceleration, medical imaging and defense systems. The device benefits from the Arria 10 family focus on performance and power efficiency, backed by product documentation and device‑level resources.
Request a quote or submit an inquiry to receive pricing, availability and technical purchasing details for the 10AX022E3F29I2LG Arria 10 GX FPGA.

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