10AX022E4F27I3LG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 240 13752320 220000 672-BBGA, FCBGA |
|---|---|
| Quantity | 725 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FBGA, FC (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BBGA, FCBGA | Number of I/O | 240 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 80330 | Number of Logic Elements/Cells | 220000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 13752320 |
Overview of 10AX022E4F27I3LG – Arria 10 GX FPGA, 220000 logic elements, 672‑BBGA
The 10AX022E4F27I3LG is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) supplied in a 672‑ball FCBGA (27 × 27 mm) package for surface‑mount assembly. It is part of the Arria 10 family of 20 nm mid‑range FPGAs, offering a balance of logic density, embedded memory, and I/O resources for performance‑ and power‑sensitive applications.
Designed for industrial temperature operation, this device targets markets such as wireless, wireline, broadcast, computing and storage, and medical systems where programmable hardware, memory capacity, and flexible I/O are required.
Key Features
- Logic Capacity 220,000 logic elements (cells) provide substantial programmable fabric for custom logic, signal processing, and control functions.
- Embedded Memory 13,752,320 total RAM bits to support large on‑chip buffers, packet processing, and intermediate data storage without external memory.
- I/O Resources 240 I/O pins available for diverse peripheral and high‑speed interface requirements.
- Package & Mounting 672‑BBGA, FCBGA package (27 × 27 mm) optimized for surface‑mount PCB assembly and dense board designs.
- Voltage Supply Core supply operating range from 870 mV to 980 mV for compatibility with platform power domains.
- Industrial Temperature Range Rated for −40 °C to 100 °C operation for deployment in industrial and temperature‑challenging environments.
- Standards & Compliance RoHS compliant, aligning with lead‑free and environmental regulations.
Typical Applications
- Wireless Infrastructure Channel and switch cards in remote radio heads and mobile backhaul systems where programmable logic and on‑chip memory accelerate signal processing.
- Wireline Networking Line cards, muxponders and transponders for 40G/100G systems that require flexible protocol handling and packet buffering.
- Broadcast & Pro AV Studio switches, video transport and videoconferencing equipment that benefit from large on‑chip memory and configurable I/O.
- Computing & Storage Server acceleration tasks and flash cache controllers where FPGA logic and embedded RAM enable hardware offload and low‑latency processing.
- Medical Imaging Diagnostic scanners and imaging systems that require substantial logic and memory for data acquisition and real‑time processing.
Unique Advantages
- High Logic Density: 220,000 logic elements accommodate complex custom logic and algorithm implementation on a single device.
- Large On‑Chip Memory: 13.75 Mbits of embedded RAM reduce dependence on external memory and simplify board design for buffering and streaming data.
- Industrial‑Grade Operation: Specified −40 °C to 100 °C operation supports deployment in industrial environments with wider temperature swings.
- Flexible I/O Count: 240 I/O pins provide connectivity options for multiple interfaces and peripheral expansions.
- Compact FCBGA Packaging: 672‑BBGA (27 × 27 mm) package enables high‑density PCB layouts while remaining compatible with standard surface‑mount processes.
- Regulatory Compliance: RoHS compliance supports environmentally conscious designs and regulatory requirements.
Why Choose 10AX022E4F27I3LG?
The 10AX022E4F27I3LG Arria 10 GX FPGA combines substantial logic resources, significant embedded RAM, and a broad set of I/O in a compact FCBGA package rated for industrial temperatures. It is well suited for designers who need programmable hardware and on‑chip memory to implement custom accelerators, protocol engines, or real‑time processing functions in mid‑range systems.
With a documented Arria 10 family heritage on a 20 nm process and RoHS compliance, this device offers a pragmatic balance of performance, integration, and regulatory alignment for long‑term platform deployments across communications, broadcast, compute acceleration, and medical applications.
Please request a quote or contact sales to discuss availability, pricing, and ordering for the 10AX022E4F27I3LG.

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